10AX115N2F45E2SG - Arria 10 GX FPGA, 1.15M LE, 1932-BGA | Intel
MPN: 10AX115N2F45E2SG ✓ فعال10AX115N2F45E2SG جائزہ
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic function is defined after manufacturing by the end user via a configuration bitstream. FPGAs occupy a distinct position in the programmable logic hierarchy, sitting between fixed-function Application-Specific Integrated Circuits (ASICs) and software-programmable processors, and are categorized by logic density, embedded transceiver count, and DSP/memory resources. The Arria 10 GX family specifically targets mid-range applications that need integrated transceivers (up to 17.4 Gbps) and floating-point DSP blocks.
Key features of the 10AX115N2F45E2SG include approximately 1,150,000 logic elements, 68,857,856 bits (about 8,029 Kbits per M20K block) of embedded SRAM, 1,518 18x19 multipliers, integrated PCI Express Gen3 hard IP blocks, and up to 17.4 Gbps transceivers. The part suffix encodes speed grade 2 (slower timing, lower power), commercial temperature grade (0C to +100C junction), and lead-free RoHS-compliant assembly. The F45 package variant denotes the 45mm body size with the F1932 flip-chip BGA ball pattern.
Architecturally, the Arria 10 GX combines a sea-of-lookup-tables fabric with column-based M20K SRAM blocks, variable-precision DSP blocks supporting IEEE 754 single-precision floating point, and a hardened memory controller plus PCIe Gen3 controller. The 20nm Tri-Gate process reduces static leakage by roughly 50% compared to the prior 28nm planar Arria V generation, while the partial reconfiguration region controller allows runtime re-loading of selected fabric tiles without disrupting the rest of the device.
Typical applications include 4K UHD video broadcast encoders, software-defined radio (SDR) baseband processing, 100 Gigabit Ethernet bridge/muxponder line cards, military radar signal processing, medical imaging accelerators, and ASIC prototyping. Designers choose this part when they need transceiver-rich mid-range density without paying for the full Stratix 10 fabric.
When designing with this part, allocate power budget carefully: at full fabric utilization the device can exceed 30W, and the FCBGA requires a heatsink plus minimum 8-layer PCB with continuous via arrays under the package for thermal dissipation. Quartus Prime Pro Edition is required for compilation.
کے لیے ڈراپ اِن متبادل 10AX115N2F45E2SG — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں 10AX115N2F45E2SG (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Transceivers, Mounting Type, Process Technology, Embedded Memory.
10AX115N2F45E2LG
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →10AX115N2F45E1SG
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →10AX115N2F40I2SG
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →10AX115H2F34E2LG
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →10AX090N2F45E2SG
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →10AX115N2F45E2SG زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Series | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| Embedded Memory Type | M20K SRAM blocks |
| DSP Blocks (18x19 Multipliers) | 1,518 |
| Maximum User I/Os | 768 |
| Maximum Transceiver Data Rate | 17.4 Gbps |
| Hard Processor Subsystem | Dual-core ARM Cortex-A9 (optional HPS configuration) |
| PCI Express Hard IP | Gen3 x8 (hardened) |
| Process Technology | Intel 20nm Tri-Gate (FinFET) |
| پیکیج | 1932-ball FCBGA, 45mm body (F45) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| آپریٹنگ جنکشن درجہ حرارت | 0C to +100C (commercial grade) |
| Speed Grade | 2 |
| RoHS اسٹیٹس | Compliant |
| Configuration Memory | Internal, supports serial and parallel configuration |
10AX115N2F45E2SG 1932-ball fcbga, 45mm body (f45) پن کنفیگریشن گائیڈ
10AX115N2F45E2SG (1932-ball fcbga, 45mm body (f45) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں 10AX115N2F45E2SG.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
10AX115N2F45E2SG کے لیے موزوں ہے 6 ایپلیکیشنs: 4K UHD Broadcast Video Encoder, Software Defined Radio (SDR) Baseband, 100G Ethernet Bridge / Muxponder, Military Radar Signal Processing, Medical Imaging Accelerator, ASIC Prototyping Platform.
4K UHD Broadcast Video Encoder
The 10AX115N2F45E2SG's 1.15M logic elements and 1,518 DSP multipliers make it well-suited for real-time 4K UHD (3840x2160p60) H.264/HEVC broadcast encoders. The hardened memory controller and PCI Express Gen3 IP block allow direct attachment to host video capture cards at full line rate, while the -2 speed grade keeps total board power under 30W in typical encoder firmware. With 768 user I/Os the device can drive multiple 12G-SDI outputs natively, replacing discrete ASSP encoder chips. Designers pair it with external H.265 codec IP and DDR4 memory controllers to hit broadcast-quality bitrate targets under tight latency budgets.
تجویز کردہ
Software Defined Radio (SDR) Baseband
For wideband SDR baseband processing in military and commercial wireless infrastructure, the 10AX115N2F45E2SG offers up to 17.4 Gbps transceivers that can directly digitize IF signals from a wideband ADC and run FFT-based channelization in firmware. The 68,857,856 bits of embedded M20K SRAM provide ample buffering for 4096-point FFT windows, while the floating-point DSP blocks accelerate polyphase filterbanks. With the optional hardened ARM Cortex-A9 subsystem, designers can run Linux for waveform management alongside FPGA fabric DSP. The -2 speed grade is favored here because DSP pipelines tolerate slightly lower Fmax in exchange for thermal headroom in sealed outdoor radio units.
تجویز کردہ
100G Ethernet Bridge / Muxponder
The 10AX115N2F45E2SG is widely deployed in OTN (Optical Transport Network) line cards as a 100G muxponder or bridge element. Four transceivers at 25.78 Gbps implement the CAUI-4 electrical interface to optical modules, while the fabric runs PCS, FEC (KP4 RS), and MAC layers. Designers use the hardened PCIe Gen3 IP to connect to the backplane CPU blade for management. Compared to an ASSP Ethernet switch, the Arria 10 variant offers custom packet processing at line rate, making it ideal for security appliances that must inspect encrypted flows. The F45 FCBGA package provides 768 I/Os, sufficient for multiple QSFP28 cages plus a CPU interface.
تجویز کردہ
Military Radar Signal Processing
Phased-array radar front-ends in defense electronics leverage the 10AX115N2F45E2SG for pulse compression, Doppler filtering, and constant false alarm rate (CFAR) detection across thousands of range bins. The DSP blocks accelerate FIR filters for matched pulse compression, while the embedded M20K SRAM holds 2D data matrices for synthetic aperture radar (SAR) imaging modes. The Arria 10's radiation-tolerant silicon-on-insulator variant (10AT115) is preferred for space, but the commercial 10AX115 is widely used in ground-based and naval radar cabinets. With up to 768 I/Os the FPGA can interface to multiple A/D converter banks and fibre-channel recorders simultaneously.
تجویز کردہ
Medical Imaging Accelerator
In CT and MRI reconstruction pipelines, the 10AX115N2F45E2SG accelerates filtered back-projection (FBP) and iterative reconstruction algorithms, offloading the host workstation CPU. The DSP blocks perform floating-point convolutions and matrix rotations, while the embedded SRAM buffers 512x512x32 voxel volumes. Hospitals benefit from reduced scan reconstruction times, enabling real-time 3D visualization during procedures. The lead-free RoHS-compliant assembly meets medical device material restrictions, and the 100C junction temperature rating suits the airflow conditions of imaging-cart chassis. Compared to GPU-based solutions, the FPGA delivers deterministic latency critical for image-guided surgery.
تجویز کردہ
ASIC Prototyping Platform
Semiconductor design houses use the 10AX115N2F45E2SG as a building block in multi-FPGA ASIC prototyping, where it emulates the target ASIC's logic at near-ASIC speed with full visibility into internal nodes. Quartus Prime Pro supports Logic Lock regions, partial reconfiguration, and incremental compile flows that let design teams iterate on RTL quickly. With 1.15M LEs per device, a 5M-gate ASIC typically maps to four 10AX115 FPGAs with a TDM-based pin-multiplexing debug fabric. The 17.4 Gbps transceivers emulate high-speed SERDES interfaces that are otherwise expensive to validate in software simulation, accelerating pre-silicon bring-up by months.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا 10AX115N2F45E2SG — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | 10AX115N2F45E2LG | 10AX115N2F45E1SG | 10AX115N2F40I2SG | 10AX090N2F45E2SG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F40) | 1932-ball FCBGA (F45) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Embedded Memory Bits | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 53,248,000 |
| Speed Grade | -2 | -2 | -1 (fastest) | -2 | -2 |
| Temperature Grade | Commercial (0C to +100C junction) | Commercial (0C to +100C) | Commercial (0C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +100C) |
| Process Technology | 20nm Tri-Gate (FinFET) | 20nm Tri-Gate | 20nm Tri-Gate | 20nm Tri-Gate | 20nm Tri-Gate |
| RoHS Compliance | Yes (lead-free) | Yes | Yes | Yes | Yes |
اہم امتیازی خصوصیات
- Higher logic density within the same F45 FCBGA footprint (بمقابلہ10AX090N2F45E2SG)
- Lower power via -2 speed grade (بمقابلہ10AX115N2F45E1SG)
- Commercial temperature grade optimized for indoor deployment (بمقابلہ10AX115N2F40I2SG)
ڈیزائن نوٹس
Estimated: The 10AX115N2F45E2SG dissipates approximately 30-35W at full fabric utilization and active transceivers. The F45 FCBGA's exposed die thermal pad requires a heatsink with thermal interface material rated at <0.1 C-in2/W, plus a minimum 8-layer PCB with continuous via-in-pad arrays under the package. Without 1 oz copper pours in inner layers, junction temperature can exceed 100C and trigger thermal throttling. Plan for 400 LFM forced-air cooling in rack-mounted applications.
The 1932-ball FCBGA F45 package demands a high-density PCB stack-up: minimum 8 layers with 1 oz copper, 0.4mm pitch microvia-in-pad, and depth-controlled back-drilling on high-speed transceiver channels to suppress stub resonance. Reference Intel's AN522 and the Arria 10 PCB layout user guide for via pattern geometry. The 17.4 Gbps transceivers need 100-ohm differential pair routing with no more than two vias and continuous reference plane stitching every 200 mil.
Use Intel's Early Power Estimator (EPE) and PowerPlay Power Analyzer to model VCC, VCCP, and VCCERAM rail currents before committing to a regulator design. The -2 speed grade typically draws 15-20% less core current than -3. Decoupling requires 0402 100nF X7R capacitors within 2mm of every VCC pin plus bulk 22uF tantalum or polymer caps on each rail. Sequence core voltage before transceiver supplies to avoid in-rush latch-up.
Common pitfalls: (1) Using commercial-grade part in outdoor enclosure - select industrial 10AX115N2F40I2SG instead. (2) Omitting MSL3 bake-out before reflow can cause die-package delamination. (3) Configuration bitstream loaded from incompatible flash causes soft CRC errors - always use supported EPCQ-L or EPCQ-A devices. (4) Driving JTAG signals without series resistors causes reflection on the TCK line at 30 MHz.
تعمیل کی معلومات
Lead-free RoHS compliant per Intel Altera product ordering information. Halogen-free status not explicitly confirmed in provided data - set to unknown. AEC-Q100 not applicable for FPGA. Conflict-minerals compliance per Intel's standard disclosure.
