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Samsung Electronics

K9HCG08U1M - 64Gb 8Gx8 MLC NAND Flash | Samsung | SSD Storage

MPN: K9HCG08U1M ✓ Nakahanda
TSOP-48 (PDSO48) Package MLC NAND Flash Memory
MOQ: 1 |

K9HCG08U1M Ulas

The Samsung Electronics K9HCG08U1M is a 64Gbit (8G x 8 organization) MLC NAND Flash memory device with an 8-bit data interface, housed in a 48-pin TSOP (PDSO48) surface-mount package. It is part of Samsung's K9XXG08UXM NAND Flash family and is typically ordered as the K9HCG08U1M-PCB0 / K9HCG08U1M-PCB0T00 full ordering code.

NAND Flash is a non-volatile memory technology in which memory cells are connected in series, enabling very high density and low cost per bit compared to NOR Flash. Within the memory hierarchy, NAND Flash sits as mass-storage media below DRAM (which is volatile) and above storage interfaces such as SATA, PCIe, and eMMC controllers. MLC (Multi-Level Cell) NAND stores two bits per cell, doubling density relative to SLC at the cost of lower endurance and tighter timing margins, which is why MLC devices are almost always paired with a dedicated NAND controller implementing ECC (Error Correction Code), wear leveling, and bad-block management.

Key characteristics of the K9HCG08U1M include its 64Gb capacity, x8 I/O bus, asynchronous page-based read/program architecture with address/data/command multiplexing on the 8-bit bus, and extended industrial operating temperature of -40C to +105C (TA) as reported by distributors. Control signals follow the standard Samsung NAND interface: CLE, ALE, CE#, RE#, WE#, WP#, and a Ready/Busy (R/B#) output.

The device uses Samsung's advanced E-die process technology per datasheet references for the family. As raw MLC NAND, it does not contain an internal controller; system designers must provide block management. Typical applications include solid-state drives, USB flash drives, memory cards, set-top boxes, industrial recorders, and embedded mass storage where high capacity per device is required.

Design consideration: because MLC NAND has limited program/erase cycles, always implement ECC and wear leveling in the host controller and validate timing at both temperature extremes.

This page synthesizes distributor listings, drop-in same-family alternatives, and practical design guidance not consolidated in the manufacturer datasheet.

Mga alternatibo na pwedeng ilagay na K9HCG08U1M — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.

Variante sa Seri na ito

Katulad na modelo sa serye na katugma sa pagpasok K9HCG08U1M (parehas na form factor at footprint) — pagkakaiba sa Package, Interface, Organization, Memory Type, Cell Type.

Samsung Electronics
Interface: Asynchronous x8-bit I/O
Memory Type: NAND Flash
Ikabit sa K9HCG08U1M →
Samsung Electronics
Package: BGA
Interface: Asynchronous multiplexed NAND I/O
Organization: x8 I/O
Ikabit sa K9HCG08U1M →
Samsung Electronics
Package: 48-pin TSOP1 dual stacked, 12 mm x 20 mm
Interface: Asynchronous x8 multiplexed address/data
Organization: 16G x 8 bit
Ikabit sa K9HCG08U1M →
Samsung Electronics
Memory Type: NAND Flash
Ikabit sa K9HCG08U1M →
Samsung Electronics
Package: 48-pin TSOP-I
Interface: 8-bit parallel NAND (command/address/data multiplexed)
Organization: 1G x 8 bit
Ikabit sa K9HCG08U1M →
Samsung Electronics
Package: 48-pin TSOP
Cell Type: SLC (single-level cell) NAND
Ikabit sa K9HCG08U1M →

K9XXG08U0M

✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo
Samsung Electronics
📦 TSOP-48
NAND Flash · 8 G-bit · 1G x 8 bit · 256 M-bit (per K9K8G08U0M) · 2.7 V to 3.6 V (3.3V device) · 8-bit parallel NAND (command/address/data multiplexed) · 20 us · 48-pin TSOP-I

Magkontak para sa presyo

Tingnan ang Datasheet →

K9XXG08UXM

✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo
Samsung Electronics
📦 TSOP-48
2G x 8 Bit (2Gb) · (1G + 32M) bit x 8 bit · (2K + 64) bit x 8 bit · 2.7 V to 3.6 V · (2K + 64) Byte · (256K + 8K) Byte · Automatic Page Program, (2K + 64) Byte · Automatic Block Erase, (256K + 8K) Byte

Magkontak para sa presyo

Tingnan ang Datasheet →

K9HCG08U1E

✅ Drop-In
📦 TSOP-48
Same 16Gb E-die device per Alldatasheet cross-listing; suffix differs (commercial grade/quality code vs PCB0)

📋 Alternatibo na Reference (hindi sa katalogo)

K9LBG08U0M

✅ Drop-In
📦 TSOP-48
Same preliminary datasheet family member; lower stack configuration than 64Gb variant, verify density mapping and timing

📋 Alternatibo na Reference (hindi sa katalogo)

K9MDG08U5M

✅ Drop-In
Samsung Electronics
📦 TSOP-48
MLC Large Block NAND Flash · 16 Gbit (2 GB) · 16G x 8 bit · MLC (2 bits per cell) · 2.7 V · 3.6 V · Asynchronous x8 multiplexed address/data · 48-pin TSOP1 dual stacked, 12 mm x 20 mm

Magkontak para sa presyo

Tingnan ang Datasheet →

K9HCG08U1M Mga Pinakamataas na Rating at Electrical Characteristics

Memory Technology MLC NAND Flash
Total Capacity 64 Gbit
Organisasyon 8G x 8
Width ng Data Bus 8 bit
Uri ng Interface Asynchronous NAND (multiplexed address/data/command)
Packhaging TSOP-48 (PDSO48)
Uri ng Pagpapasok Surface Mount
Temperature na Operasyon -40C to +105C (TA)
Ready/Busy Output Yes (R/B#)
Die Technology Samsung E-die (per datasheet family)
Full Ordering Code K9HCG08U1M-PCB0 / K9HCG08U1M-PCB0T00

Gabay sa Pin Configuration ng K9HCG08U1M tsop-48 (pdso48)

Pin configuration para sa K9HCG08U1M (tsop-48 (pdso48) package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.

Pinout diagram ng tsop-48 (pdso48) package para sa K9HCG08U1M

Wala ng detalyadong pinout data na magagamit para sa K9HCG08U1M.

Sumangguni sa datasheet para sa buong pin configuration.

Tipikal na mga Gamit

K9HCG08U1M ay nararapat para sa 6 aplikasyons: Solid-State Drives (SSD), USB Flash Drives, Memory Cards (SD/microSD), Industrial Data Recorders, Set-Top Boxes and Smart TV Storage, Embedded Mass Storage Modules.

🖥️

Solid-State Drives (SSD)

The K9HCG08U1M's 64Gb MLC capacity per TSOP-48 device lets an SSD controller reach multi-terabyte arrays with a modest chip count. Its standard 8-bit asynchronous Samsung NAND interface is directly supported by mature SSD controller firmware, including bad-block tables and multi-plane scheduling where applicable. Placed behind an ECC-enabled controller, the MLC two-bits-per-cell density delivers low cost per gigabyte, while the extended -40C to +105C operating range reported by distributors supports industrial SSD variants. Trade-off: asynchronous TSOP-48 NAND is slower than modern Toggle/BGA NAND, so this part suits cost-driven and legacy SSD platforms rather than performance-tier drives.

🔧

USB Flash Drives

High-density MLC NAND such as the K9HCG08U1M is a classic fit for high-capacity USB flash drives, where cost per gigabyte dominates. A single 64Gb device in a thin 48-pin TSOP package fits inside compact drive housings and pairs naturally with USB 3.x NAND controller ICs that implement BCH ECC and wear leveling. Because the Samsung command set is an industry reference, controller bring-up is straightforward. The -40C to +105C distributor-specified temperature range tolerates automotive and outdoor use better than consumer-only NAND. Designers should budget for MLC endurance limits in write-intensive usage and enable power-fail protection via the WP# pin to prevent corruption on sudden unplug events.

📺

Memory Cards (SD/microSD)

SD and microSD card controllers based on the Samsung NAND command set can incorporate the K9HCG08U1M to deliver large capacities in a small card form factor. The TSOP-48 leaded package can be mounted or die-banked for card assembly, and the x8 multiplexed interface minimizes controller pin count. MLC density keeps bill-of-material cost low for consumer card SKUs, while the distributor-reported -40C to +105C range supports industrial card variants used in data loggers and cameras. Performance consideration: asynchronous page reads and program times cap sequential throughput below what modern UHS-class cards achieve, so this part targets standard-class or industrial-grade cards where reliability and cost outweigh speed.

🏭

Industrial Data Recorders

Industrial data loggers, black-box recorders, and SCADA historians require non-volatile storage that survives harsh environments. The K9HCG08U1M's reported -40C to +105C operating window and robust TSOP-48 surface-mount construction meet these ambient requirements. Its 64Gb MLC capacity stores years of high-rate sensor logs, and the standard Samsung 8-bit interface is supported by common industrial SoCs and FPGA controllers implementing BCH ECC. Use WP# control tied to the system power supervisor so writes are locked during brownouts, and implement wear leveling given MLC endurance limits. For vibration-prone installations, the leaded TSOP package with proper solder fillets provides proven mechanical reliability.

📺

Set-Top Boxes and Smart TV Storage

Set-top boxes and smart TVs use NAND Flash for channel databases, DVR buffering, firmware over-the-air updates, and app storage. The K9HCG08U1M provides 64Gb per chip, sufficient for these workloads without the cost of eMMC. Its asynchronous 8-bit interface connects directly to mainstream STB SoCs with NAND boot support, and the Ready/Busy handshake simplifies driver integration. Because broadcast recording involves frequent large sequential writes, MLC endurance is adequate with controller-level wear leveling. The distributor-reported -40C to +105C range covers enclosed, fanless AV equipment environments. For designs prioritizing boot speed, pair with a small NOR or SPI boot device alongside this NAND.

🧩

Embedded Mass Storage Modules

Custom embedded modules - medical devices, networking appliances, kiosks - frequently build raw NAND plus controller into a soldered-down storage module. The K9HCG08U1M is a strong candidate: 64Gb MLC per TSOP-48 chip enables tiered capacities by populating one to four devices, all sharing the same verified footprint. The widely documented Samsung NAND command interface shortens controller firmware development, and the extended -40C to +105C distributor-specified range suits unventilated enclosures. Layout guidance: keep CE#, RE#, WE# traces short and match lengths across chips in multi-device banks; dedicate solid ground plane under the bus. Sustained-write products must budget MLC endurance with over-provisioning.

Buod ng mga Inirekomendang Produkto

K9XXG08U0M Samsung Electronics Ginagamit sa: Solid-State Drives (SSD), Memory Cards (SD/microSD), Set-Top Boxes and Smart TV Storage K9XXG08UXM Samsung Electronics Ginagamit sa: Solid-State Drives (SSD), Memory Cards (SD/microSD), Embedded Mass Storage Modules K9LBG08U0M Lower-density family member for capacity-tiered drive SKUs Ginagamit sa: USB Flash Drives, Set-Top Boxes and Smart TV Storage K9MDG08U5M Samsung Electronics Ginagamit sa: USB Flash Drives, Industrial Data Recorders K9HCG08U1E Same-die sibling for dual-source procurement Ginagamit sa: Industrial Data Recorders, Embedded Mass Storage Modules
What is the K9HCG08U1M?
The K9HCG08U1M is a 64Gbit MLC NAND Flash memory from Samsung Electronics, organized as 8G x 8 with an 8-bit asynchronous multiplexed interface. It is supplied in a 48-pin TSOP (PDSO48) package and is typically ordered under the full code K9HCG08U1M-PCB0 or K9HCG08U1M-PCB0T00. As raw MLC NAND, it requires an external controller providing ECC, wear leveling, and bad-block management. Distributors list it with an extended operating temperature range of -40C to +105C.
What is the price of K9HCG08U1M?
XAIPART lists the K9HCG08U1M on an RFQ (request-for-quote) basis as of 2026-09-04, so the exact unit price is not published on this page. NAND Flash of this class is commodity-priced and fluctuates with the memory market. For volume pricing, request a quote from XAIPART or check commodity brokers such as Win Source, which lists the K9HCG08U1M-PCB0 with stock-check and RFQ functionality.
Where can I buy K9HCG08U1M online?
You can buy the K9HCG08U1M (usually as the K9HCG08U1M-PCB0 full code) from XAIPART via RFQ, and from distributors such as Win Source, Jotrin Electronics, and Lisleapex, all of which list this Samsung part with stock inquiry and datasheet download. Because 64Gb MLC NAND in TSOP-48 is a mature part frequently sourced on the broker market, always verify authenticity and date codes when ordering outside authorized channels.
Is K9HCG08U1M in stock and what is the lead time?
Stock status for the K9HCG08U1M changes frequently because it is a commodity NAND Flash traded on the open market. Multiple distributors, including Win Source and Jotrin, show the part as available via RFQ or stock check as of 2026-09-04. Lead time is typically short (days to a few weeks) when broker stock exists, but can extend if a factory order is required. Contact XAIPART for a current stock and lead-time confirmation before scheduling production.
What is the difference between K9HCG08U1M and K9MDG08U5M?
Both devices appear on the same Samsung K9XXG08UXM-family preliminary datasheet, but they target different densities/configurations within the 16Gb E-die stack family; the K9HCG08U1M is the 64Gb 8Gx8 MLC variant in TSOP-48. Exact density, page/block organization, and timing differences between the two should be confirmed against the shared Samsung datasheet before substitution, since stack configurations change read/program timings even when the pin interface is identical.
K9HCG08U1M vs K9LBG08U0M - which is better for mass storage?
For high-capacity mass storage, the K9HCG08U1M is preferable because it provides 64Gb (8G x 8) per device, doubling content per TSOP-48 footprint versus the lower-density K9LBG08U0M family member listed on the same preliminary datasheet. For designs where board space allows multiple smaller devices and controller interleaving, either works. Both share the standard Samsung 8-bit NAND interface; verify page/block organization and timing in the shared datasheet before finalizing the controller firmware.
When should I choose K9HCG08U1M over newer NAND?
Choose the K9HCG08U1M when you must maintain an existing TSOP-48 legacy NAND design, need a second source for an aging BOM, or require the extended -40C to +105C industrial temperature range that distributors report for this part. Newer NAND types (e.g., BGA-packagedToggle-mode or 3D V-NAND) offer higher speed and density but do not drop onto a TSOP-48 footprint. For legacy sustain and industrial retrofits, this part remains the practical choice; for new designs, evaluate current-generation NAND first.
Is the K9HCG08U1M suitable for industrial applications?
Yes. Distributors such as Veswin specify the K9HCG08U1M-PCB0T00 over an extended temperature range of -40C to +105C (TA), which covers most industrial ambient conditions. Its TSOP-48 surface-mount package is reflow-compatible and mechanically robust. For data integrity, pair it with a controller that implements strong ECC appropriate for MLC NAND, wear leveling, and power-fail protection (WP# deassertion control), since MLC endurance and retention are tighter than SLC alternatives.
What is the best drop-in replacement for K9HCG08U1M?
The closest drop-in replacements are same-family Samsung TSOP-48 devices: K9XXG08U0M and K9XXG08UXM (the family designators used on the shared preliminary datasheet), plus the same-die sibling K9HCG08U1E listed by Alldatasheet. These share the 48-pin TSOP package and standard Samsung 8-bit NAND command set, so the footprint and basic interface are identical. Always confirm density mapping, page/block size, and AC timing against the Samsung K9XXG08UXM preliminary datasheet before direct substitution in production.
Can K9HCG08U1M be replaced by a Micron or Toshiba equivalent?
A cross-brand equivalent is not confirmed by available web data for the K9HCG08U1M. While other vendors (Micron, Kioxia/Toshiba, SK Hynix) have shipped 64Gb-class x8 TSOP-48 MLC NAND with similar interfaces, command-set details, on-die ECC, and bad-block marking differ enough that a controller revalidation is mandatory - it is not a guaranteed pin-to-pin drop-in. XAIPART therefore lists only same-brand Samsung family alternatives; verify any cross-brand candidate against your controller's supported device list.
Where can I download the K9HCG08U1M datasheet PDF?
The K9HCG08U1M datasheet PDF is available from datasheet archives such as Datasheet4U (which hosts the Samsung preliminary datasheet covering the K9MDG08U5M, K9LBG08U0M, and K9HCG08U1M), Alldatasheet, and via distributor pages at Win Source, Jotrin, and Lisleapex. Prefer the Samsung Semiconductor official site when accessible. The datasheet covers the FLASH MEMORY K9XXG08UXM family and is marked preliminary, so confirm final specifications with Samsung before mass production.
What package does the K9HCG08U1M use and how is it mounted?
The K9HCG08U1M is packaged in a 48-pin TSOP (PDSO48) surface-mount package, as confirmed by Datasheets360 which lists it as 'Flash, 8GX8, PDSO48'. This thin small-outline package with 0.5 mm lead pitch mounts on a standard TSOP-48 land pattern and is compatible with reflow soldering. The 48-pin TSOP footprint is a legacy high-volume package, which simplifies second-sourcing within the Samsung K9 family but is not footprint-compatible with modern BGA NAND.
What are the key specifications of K9HCG08U1M that engineers should know?
Key facts: Samsung 64Gbit MLC NAND Flash, 8G x 8 organization, 8-bit asynchronous multiplexed address/data/command interface, 48-pin TSOP (PDSO48) package, extended operating temperature of -40C to +105C, R/B# Ready/Busy handshake, standard NAND control signals (CLE, ALE, CE#, RE#, WE#, WP#). It is raw MLC NAND without internal ECC, so the host controller must manage ECC, wear leveling, and bad blocks. Full ordering codes are K9HCG08U1M-PCB0 and K9HCG08U1M-PCB0T00.
Does the K9HCG08U1M need ECC and wear leveling?
Yes, both are mandatory. As raw MLC NAND storing two bits per cell, the K9HCG08U1M has significantly lower program/erase endurance and raw bit-error rates than SLC, so the host controller must implement ECC (typically BCH or LDPC class), dynamic and static wear leveling, and bad-block table management. The WP# pin should be controlled to lock the array during power transitions to prevent partial programming. These functions are the responsibility of the system controller, not the memory device.

Impormasyon ng Talumpati sa Engineering for K9HCG08U1M — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.

Paunawang Hanapin

Choose the K9HCG08U1M when you need maximum 64Gb MLC density in a legacy TSOP-48 footprint, an extended -40C to +105C industrial temperature range, or a sustain/second-source for an existing Samsung NAND BOM. Choose K9HCG08U1E if you want the same die with an alternate ordering suffix. Choose K9LBG08U0M or K9MDG08U5M when your controller supports those stack configurations or cost requires lower density. For brand-new performance-driven designs, this asynchronous TSOP-48 part is not the right choice: modern BGA Toggle-mode or 3D V-NAND offers far higher bandwidth and density, but it will not drop onto this PCB. Honest trade-off: mature TSOP-48 MLC NAND is cheap and controller-proven, but slower and endurance-limited versus current-generation NAND.

Ikabit sa Mga Alternatibo

Parametro Ito ang Producto K9XXG08U0M K9XXG08UXM K9HCG08U1E K9LBG08U0M K9MDG08U5M
Package TSOP-48 (PDSO48) TSOP-48 - same TSOP-48 - same TSOP-48 - same TSOP-48 - same TSOP-48 - same
Brand Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics
Memory Type MLC NAND Flash MLC NAND Flash MLC NAND Flash MLC NAND Flash (same E-die) MLC NAND Flash MLC NAND Flash
Data Bus Width 8 bit 8 bit 8 bit 8 bit 8 bit 8 bit
Automotive Grade No evidence in data No evidence in data No evidence in data No evidence in data No evidence in data No evidence in data

Pangunahing mga Pagkakaiba

  • Highest capacity per TSOP-48 footprint in its datasheet family (kumpara saK9LBG08U0M)
  • Extended industrial temperature range (kumpara saK9HCG08U1E)
  • Shared Samsung K9XXG08UXM family datasheet enables low-risk second sourcing (kumpara saK9MDG08U5M)

Talaan ng Disenyo

As raw MLC NAND, the K9HCG08U1M has no internal ECC. You must implement ECC in the controller sized for MLC raw bit-error rates, plus wear leveling and bad-block table management. Samsung NAND devices ship with initial bad blocks already marked in the first page/spare area of defective blocks - your firmware must scan and persist this map at first boot. Never erase block 0; Samsung reserves the first block for boot integrity, and erasing it can destroy boot-marker data.

Use the WP# pin to protect the array during power transitions: assert WP# (low) whenever VCC is outside the valid operating window. A supervisor IC driving WP# from the brownout detector prevents partial-page programming and corrupted MLC cells during unexpected power loss, a leading cause of field failures in NAND systems. Additionally, decouple VCC with at least 0.1uF ceramic per device plus bulk capacitance, since program operations draw transient current pulses on the supply.

Route the 8-bit I/O bus and control signals (CLE, ALE, CE#, RE#, WE#) as short as practical, under 50 mm where possible, and keep them away from clock or RF lines. In multi-chip banks, match control-signal trace lengths across devices so shared CE#/RE#/WE# arrive within skew budget. Provide a continuous ground plane under the bus and series-terminate long RE# lines if read-cycle ringing is observed on the scope. The TSOP-48 land pattern should follow standard 0.5 mm pitch footprint rules.

Impormasyon ng Pagsunod sa Kautusan

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Walang Lead
Unknown
Walang Halogen
Unknown
Mga Conflict Mineral
Unknown

No explicit compliance statements were found in the provided web data. Samsung commodity NAND of this era is typically RoHS-compliant, but this must be confirmed from the official Samsung product page or full datasheet before specification.

Data napatotohanan sa: 2026-09-04 — impormasyon na pinatunayan at pinapatakbo ng pangkat ng engineering ng XAIPART's component engineering team

Kaugnay na Hanapin

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Mga kaugnay na Mga Komponente at mga Tuntunin

Samsung Electronics K9HCG08U1M K9HCG08U1M-PCB0 K9HCG08U1M-PCB0T00 K9XXG08U0M K9XXG08UXM K9LBG08U0M K9MDG08U5M MLC NAND Flash NAND Flash non-volatile memory TSOP-48 PDSO48 8G x 8 E-die ECC wear leveling bad-block management RoHS solid-state drive USB flash drive memory card Ready/Busy (R/B#)
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