MSC8157ETVT1000A vs MSC8144ETVT800A Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MSC8157ETVT1000A sa pamamagitan ng NXP Semiconductors at MSC8144ETVT800A sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MSC8157ETVT1000A MSC8157ETVT1000A - 1GHz Six-Core StarCore DSP, 783-FCBGA | NXP

MSC8157ETVT1000A - 1GHz Six-Core StarCore DSP, 783-FCBGA | NXP

MSC8157ETVT1000A Obsolete
NXP Semiconductors
MSC8144ETVT800A MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP

MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP

MSC8144ETVT800A Obsolete

Pagsanggunian na paghahambing

Parametro MSC8157ETVT1000A MSC8144ETVT800A
Brand NXP Semiconductors NXP Semiconductors
Kategorya DSP DSP
Katayuan ng Lifecycle Obsolete Obsolete
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Series StarCore —
Type SC3850 Six-Core Digital Signal Processor (DSP) —
Architecture StarCore SC3850, six independent cores —
Core Count 6 —
Clock Rate 1 GHz (1000 MHz) —
Width ng Data Bus 64-bit —
On-Chip RAM 6.375 MB 10.5 MB
On-Chip ROM 96 kB —
L1 Instruction Cache (per core) 32 KB —
L1 Data Cache (per core) 32 KB —
Voltage - Core 1.0 V —
Voltage - I/O 1.0 V / 1.5 V / 2.5 V (selectable) —
Interfaces Ethernet, I²C, SPI, UART/USART, PCI, RGMII, SGMII, Serial RapidIO Ethernet (UTOPIA), I2C, SPI, TDM, UART
Temperature na Operasyon -40°C to +105°C (Extended) -40C to +105C
Packhaging 783-FCBGA (Flip-Chip BGA), 29 mm × 29 mm 783-FCBGA (29x29 mm)
Bilang ng Pin 783 —
Uri ng Pagpapasok Surface Mount (FCBGA) Surface Mount
Lead Status Lead Free —
Process Technology CMOS —
Core Architecture — SC3400 StarCore (4-core)
Number of Cores — 4
Core Clock Rate — 800 MHz
Non-Volatile Memory — External (NOR/NAND boot ROM)
Core Voltage — 1.00 V
I/O Voltage — 3.30 V
Operating Temperature Grade — Extended Industrial
Terminal Form — Ball
Number of Terminals — 783
Package Code — BGA / FCBGA
Package Shape — Square
Technology — High-performance multi-core DSP, SIMD
Tindminan RoHS — [DATA_NEEDED: RoHS status not in web data]

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