EPM5192LI-1 vs EPM5192JI Karşılaştırma
Ayrıntılı yan yana karşılaştırma EPM5192LI-1 tarafından Altera ve EPM5192JI tarafından AlteraAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EPM5192LI-1 | EPM5192JI |
|---|---|---|
| Marka | Altera | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | NRND | Obsolete |
| Family | MAX 5000 | MAX 5000 |
| Device Type | EPLD (UV-Erasable/OTP Complex PLD) | EPLD (UV-erasable CMOS Programmable Logic Device) |
| Usable Gates | 3,750 | — |
| Macrocells | 192 | 192 |
| Maximum Toggle Frequency | 40 MHz | — |
| Besleme Gerilimi | 5 V | 4.75 V to 5.25 V (nominal 5 V) |
| Propagation Delay (tPD) | [DATA_NEEDED: tPD in ns at -1 grade] | — |
| User I/O Pins | [DATA_NEEDED: user I/O count for JLCC variant] | 64 |
| Package Type | JLCC (windowed, ceramic, UV-erasable) | — |
| Process Technology | CMOS EPROM, UV-erasable | — |
| Speed Grade | -1 | — |
| İşletim Sıcaklığı | [DATA_NEEDED: industrial vs military range] | -40 C to +125 C (industrial, I-suffix) |
| Pin Sayısı | [DATA_NEEDED: pin count of LI package] | — |
| Montaj Türü | Surface Mount (JLCC with J-leads) | Surface Mount (PLCC socket recommended for UV erasure) |
| MSL Seviyesi | [DATA_NEEDED: MSL level] | — |
| RoHS Durumu | [DATA_NEEDED: RoHS status of ceramic LI variant] | [DATA_NEEDED: RoHS status - pre-2010 part, likely non-compliant] |
| Lead Free | [DATA_NEEDED: lead-free] | — |
| Programmable Interconnect | Programmable Interconnect Array (PIA) | — |
| Architecture | EEPROM/EPROM-based, non-volatile, instant-on | — |
| Logic Array Blocks (LABs) | — | 12 |
| Dedicated Inputs | — | 7 |
| Propagation Delay (tpd) | — | 55 ns |
| Technology | — | CMOS EPROM, UV-erasable |
| Paket | — | 84-pin PLCC (windowed, J-suffix ceramic) |
| Programming Method | — | Altera MAX 5000 programming algorithm (device programmer) |
| Erasure Method | — | UV exposure through windowed package |