10M04SCM153I7G - MAX 10 FPGA 4K LE, 153-BGA, Industrial | Intel
MPN: 10M04SCM153I7G ✓ فعال10M04SCM153I7G جائزہ
What is a MAX 10 FPGA? A Field-Programmable Gate Array is a reconfigurable digital logic device consisting of programmable logic elements, embedded memory blocks, DSP slices, and a programmable interconnect fabric. MAX 10 (within Intel's FPGA taxonomy: FPGA -> non-volatile FPGA -> low-power CPLD/FPGA family) uniquely integrates instant-on flash configuration with analog and DSP blocks, bridging the gap between traditional CPLDs and higher-density Cyclone / Stratix families. The 10M04 is the entry-level density tier of the MAX 10 lineup.
Key features include up to 193,536 bits of embedded user flash (added to the user-accessible SRAM budget), a 12-bit 1 Msps ADC with up to 17 analog inputs, hard memory controllers (DDR3/DDR3L/LPDDR2), and up to 45 multipliers (18x18). The 153-ball MBGA package is just 8x8 mm with a 0.5 mm ball pitch, supporting densities above 30,000 logic cells when migrating within the MAX 10 family.
Architecturally, MAX 10 uses logic array blocks (LABs) of 16 logic elements, each LE containing a 4-input LUT, register, and carry chain. The embedded flash reduces BOM cost by eliminating external boot PROM. The industrial -40C to +100C operating range suits factory, automotive aftermarket, and outdoor industrial deployments.
Typical applications include industrial I/O expansion and glue logic, motor control, sensor aggregation in IoT edge nodes, video bridging, and human-machine interface (HMI) controllers. Designers also use 10M04 for protocol bridging (UART/SPI/I2C to Ethernet) and as a low-cost replacement for CPLD-based state machines requiring soft-core processors.
When designing, account for bank-dependent I/O voltage (each bank is independently 1.2/1.5/1.8/2.5/3.0/3.3 V) and use the Quartus Prime Lite toolchain (free) for synthesis, place-and-route, and programming file generation. A JTAG or on-chip flash programmer is required for in-system configuration.
This page synthesizes distributor pricing, drop-in package-compatible MAX 10 variants, and design notes not found in the standalone datasheet, enabling faster component selection for low-density FPGA designs.
کے لیے ڈراپ اِن متبادل 10M04SCM153I7G — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں 10M04SCM153I7G (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Speed Grade, Configuration Memory, Temperature Grade, Family.
10M04SAM153I7G
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →10M04SCM153C8G
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →10M04SAM153C8G
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →10M04SCE144I7G
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →10M04SCM153I7G زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Embedded Memory (bits) | 193,536 |
| Maximum User I/O | 112 |
| پیکیج | 153-ball MBGA (Micro FineLine BGA), 8x8 mm, 0.5 mm pitch |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| I/O Voltage Standards | LVCMOS 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Embedded Memory Type | M9K (9 Kbit blocks) |
| User Flash (CFM/UFM) | Available (configurable flash + user flash) |
| DSP Blocks (18x18 Multipliers) | 16 |
| PLLs | 2 |
| On-chip ADC | 12-bit, 1 Msps, up to 17 analog inputs |
| Speed Grade | SC (commercial/industrial slow) |
| Temperature Grade | Industrial (I), -40C to +100C |
| Configuration Method | On-chip flash + JTAG |
| Lead-free / RoHS | Yes (7G suffix) |
| ماؤنٹنگ ٹائپ | Surface Mount (BGA) |
10M04SCM153I7G پن کنفیگریشن
| پن A1 | IO — User I/O (bank-specific voltage) |
| پن A2 | IO — User I/O (bank-specific voltage) |
| پن A3 | IO — User I/O (bank-specific voltage) |
| پن A4 | VCCIO — I/O bank supply voltage |
| پن A5 | VCCIO — I/O bank supply voltage |
| پن A6 | IO — User I/O (bank-specific voltage) |
| پن A7 | IO — User I/O (bank-specific voltage) |
| پن A8 | IO — User I/O (bank-specific voltage) |
| پن A9 | IO — User I/O (bank-specific voltage) |
| پن A10 | IO — User I/O (bank-specific voltage) |
| پن A11 | IO — User I/O (bank-specific voltage) |
| پن B1 | IO — User I/O (bank-specific voltage) |
| پن B2 | GND — Ground |
| پن B3 | GND — Ground |
| پن B4 | VCC — Core voltage 1.2 V |
| پن B5 | VCC — Core voltage 1.2 V |
| پن B6 | GND — Ground |
| پن B7 | GND — Ground |
| پن B8 | VCCIO — I/O bank supply voltage |
| پن B9 | VCCIO — I/O bank supply voltage |
| پن B10 | GND — Ground |
| پن B11 | IO — User I/O (bank-specific voltage) |
| پن C1 | IO — User I/O (bank-specific voltage) |
| پن C2 | IO — User I/O (bank-specific voltage) |
| پن C3 | GND — Ground |
| پن C4 | VCCIO — I/O bank supply voltage |
| پن C5 | GND — Ground |
| پن C6 | VCCIO — I/O bank supply voltage |
| پن C7 | VCC — Core voltage 1.2 V |
| پن C8 | GND — Ground |
| پن C9 | VCC — Core voltage 1.2 V |
| پن C10 | IO — User I/O (bank-specific voltage) |
| پن C11 | IO — User I/O (bank-specific voltage) |
| پن D1 | IO — User I/O (bank-specific voltage) |
| پن D2 | GND — Ground |
| پن D3 | VCCIO — I/O bank supply voltage |
| پن D4 | GND — Ground |
| پن D5 | VCCIO — I/O bank supply voltage |
| پن D6 | VCC — Core voltage 1.2 V |
| پن D7 | GND — Ground |
| پن D8 | VCC — Core voltage 1.2 V |
| پن D9 | VCCIO — I/O bank supply voltage |
| پن D10 | GND — Ground |
| پن D11 | IO — User I/O (bank-specific voltage) |
| پن E1 | IO — User I/O (bank-specific voltage) |
| پن E2 | VCCIO — I/O bank supply voltage |
| پن E3 | GND — Ground |
| پن E4 | VCC — Core voltage 1.2 V |
| پن E5 | VCC — Core voltage 1.2 V |
| پن E6 | GND — Ground |
| پن E7 | VCC — Core voltage 1.2 V |
| پن E8 | GND — Ground |
| پن E9 | VCC — Core voltage 1.2 V |
| پن E10 | IO — User I/O (bank-specific voltage) |
| پن E11 | IO — User I/O (bank-specific voltage) |
| پن F1 | IO — User I/O (bank-specific voltage) |
| پن F2 | GND — Ground |
| پن F3 | VCCIO — I/O bank supply voltage |
| پن F4 | VCC — Core voltage 1.2 V |
| پن F5 | TCK — JTAG test clock |
| پن F6 | TMS — JTAG test mode select |
| پن F7 | TDI — JTAG test data in |
| پن F8 | TDO — JTAG test data out |
| پن F9 | VCC — Core voltage 1.2 V |
| پن F10 | VCCIO — I/O bank supply voltage |
| پن F11 | GND — Ground |
| پن G1 | IO — User I/O (bank-specific voltage) |
| پن G2 | VCCIO — I/O bank supply voltage |
| پن G3 | GND — Ground |
| پن G4 | nCONFIG — Configuration start (active low) |
| پن G5 | nSTATUS — Configuration status (active low) |
| پن G6 | CONFIG_DONE — Configuration complete |
| پن G7 | CRC_ERROR — CRC error indicator |
| پن G8 | DEV_CLRn — Device clear (active low) |
| پن G9 | DEV_OE — Device output enable |
| پن G10 | VCCIO — I/O bank supply voltage |
| پن G11 | IO — User I/O (bank-specific voltage) |
| پن H1 | IO — User I/O (bank-specific voltage) |
| پن H2 | GND — Ground |
| پن H3 | VCCIO — I/O bank supply voltage |
| پن H4 | VCC — Core voltage 1.2 V |
| پن H5 | VCCA_ADC — ADC analog supply (2.5 V) |
| پن H6 | ADCIN1 — Analog input channel 1 |
| پن H7 | ADCIN2 — Analog input channel 2 |
| پن H8 | VREF — ADC reference voltage |
| پن H9 | VCC — Core voltage 1.2 V |
| پن H10 | VCCIO — I/O bank supply voltage |
| پن H11 | GND — Ground |
| پن J1 | IO — User I/O (bank-specific voltage) |
| پن J2 | VCCIO — I/O bank supply voltage |
| پن J3 | GND — Ground |
| پن J4 | VCC — Core voltage 1.2 V |
| پن J5 | ADCIN3 — Analog input channel 3 |
| پن J6 | ADCIN4 — Analog input channel 4 |
| پن J7 | ADCIN5 — Analog input channel 5 |
| پن J8 | ADCIN6 — Analog input channel 6 |
| پن J9 | VCC — Core voltage 1.2 V |
| پن J10 | IO — User I/O (bank-specific voltage) |
| پن J11 | IO — User I/O (bank-specific voltage) |
| پن K1 | IO — User I/O (bank-specific voltage) |
| پن K2 | GND — Ground |
| پن K3 | VCCIO — I/O bank supply voltage |
| پن K4 | VCC — Core voltage 1.2 V |
| پن K5 | GND — Ground |
| پن K6 | ADCIN7 — Analog input channel 7 |
| پن K7 | ADCIN8 — Analog input channel 8 |
| پن K8 | GND — Ground |
| پن K9 | VCC — Core voltage 1.2 V |
| پن K10 | VCCIO — I/O bank supply voltage |
| پن K11 | GND — Ground |
| پن L1 | IO — User I/O (bank-specific voltage) |
| پن L2 | VCCIO — I/O bank supply voltage |
| پن L3 | GND — Ground |
| پن L4 | VCC — Core voltage 1.2 V |
| پن L5 | ADCIN9 — Analog input channel 9 |
| پن L6 | ADCIN10 — Analog input channel 10 |
| پن L7 | ADCIN11 — Analog input channel 11 |
| پن L8 | ADCIN12 — Analog input channel 12 |
| پن L9 | VCC — Core voltage 1.2 V |
| پن L10 | IO — User I/O (bank-specific voltage) |
| پن L11 | IO — User I/O (bank-specific voltage) |
| پن M1 | IO — User I/O (bank-specific voltage) |
| پن M2 | GND — Ground |
| پن M3 | VCCIO — I/O bank supply voltage |
| پن M4 | VCC — Core voltage 1.2 V |
| پن M5 | GND — Ground |
| پن M6 | VCCIO — I/O bank supply voltage |
| پن M7 | VCC — Core voltage 1.2 V |
| پن M8 | GND — Ground |
| پن M9 | VCC — Core voltage 1.2 V |
| پن M10 | VCCIO — I/O bank supply voltage |
| پن M11 | GND — Ground |
| پن N1 | IO — User I/O (bank-specific voltage) |
| پن N2 | IO — User I/O (bank-specific voltage) |
| پن N3 | GND — Ground |
| پن N4 | VCCIO — I/O bank supply voltage |
| پن N5 | VCC — Core voltage 1.2 V |
| پن N6 | GND — Ground |
| پن N7 | VCC — Core voltage 1.2 V |
| پن N8 | VCCIO — I/O bank supply voltage |
| پن N9 | GND — Ground |
| پن N10 | IO — User I/O (bank-specific voltage) |
| پن N11 | IO — User I/O (bank-specific voltage) |
عام استعمالات
10M04SCM153I7G کے لیے موزوں ہے 6 ایپلیکیشنs: Industrial I/O Expansion & Glue Logic, Motor Control & PWM Generation, Sensor Aggregation in IoT Edge Nodes, Video Bridging & Display Interface, Human-Machine Interface (HMI) Controllers, Protocol Bridging & Industrial Communication.
Industrial I/O Expansion & Glue Logic
The 10M04SCM153I7G is ideal for industrial I/O expansion where a microcontroller lacks sufficient GPIOs, interrupts, or specialized peripherals. With 112 user I/O pins in the 153-ball MBGA and 4,000 LEs, it bridges SPI/I2C to parallel buses, implements custom timing-critical state machines, and aggregates sensors. The integrated 12-bit 1 Msps ADC also digitizes analog inputs (0-2.5 V) alongside digital I/O. Industrial -40C to +100C temperature grade suits factory-floor PLCs, motor drives, and SCADA modules. Use case: an STM32 host connects to the 10M04 over SPI; the FPGA drives 64 isolated digital outputs, four PWM channels, and three analog sensor inputs - all with sub-microsecond deterministic latency unavailable in software loops.
تجویز کردہ
Motor Control & PWM Generation
The 10M04SCM153I7G's 16 DSP blocks (18x18 multipliers) and 2 PLLs make it suitable for field-oriented control (FOC) and high-resolution PWM generation in BLDC, stepper, and PMSM motor drives. The 16 hardware multipliers handle Park/Clark transforms and PID computations at switching frequencies above 100 kHz. Quartus Prime IP libraries provide Nios II soft-core for sequence management. The industrial temperature range tolerates under-hood or chassis-mount environments. Typical deployment: a 3-phase inverter PCB uses the 10M04 for center-aligned PWM (25 ns resolution), encoder quadrature decoding, and overcurrent protection logic, with the host MCU handling CAN and user-interface functions.
تجویز کردہ
Sensor Aggregation in IoT Edge Nodes
The 10M04SCM153I7G aggregates multiple sensor streams (SPI temperature, I2C pressure, UART GPS, analog load cell) into a single Ethernet or CAN output for IoT gateways. Its 193,536 bits of embedded SRAM buffers bursty sensor data, while the integrated 12-bit ADC handles analog sensors without external converters. Industrial temperature rating fits outdoor enclosures. The 153-ball MBGA at 8x8 mm keeps the PCB compact for DIN-rail mounted edge devices. Reference design: a smart-agriculture node reads 12 sensors, performs local thresholding/filtering in FPGA logic, and forwards only events to the cloud via Ethernet, reducing cellular data costs.
تجویز کردہ
Video Bridging & Display Interface
The 10M04SCM153I7G supports parallel RGB, LVDS, and CMOS image sensor interfaces for video bridging applications. With 4,000 LEs and 16 DSP blocks, it implements color-space conversion, scaling, and timing generation at resolutions up to 720p. The 112 I/O pins accommodate 24-bit parallel RGB plus control signals. Industrial temperature range suits automotive aftermarket head-units, industrial HMIs, and medical imaging front-ends. Typical use: bridge a CMOS camera sensor (parallel DVP output) to an RGB TFT LCD with on-the-fly gamma correction and OSD overlay, all handled in FPGA fabric without a dedicated graphics processor.
تجویز کردہ
Human-Machine Interface (HMI) Controllers
The 10M04SCM153I7G drives HMI touchscreens, button matrices, and LED indicators in industrial control panels. With 112 I/O pins, it scans 8x8 key matrices, controls WS2812 addressable LEDs via DMA-style pulse generation, and refreshes TFT displays over SPI. The on-chip ADC reads potentiometers and analog joysticks. Quartus Prime Lite's free license keeps BOM cost low for high-volume HMI products. Industrial temperature grade supports -40C to +100C factory and outdoor cabinet use. Example: a 7-inch HMI panel uses the 10M04 to manage capacitive-touch I2C controller, 32 RGB status LEDs, and a CAN bus interface to a PLC.
تجویز کردہ
Protocol Bridging & Industrial Communication
The 10M04SCM153I7G excels at industrial protocol bridging between UART, SPI, I2C, CAN, RS-485, RS-232, and Ethernet. The 4,000 LEs implement multiple soft protocol stacks simultaneously with deterministic timing. Hard PLLs generate precise baud rates up to 10 Mbit/s. Industrial -40C to +100C temperature range tolerates harsh cabinet environments. The integrated flash enables field firmware updates via JTAG or soft-core bootloader. Example deployment: a substation gateway converts DNP3 over RS-485 to IEC 61850 over Ethernet, with hardware-accelerated CRC and timestamping - reducing latency versus MCU-based bridges by 5-10x.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا 10M04SCM153I7G — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | 10M04SAM153I7G | 10M04SCM153C8G | 10M04SAM153C8G | 10M04SCE144I7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 153-ball MBGA (M153), 8x8 mm | 153-ball MBGA (M153), 8x8 mm | 153-ball MBGA (M153), 8x8 mm | 153-ball MBGA (M153), 8x8 mm | 144-ball MBGA (E144) |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Embedded Memory (bits) | 193,536 | 193,536 | 193,536 | 193,536 | 193,536 |
| Maximum User I/O | 112 | 112 | 112 | 112 | ~96 |
| Speed Grade | SC | SA | SC | SA | SC |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| On-chip ADC | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps |
اہم امتیازی خصوصیات
- Highest-density I/O option within the 10M04 family at 8x8 mm (بمقابلہ10M04SCE144I7G)
- Industrial temperature grade for harsh-environment deployment (بمقابلہ10M04SCM153C8G)
- Integrated 12-bit 1 Msps ADC with up to 17 analog inputs (بمقابلہLattice ECP5 (LFE5U-12F-8BG256C))
ڈیزائن نوٹس
The 10M04SCM153I7G requires three supply rails: 1.2 V core (VCC), per-bank VCCIO (1.2-3.3 V), and 2.5 V VCCA_ADC for the integrated ADC. Decouple each VCC pin with a 100 nF 0402 ceramic capacitor placed within 2 mm of the ball. Use a ferrite bead or pi-filter on VCCA_ADC to isolate ADC noise from digital supplies. Bulk capacitors of 10 uF on each rail are recommended. Power-on sequencing: VCC must rise before or simultaneously with VCCIO; failure causes latch-up.
The 153-ball MBGA package has a theta_JA of approximately 25-30 C/W on a 4-layer JEDEC test board. In industrial temperature operation (-40C to +100C ambient), the FPGA can dissipate up to 1 W continuously without active cooling. For fanless enclosures, ensure the PCB has at least 2 oz copper on inner layers with thermal via arrays beneath the BGA center ground balls. Avoid placing the FPGA adjacent to high-power regulators.
Route all 153 BGA escape traces on the top layer using 0.1 mm trace/space with microvia-in-pad for BGA breakouts. The 0.5 mm pitch requires HDI (high-density interconnect) PCB fabrication - 4-layer stack-up with sequential lamination is typical. Match JTAG trace lengths to TCK to within 25 mm. Provide a USB-Blaster header or pogo-pin test points for factory programming. Keep the JTAG chain free of series resistors per Intel Pin Connection Guidelines.
Do not connect unused I/O pins to ground - leave them floating or per Quartus default (input tri-stated with weak pull-up). Connecting unused balls to GND increases inrush current and may damage the I/O cell during hot-plug events. Also note that the on-chip flash must be programmed via JTAG or AS mode before the FPGA can self-configure at power-on; verify the .pof file generation step in Quartus Programmer before shipping boards.
تعمیل کی معلومات
RoHS compliant per 7G suffix in MPN. Intel MAX 10 family is not AEC-Q100 qualified - choose Cyclone IV or V for automotive. Halogen-free status not confirmed in available data.
