EP20K600CF672C8N vs EP20K600CF672C6 Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP20K600CF672C8N tarafından Intel ve EP20K600CF672C6 tarafından AlteraAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP20K600CF672C8N | EP20K600CF672C6 |
|---|---|---|
| Marka | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Obsolete |
| Device Type | SPLD | — |
| Product Type | FPGA / programmable logic device | — |
| Family | APEX 20KC | APEX 20KC |
| Nominal Gate Capacity | 600K gates | — |
| Logic Elements or Cells | 24,320 | — |
| Macros | 2,432 | — |
| User I/O Count | 508 | — |
| Package Terminals | 652 pins | — |
| Paket | BGA-652, 45 x 45 mm, 1.27 mm pitch | 672-ball FineLine BGA (CF672) |
| Package Description | 672-pin FC-FBGA | — |
| Besleme Gerilimi | 1.8 V | — |
| Listed Frequency | 301.21 MHz | — |
| Propagation Delay | 1.48 ns | — |
| Fabrication Process | 0.15 µm | — |
| İşletim Sıcaklığı | 0°C to 85°C | 0 °C to +85 °C (commercial) |
| Interconnect Metal | All-layer copper metal | — |
| I/O Configuration | 508 user I/O | — |
| Montaj Türü | Surface mount | — |
| RoHS Durumu | unknown | Non-RoHS (legacy process) |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration memory and programming method] | SRAM-based, JTAG, EPC16/EPC2 |
| Core Current | [DATA_NEEDED: core supply current] | — |
| I/O Bank Voltage | [DATA_NEEDED: supported I/O voltage range] | — |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Termal Direnç | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| Typical Gate Count | — | 600,000 gates |
| Logic Elements (LEs) | — | 24,320 |
| Embedded System Blocks (ESBs) | — | 160 (each 2,048 bits) |
| Maximum Embedded RAM | — | 311,296 bits (311 kbit) |
| Maximum User I/O Pins | — | 508 |
| Package Body Size | — | 27 mm × 27 mm |
| Speed Grade | — | -6 (C6) |
| Core Voltage | — | 1.8 V |
| I/O Standards Supported | — | LVCMOS, LVTTL, HSTL, SSTL, GTL+ |
| Embedded PLLs | — | 4 |
| Process Technology | — | 0.18 µm CMOS, 6 metal layers |