MSC8156AG1000B vs MSC8156HAG1000B Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MSC8156AG1000B sa pamamagitan ng NXP Semiconductors at MSC8156HAG1000B sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MSC8156AG1000B MSC8156AG1000B - 6x 1GHz StarCore DSP SoC | NXP (Freescale)

MSC8156AG1000B - 6x 1GHz StarCore DSP SoC | NXP (Freescale)

MSC8156AG1000B ⚠ Huling Pagbili
NXP Semiconductors
MSC8156HAG1000B MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro MSC8156AG1000B MSC8156HAG1000B
Brand NXP Semiconductors NXP Semiconductors
Kategorya DSP DSP
Katayuan ng Lifecycle Huling Pagbili Aktibo
Product Type Multi-core DSP SoC Multi-core Digital Signal Processor (DSP)
DSP Core 6x StarCore SC3850 —
Clock Rate (per core) 1 GHz —
Aggregate Throughput ~ 6 GHz single-core equivalent —
Process Technology 45 nm CMOS
Hardware Accelerator MAPLE-B (turbo/Viterbi/encryption) MAPLE-B (turbo/Viterbi FEC)
Memory Controller DDR2 / DDR3 with ECC —
On-chip ROM 96 kB 96 KB
Serial RapidIO (SRIO) 2x lanes —
PCI Express 2x Gen1 controllers —
Ethernet 2x Gigabit Ethernet MACs (GbE) 2 x Gigabit Ethernet (SGMII/RGMII)
Peripheral Interfaces I2C, SPI, UART/USART, PCI, RGMII, SGMII SPI, I2C, UART, PCI
Queue Manager QF7 —
Packhaging 783-FCPBGA, 29x29 mm 783-ball FCBGA (FCP-BGA), 29 x 29 mm
Temperature na Operasyon 0C to +90C (commercial grade) 0C to +105C
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Tindminan RoHS [DATA_NEEDED: RoHS compliance] Compliant (per distributor datasheet listing)
Level ng MSL [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
DSP Cores — 6 x StarCore SC3850
Core Clock Frequency — 1 GHz per core
On-chip RAM — 576 KB (L1/L2 SRAM)
External Memory Interface — DDR2/DDR3 with ECC
High-speed Serial Fabric — 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2
Queuing Engine — Yes (QE for packet/traffic management)
Peak Reflow Temperature — 245C (JEDEC J-STD-020)
Terminal Finish — Tin Silver Copper (e1 per JESD-609)

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