MC9S12XDT256CPV vs MC9S12DG256CCPV Karşılaştırma
Ayrıntılı yan yana karşılaştırma MC9S12XDT256CPV tarafından NXP Semiconductors ve MC9S12DG256CCPV tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MC9S12XDT256CPV - 16-bit HCS12X MCU, 256KB Flash, 112-LQFP | NXP
MC9S12XDT256CPV NrndNXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV NrndÖzellik Karşılaştırması
| Parametre | MC9S12XDT256CPV | MC9S12DG256CCPV |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | NRND | NRND |
| Core | HCS12X (16-bit CISC with XGATE co-processor) | HCS12 (16-bit CISC) |
| Family | S12XD | — |
| Program Memory | 256 KB Flash | — |
| EEPROM | 4 KB | — |
| RAM | 12 KB | — |
| CPU Bus Frequency | 25 MHz / 40 MHz (max) | — |
| XGATE Co-processor | 80 MHz, RISC-style peripheral engine | — |
| Besleme Gerilimi | 2.5 V / 5 V (dual-range) | — |
| Paket | 112-LQFP (20 x 20 mm, 0.65 mm pitch) | — |
| Pin Sayısı | 112 | — |
| Temperature Grade | Industrial (-40C to +85C) | — |
| Montaj Türü | Surface Mount | Surface Mount |
| CAN Modules | Up to 2 x CAN 2.0A/B (msCAN) | — |
| SCI / SPI / I2C | 2 x SCI, 2 x SPI, 1 x I2C | — |
| ADC | 8-channel, 10-bit ATD | 8-channel, 10-bit |
| PWM Channels | 4 x 8/16-bit PWM | 8 channels |
| Timers | ECT (Enhanced Capture Timer), PIT, RTI | Enhanced Capture Timer (ECT) + watchdog |
| Debug Interface | BDM (Background Debug Mode) | — |
| RoHS Durumu | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| RAM Size | — | 12 KB |
| EEPROM Size | — | 4 KB |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| İşletim Sıcaklığı Aralığı | — | -40 °C to +85 °C (industrial) |
| Paket / Kas | — | 112-LQFP (20 x 20 mm) |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| On-chip Debug | — | Background Debug Mode (BDM) |
| MSL Seviyesi | — | 3 (168 hours, JEDEC J-STD-020) |