MC9S12XDT256CPV vs MC9S12DG256CCPV Perbandingan
Perbandingan bersamaan detil MC9S12XDT256CPV dari NXP Semiconductors dan MC9S12DG256CCPV dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S12XDT256CPV - 16-bit HCS12X MCU, 256KB Flash, 112-LQFP | NXP
MC9S12XDT256CPV NrndNXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV NrndPerbandingan Spesifikasi
| Parameter Umum | MC9S12XDT256CPV | MC9S12DG256CCPV |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Core | HCS12X (16-bit CISC with XGATE co-processor) | HCS12 (16-bit CISC) |
| Family | S12XD | — |
| Program Memory | 256 KB Flash | — |
| EEPROM | 4 KB | — |
| RAM | 12 KB | — |
| CPU Bus Frequency | 25 MHz / 40 MHz (max) | — |
| XGATE Co-processor | 80 MHz, RISC-style peripheral engine | — |
| Tegangan Pemuat | 2.5 V / 5 V (dual-range) | — |
| Paket | 112-LQFP (20 x 20 mm, 0.65 mm pitch) | — |
| Jumlah Pin | 112 | — |
| Temperature Grade | Industrial (-40C to +85C) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| CAN Modules | Up to 2 x CAN 2.0A/B (msCAN) | — |
| SCI / SPI / I2C | 2 x SCI, 2 x SPI, 1 x I2C | — |
| ADC | 8-channel, 10-bit ATD | 8-channel, 10-bit |
| PWM Channels | 4 x 8/16-bit PWM | 8 channels |
| Timers | ECT (Enhanced Capture Timer), PIT, RTI | Enhanced Capture Timer (ECT) + watchdog |
| Debug Interface | BDM (Background Debug Mode) | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| RAM Size | — | 12 KB |
| EEPROM Size | — | 4 KB |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| Rentang Suhu Kerja | — | -40 °C to +85 °C (industrial) |
| Paket / Case | — | 112-LQFP (20 x 20 mm) |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| On-chip Debug | — | Background Debug Mode (BDM) |
| Level MSL | — | 3 (168 hours, JEDEC J-STD-020) |