XC3S200-4FT256C vs XC3S200-4FTG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC3S200-4FT256C sa pamamagitan ng AMD at XC3S200-4FTG256I sa pamamagitan ng Xilinx. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | XC3S200-4FT256C | XC3S200-4FTG256I |
|---|---|---|
| Brand | AMD | Xilinx |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | FPGA | — |
| FPGA Family | Spartan-3 | — |
| System Gates | 200000 | 200,000 |
| Logic Cells | 4320 | 4,320 |
| Configurable Logic Blocks | 480 | — |
| Maksimum na Taktiko ng Oras | 630 MHz | — |
| Nominal Core Supply Voltage | 1.2 V | — |
| Maximum Supply Voltage | 1.26 V | — |
| Process Technology | 90 nm | 90 nm |
| Packhaging | 256-LBGA | 256-ball FTBGA (FTG256), 17 x 17 mm |
| Number of Terminals | 256 | — |
| Terminal Form | Ball | Ball |
| Package Shape | Square | — |
| Temperature na Operasyon | 0°C to 85°C | -40C to +100C (Industrial) |
| Speed Grade | -4 | -4 |
| Temperature Grade | Commercial | — |
| Lead-Free Status | Lead free | — |
| Typical Application | Cost-sensitive high-performance programmable logic | — |
| I/O Standard Support | [DATA_NEEDED: supported I/O standards] | — |
| Core Current | [DATA_NEEDED: core current] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory] | — |
| Family | — | Spartan-3 |
| Slices | — | 2,160 |
| Block RAM | — | 216 Kbit (12 blocks x 18 Kbit) |
| Dedicated Multipliers | — | 4 (18x18) |
| DCM (Digital Clock Manager) | — | 4 |
| Maximum User I/O | — | 173 |
| Core Voltage | — | 1.2 V |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Peak Reflow Time | — | 30 s |
| Tindminan RoHS | — | Compliant (G suffix = lead-free) |