XC6SLX25-3FG484I vs XC6SLX25-2FG484C Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX25-3FG484I sa pamamagitan ng AMD at XC6SLX25-2FG484C sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

AMD
XC6SLX25-3FG484I XC6SLX25-3FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD

XC6SLX25-3FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD

XC6SLX25-3FG484I ✓ Nakahanda
AMD
XC6SLX25-2FG484C XC6SLX25-2FG484C - 24,051-Cell Spartan-6 LX FPGA | AMD

XC6SLX25-2FG484C - 24,051-Cell Spartan-6 LX FPGA | AMD

XC6SLX25-2FG484C ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro XC6SLX25-3FG484I XC6SLX25-2FG484C
Brand AMD AMD
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Type Field Programmable Gate Array (FPGA) Field-Programmable Gate Array (FPGA)
FPGA Family Spartan-6 LX Spartan-6 LX
Logic Cells 24,051 cells 24,051 cells
I/O Count 266 I/O —
Internal Frequency 500 MHz 500 MHz
Speed Grade -3 -2
Process Technology 45 nm CMOS —
Package Type 484-BBGA 484-pin FBGA
Package Pin Count 484 pins —
Package Body Size 15 mm x 15 mm —
Ball Pitch 0.80 mm —
Temperature na Operasyon 0°C to 85°C 0°C to 85°C
Lead-Free Status Lead-free package Lead-free
Terminal Form BGA balls —
Core Supply Voltage [DATA_NEEDED: core supply voltage] 1.2 V
Power Consumption [DATA_NEEDED: typical and maximum power consumption] —
Tindminan RoHS [DATA_NEEDED: RoHS status] RoHS compliant
REACH Status [DATA_NEEDED: REACH status] —
Number of I/O — 266 I/O
Technology — 45 nm CMOS
Number of Package Balls — 484 balls
Terminal Type — Ball
Package Shape — Square
Uri ng Pagpapasok — Surface mount

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