MPC8255ACZUMHBB vs MPC8250ACZUMHBC Karşılaştırma
Ayrıntılı yan yana karşılaştırma MPC8255ACZUMHBB tarafından NXP Semiconductors ve MPC8250ACZUMHBC tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
MPC8255ACZUMHBB ObsoleteNXP Semiconductors
MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP
MPC8250ACZUMHBC ⚠ Son Satın AlmaÖzellik Karşılaştırması
| Parametre | MPC8255ACZUMHBB | MPC8250ACZUMHBC |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Obsolete | Son Alış Zamanı |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale/Motorola) |
| Series | PowerQUICC II HIP4 | MPC82xx (PowerQUICC II) |
| Core Architecture | PowerPC G2 | — |
| Veri Bus Genişliği | 64-Bit | 32-bit internal / 64-bit external |
| Core Supply Voltage | 1.8 V | — |
| Maximum Clock Speed | 266 MHz | — |
| Number of Cores | 1 | 1 Core, 32-Bit |
| Instruction Set | 32-Bit RISC | — |
| Core | MPC82xx | — |
| Package Type | T-BGA | — |
| Pin/Ball Count | 480 | — |
| Package Size | 37.50 x 37.50 mm | — |
| Package Height | 1.55 mm | — |
| Ball Pitch | 1.27 mm | — |
| İşletim Sıcaklığı | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Process Technology | 0.25 micron (HiP4) silicon revision | 0.25 micron |
| Integrated CPM | Yes (dual communications processor modules) | — |
| Ethernet MACs | Dual 10/100 MAC | — |
| Montaj Türü | Surface Mount | Surface Mount (BGA) |
| RoHS Durumu | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Core Processor | — | PowerPC G2 |
| Co-Processors / DSP | — | Communications; RISC CPM |
| Speed | — | 266 MHz |
| Supply Voltage (I/O) | — | 3.3 V |
| Core Voltage | — | 1.8 V |
| Paket / Kas | — | 480-TBGA (37.5 x 37.5 mm) |
| Pin Sayısı | — | 480 |
| Architecture | — | RISC |
| RAM Controllers | — | DRAM, SDRAM |
| Graphics Acceleration | — | No |
| Yaşam Döngüsü Durumu | — | Last Time Buy (NXP EOL announced) |
| Lead Free | — | Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) |