XC6SLX75-3FGG676C vs XC6SLX100-2FGG676C Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX75-3FGG676C sa pamamagitan ng Xilinx at XC6SLX100-2FGG676C sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro XC6SLX75-3FGG676C XC6SLX100-2FGG676C
Brand Xilinx AMD
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Type FPGA (Field Programmable Gate Array) —
FPGA Family Spartan-6 LX —
Logic Cells 74,637 101,261
Configurable Logic Blocks (CLBs) 5,831 —
User I/O 408 —
DSP48A1 Slices 132 —
Block RAM 3,096 Kbit 3.8 Mb (4824 Kbits)
Internal Frequency 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table) —
Volte ng Pagbibigay 1.14 V to 1.26 V —
Process Technology 45 nm CMOS 45 nm CMOS
Speed Grade -3 (highest performance grade) -2
Temperature na Operasyon 0 C to 85 C (commercial) —
Package Type FBGA-676 (PBGA676) —
Package Dimensions 27 mm x 27 mm, 1.0 mm ball pitch —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Clock Management DCM and PLL present —
Lead-Free Yes —
RoHS [DATA_NEEDED: RoHS compliance statement for this exact orderable] —
REACH [DATA_NEEDED: REACH declaration for this exact orderable] —
Automotive Grade (AEC-Q100) Not qualified - commercial temperature grade —
Maximum Package Pin Count 676 balls —
Family — Spartan-6 LX
System Gates — 4,939,776
Slices — 15,822
DSP Slices — 180 DSP48A1
Maximum User I/O — 480
Maximum I/O Banks — 6
Temperature Grade — Commercial (0 C to +85 C)
Packhaging — FBGA-676 (FGG676) 27x27 mm
Ball Pitch — 0.8 mm
Core Voltage — 1.2 V
Tindminan RoHS — Compliant
Lead Free — Yes

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita