XC6SLX25-3FG484I vs XC6SLX25-2FG484C 比較

詳細並排比較 XC6SLX25-3FG484I 由 AMD 與 XC6SLX25-2FG484C 由 AMD. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

AMD
XC6SLX25-3FG484I XC6SLX25-3FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD

XC6SLX25-3FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD

XC6SLX25-3FG484I ✓ 啟用中
AMD
XC6SLX25-2FG484C XC6SLX25-2FG484C - 24,051-Cell Spartan-6 LX FPGA | AMD

XC6SLX25-2FG484C - 24,051-Cell Spartan-6 LX FPGA | AMD

XC6SLX25-2FG484C ✓ 啟用中

規格比較

參數 XC6SLX25-3FG484I XC6SLX25-2FG484C
品牌 AMD AMD
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Device Type Field Programmable Gate Array (FPGA) Field-Programmable Gate Array (FPGA)
FPGA Family Spartan-6 LX Spartan-6 LX
Logic Cells 24,051 cells 24,051 cells
I/O Count 266 I/O —
Internal Frequency 500 MHz 500 MHz
Speed Grade -3 -2
Process Technology 45 nm CMOS —
Package Type 484-BBGA 484-pin FBGA
Package Pin Count 484 pins —
Package Body Size 15 mm x 15 mm —
Ball Pitch 0.80 mm —
工作溫度 0°C to 85°C 0°C to 85°C
Lead-Free Status Lead-free package Lead-free
Terminal Form BGA balls —
Core Supply Voltage [DATA_NEEDED: core supply voltage] 1.2 V
Power Consumption [DATA_NEEDED: typical and maximum power consumption] —
RoHS 狀態 [DATA_NEEDED: RoHS status] RoHS compliant
REACH Status [DATA_NEEDED: REACH status] —
Number of I/O — 266 I/O
Technology — 45 nm CMOS
Number of Package Balls — 484 balls
Terminal Type — Ball
Package Shape — Square
安裝類型 — Surface mount

資料表與資源

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