10M04SCM153I7G - MAX 10 FPGA 4K LE, 153-BGA, Industrial | Intel
MPN: 10M04SCM153I7G ✓ Hoạt động10M04SCM153I7G Tóm tắt
What is a MAX 10 FPGA? A Field-Programmable Gate Array is a reconfigurable digital logic device consisting of programmable logic elements, embedded memory blocks, DSP slices, and a programmable interconnect fabric. MAX 10 (within Intel's FPGA taxonomy: FPGA -> non-volatile FPGA -> low-power CPLD/FPGA family) uniquely integrates instant-on flash configuration with analog and DSP blocks, bridging the gap between traditional CPLDs and higher-density Cyclone / Stratix families. The 10M04 is the entry-level density tier of the MAX 10 lineup.
Key features include up to 193,536 bits of embedded user flash (added to the user-accessible SRAM budget), a 12-bit 1 Msps ADC with up to 17 analog inputs, hard memory controllers (DDR3/DDR3L/LPDDR2), and up to 45 multipliers (18x18). The 153-ball MBGA package is just 8x8 mm with a 0.5 mm ball pitch, supporting densities above 30,000 logic cells when migrating within the MAX 10 family.
Architecturally, MAX 10 uses logic array blocks (LABs) of 16 logic elements, each LE containing a 4-input LUT, register, and carry chain. The embedded flash reduces BOM cost by eliminating external boot PROM. The industrial -40C to +100C operating range suits factory, automotive aftermarket, and outdoor industrial deployments.
Typical applications include industrial I/O expansion and glue logic, motor control, sensor aggregation in IoT edge nodes, video bridging, and human-machine interface (HMI) controllers. Designers also use 10M04 for protocol bridging (UART/SPI/I2C to Ethernet) and as a low-cost replacement for CPLD-based state machines requiring soft-core processors.
When designing, account for bank-dependent I/O voltage (each bank is independently 1.2/1.5/1.8/2.5/3.0/3.3 V) and use the Quartus Prime Lite toolchain (free) for synthesis, place-and-route, and programming file generation. A JTAG or on-chip flash programmer is required for in-system configuration.
This page synthesizes distributor pricing, drop-in package-compatible MAX 10 variants, and design notes not found in the standalone datasheet, enabling faster component selection for low-density FPGA designs.
Bộ thay thế dễ dàng lắp đặt cho 10M04SCM153I7G — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 10M04SCM153I7G (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Configuration Memory, Temperature Grade, Family.
10M04SAM153I7G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10M04SCM153C8G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10M04SAM153C8G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10M04SCE144I7G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10M04SCM153I7G Tỷ lệ tối đa & tính chất điện
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Embedded Memory (bits) | 193,536 |
| Maximum User I/O | 112 |
| Hộp | 153-ball MBGA (Micro FineLine BGA), 8x8 mm, 0.5 mm pitch |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| I/O Voltage Standards | LVCMOS 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Embedded Memory Type | M9K (9 Kbit blocks) |
| User Flash (CFM/UFM) | Available (configurable flash + user flash) |
| DSP Blocks (18x18 Multipliers) | 16 |
| PLLs | 2 |
| On-chip ADC | 12-bit, 1 Msps, up to 17 analog inputs |
| Speed Grade | SC (commercial/industrial slow) |
| Temperature Grade | Industrial (I), -40C to +100C |
| Configuration Method | On-chip flash + JTAG |
| Lead-free / RoHS | Yes (7G suffix) |
| Kiểu lắp đặt | Surface Mount (BGA) |
Cấu hình chân 10M04SCM153I7G
| Chân A1 | IO — User I/O (bank-specific voltage) |
| Chân A2 | IO — User I/O (bank-specific voltage) |
| Chân A3 | IO — User I/O (bank-specific voltage) |
| Chân A4 | VCCIO — I/O bank supply voltage |
| Chân A5 | VCCIO — I/O bank supply voltage |
| Chân A6 | IO — User I/O (bank-specific voltage) |
| Chân A7 | IO — User I/O (bank-specific voltage) |
| Chân A8 | IO — User I/O (bank-specific voltage) |
| Chân A9 | IO — User I/O (bank-specific voltage) |
| Chân A10 | IO — User I/O (bank-specific voltage) |
| Chân A11 | IO — User I/O (bank-specific voltage) |
| Chân B1 | IO — User I/O (bank-specific voltage) |
| Chân B2 | GND — Ground |
| Chân B3 | GND — Ground |
| Chân B4 | VCC — Core voltage 1.2 V |
| Chân B5 | VCC — Core voltage 1.2 V |
| Chân B6 | GND — Ground |
| Chân B7 | GND — Ground |
| Chân B8 | VCCIO — I/O bank supply voltage |
| Chân B9 | VCCIO — I/O bank supply voltage |
| Chân B10 | GND — Ground |
| Chân B11 | IO — User I/O (bank-specific voltage) |
| Chân C1 | IO — User I/O (bank-specific voltage) |
| Chân C2 | IO — User I/O (bank-specific voltage) |
| Chân C3 | GND — Ground |
| Chân C4 | VCCIO — I/O bank supply voltage |
| Chân C5 | GND — Ground |
| Chân C6 | VCCIO — I/O bank supply voltage |
| Chân C7 | VCC — Core voltage 1.2 V |
| Chân C8 | GND — Ground |
| Chân C9 | VCC — Core voltage 1.2 V |
| Chân C10 | IO — User I/O (bank-specific voltage) |
| Chân C11 | IO — User I/O (bank-specific voltage) |
| Chân D1 | IO — User I/O (bank-specific voltage) |
| Chân D2 | GND — Ground |
| Chân D3 | VCCIO — I/O bank supply voltage |
| Chân D4 | GND — Ground |
| Chân D5 | VCCIO — I/O bank supply voltage |
| Chân D6 | VCC — Core voltage 1.2 V |
| Chân D7 | GND — Ground |
| Chân D8 | VCC — Core voltage 1.2 V |
| Chân D9 | VCCIO — I/O bank supply voltage |
| Chân D10 | GND — Ground |
| Chân D11 | IO — User I/O (bank-specific voltage) |
| Chân E1 | IO — User I/O (bank-specific voltage) |
| Chân E2 | VCCIO — I/O bank supply voltage |
| Chân E3 | GND — Ground |
| Chân E4 | VCC — Core voltage 1.2 V |
| Chân E5 | VCC — Core voltage 1.2 V |
| Chân E6 | GND — Ground |
| Chân E7 | VCC — Core voltage 1.2 V |
| Chân E8 | GND — Ground |
| Chân E9 | VCC — Core voltage 1.2 V |
| Chân E10 | IO — User I/O (bank-specific voltage) |
| Chân E11 | IO — User I/O (bank-specific voltage) |
| Chân F1 | IO — User I/O (bank-specific voltage) |
| Chân F2 | GND — Ground |
| Chân F3 | VCCIO — I/O bank supply voltage |
| Chân F4 | VCC — Core voltage 1.2 V |
| Chân F5 | TCK — JTAG test clock |
| Chân F6 | TMS — JTAG test mode select |
| Chân F7 | TDI — JTAG test data in |
| Chân F8 | TDO — JTAG test data out |
| Chân F9 | VCC — Core voltage 1.2 V |
| Chân F10 | VCCIO — I/O bank supply voltage |
| Chân F11 | GND — Ground |
| Chân G1 | IO — User I/O (bank-specific voltage) |
| Chân G2 | VCCIO — I/O bank supply voltage |
| Chân G3 | GND — Ground |
| Chân G4 | nCONFIG — Configuration start (active low) |
| Chân G5 | nSTATUS — Configuration status (active low) |
| Chân G6 | CONFIG_DONE — Configuration complete |
| Chân G7 | CRC_ERROR — CRC error indicator |
| Chân G8 | DEV_CLRn — Device clear (active low) |
| Chân G9 | DEV_OE — Device output enable |
| Chân G10 | VCCIO — I/O bank supply voltage |
| Chân G11 | IO — User I/O (bank-specific voltage) |
| Chân H1 | IO — User I/O (bank-specific voltage) |
| Chân H2 | GND — Ground |
| Chân H3 | VCCIO — I/O bank supply voltage |
| Chân H4 | VCC — Core voltage 1.2 V |
| Chân H5 | VCCA_ADC — ADC analog supply (2.5 V) |
| Chân H6 | ADCIN1 — Analog input channel 1 |
| Chân H7 | ADCIN2 — Analog input channel 2 |
| Chân H8 | VREF — ADC reference voltage |
| Chân H9 | VCC — Core voltage 1.2 V |
| Chân H10 | VCCIO — I/O bank supply voltage |
| Chân H11 | GND — Ground |
| Chân J1 | IO — User I/O (bank-specific voltage) |
| Chân J2 | VCCIO — I/O bank supply voltage |
| Chân J3 | GND — Ground |
| Chân J4 | VCC — Core voltage 1.2 V |
| Chân J5 | ADCIN3 — Analog input channel 3 |
| Chân J6 | ADCIN4 — Analog input channel 4 |
| Chân J7 | ADCIN5 — Analog input channel 5 |
| Chân J8 | ADCIN6 — Analog input channel 6 |
| Chân J9 | VCC — Core voltage 1.2 V |
| Chân J10 | IO — User I/O (bank-specific voltage) |
| Chân J11 | IO — User I/O (bank-specific voltage) |
| Chân K1 | IO — User I/O (bank-specific voltage) |
| Chân K2 | GND — Ground |
| Chân K3 | VCCIO — I/O bank supply voltage |
| Chân K4 | VCC — Core voltage 1.2 V |
| Chân K5 | GND — Ground |
| Chân K6 | ADCIN7 — Analog input channel 7 |
| Chân K7 | ADCIN8 — Analog input channel 8 |
| Chân K8 | GND — Ground |
| Chân K9 | VCC — Core voltage 1.2 V |
| Chân K10 | VCCIO — I/O bank supply voltage |
| Chân K11 | GND — Ground |
| Chân L1 | IO — User I/O (bank-specific voltage) |
| Chân L2 | VCCIO — I/O bank supply voltage |
| Chân L3 | GND — Ground |
| Chân L4 | VCC — Core voltage 1.2 V |
| Chân L5 | ADCIN9 — Analog input channel 9 |
| Chân L6 | ADCIN10 — Analog input channel 10 |
| Chân L7 | ADCIN11 — Analog input channel 11 |
| Chân L8 | ADCIN12 — Analog input channel 12 |
| Chân L9 | VCC — Core voltage 1.2 V |
| Chân L10 | IO — User I/O (bank-specific voltage) |
| Chân L11 | IO — User I/O (bank-specific voltage) |
| Chân M1 | IO — User I/O (bank-specific voltage) |
| Chân M2 | GND — Ground |
| Chân M3 | VCCIO — I/O bank supply voltage |
| Chân M4 | VCC — Core voltage 1.2 V |
| Chân M5 | GND — Ground |
| Chân M6 | VCCIO — I/O bank supply voltage |
| Chân M7 | VCC — Core voltage 1.2 V |
| Chân M8 | GND — Ground |
| Chân M9 | VCC — Core voltage 1.2 V |
| Chân M10 | VCCIO — I/O bank supply voltage |
| Chân M11 | GND — Ground |
| Chân N1 | IO — User I/O (bank-specific voltage) |
| Chân N2 | IO — User I/O (bank-specific voltage) |
| Chân N3 | GND — Ground |
| Chân N4 | VCCIO — I/O bank supply voltage |
| Chân N5 | VCC — Core voltage 1.2 V |
| Chân N6 | GND — Ground |
| Chân N7 | VCC — Core voltage 1.2 V |
| Chân N8 | VCCIO — I/O bank supply voltage |
| Chân N9 | GND — Ground |
| Chân N10 | IO — User I/O (bank-specific voltage) |
| Chân N11 | IO — User I/O (bank-specific voltage) |
Ứng dụng tiêu biểu
10M04SCM153I7G phù hợp cho 6 Áp dụngs: Industrial I/O Expansion & Glue Logic, Motor Control & PWM Generation, Sensor Aggregation in IoT Edge Nodes, Video Bridging & Display Interface, Human-Machine Interface (HMI) Controllers, Protocol Bridging & Industrial Communication.
Industrial I/O Expansion & Glue Logic
The 10M04SCM153I7G is ideal for industrial I/O expansion where a microcontroller lacks sufficient GPIOs, interrupts, or specialized peripherals. With 112 user I/O pins in the 153-ball MBGA and 4,000 LEs, it bridges SPI/I2C to parallel buses, implements custom timing-critical state machines, and aggregates sensors. The integrated 12-bit 1 Msps ADC also digitizes analog inputs (0-2.5 V) alongside digital I/O. Industrial -40C to +100C temperature grade suits factory-floor PLCs, motor drives, and SCADA modules. Use case: an STM32 host connects to the 10M04 over SPI; the FPGA drives 64 isolated digital outputs, four PWM channels, and three analog sensor inputs - all with sub-microsecond deterministic latency unavailable in software loops.
Được đề xuất
Motor Control & PWM Generation
The 10M04SCM153I7G's 16 DSP blocks (18x18 multipliers) and 2 PLLs make it suitable for field-oriented control (FOC) and high-resolution PWM generation in BLDC, stepper, and PMSM motor drives. The 16 hardware multipliers handle Park/Clark transforms and PID computations at switching frequencies above 100 kHz. Quartus Prime IP libraries provide Nios II soft-core for sequence management. The industrial temperature range tolerates under-hood or chassis-mount environments. Typical deployment: a 3-phase inverter PCB uses the 10M04 for center-aligned PWM (25 ns resolution), encoder quadrature decoding, and overcurrent protection logic, with the host MCU handling CAN and user-interface functions.
Được đề xuất
Sensor Aggregation in IoT Edge Nodes
The 10M04SCM153I7G aggregates multiple sensor streams (SPI temperature, I2C pressure, UART GPS, analog load cell) into a single Ethernet or CAN output for IoT gateways. Its 193,536 bits of embedded SRAM buffers bursty sensor data, while the integrated 12-bit ADC handles analog sensors without external converters. Industrial temperature rating fits outdoor enclosures. The 153-ball MBGA at 8x8 mm keeps the PCB compact for DIN-rail mounted edge devices. Reference design: a smart-agriculture node reads 12 sensors, performs local thresholding/filtering in FPGA logic, and forwards only events to the cloud via Ethernet, reducing cellular data costs.
Được đề xuất
Video Bridging & Display Interface
The 10M04SCM153I7G supports parallel RGB, LVDS, and CMOS image sensor interfaces for video bridging applications. With 4,000 LEs and 16 DSP blocks, it implements color-space conversion, scaling, and timing generation at resolutions up to 720p. The 112 I/O pins accommodate 24-bit parallel RGB plus control signals. Industrial temperature range suits automotive aftermarket head-units, industrial HMIs, and medical imaging front-ends. Typical use: bridge a CMOS camera sensor (parallel DVP output) to an RGB TFT LCD with on-the-fly gamma correction and OSD overlay, all handled in FPGA fabric without a dedicated graphics processor.
Được đề xuất
Human-Machine Interface (HMI) Controllers
The 10M04SCM153I7G drives HMI touchscreens, button matrices, and LED indicators in industrial control panels. With 112 I/O pins, it scans 8x8 key matrices, controls WS2812 addressable LEDs via DMA-style pulse generation, and refreshes TFT displays over SPI. The on-chip ADC reads potentiometers and analog joysticks. Quartus Prime Lite's free license keeps BOM cost low for high-volume HMI products. Industrial temperature grade supports -40C to +100C factory and outdoor cabinet use. Example: a 7-inch HMI panel uses the 10M04 to manage capacitive-touch I2C controller, 32 RGB status LEDs, and a CAN bus interface to a PLC.
Được đề xuất
Protocol Bridging & Industrial Communication
The 10M04SCM153I7G excels at industrial protocol bridging between UART, SPI, I2C, CAN, RS-485, RS-232, and Ethernet. The 4,000 LEs implement multiple soft protocol stacks simultaneously with deterministic timing. Hard PLLs generate precise baud rates up to 10 Mbit/s. Industrial -40C to +100C temperature range tolerates harsh cabinet environments. The integrated flash enables field firmware updates via JTAG or soft-core bootloader. Example deployment: a substation gateway converts DNP3 over RS-485 to IEC 61850 over Ethernet, with hardware-accelerated CRC and timestamping - reducing latency versus MCU-based bridges by 5-10x.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 10M04SCM153I7G — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 10M04SAM153I7G | 10M04SCM153C8G | 10M04SAM153C8G | 10M04SCE144I7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 153-ball MBGA (M153), 8x8 mm | 153-ball MBGA (M153), 8x8 mm | 153-ball MBGA (M153), 8x8 mm | 153-ball MBGA (M153), 8x8 mm | 144-ball MBGA (E144) |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Embedded Memory (bits) | 193,536 | 193,536 | 193,536 | 193,536 | 193,536 |
| Maximum User I/O | 112 | 112 | 112 | 112 | ~96 |
| Speed Grade | SC | SA | SC | SA | SC |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| On-chip ADC | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps |
Bảo phân biệt quan trọng
- Highest-density I/O option within the 10M04 family at 8x8 mm (vs10M04SCE144I7G)
- Industrial temperature grade for harsh-environment deployment (vs10M04SCM153C8G)
- Integrated 12-bit 1 Msps ADC with up to 17 analog inputs (vsLattice ECP5 (LFE5U-12F-8BG256C))
Ghi chú thiết kế
The 10M04SCM153I7G requires three supply rails: 1.2 V core (VCC), per-bank VCCIO (1.2-3.3 V), and 2.5 V VCCA_ADC for the integrated ADC. Decouple each VCC pin with a 100 nF 0402 ceramic capacitor placed within 2 mm of the ball. Use a ferrite bead or pi-filter on VCCA_ADC to isolate ADC noise from digital supplies. Bulk capacitors of 10 uF on each rail are recommended. Power-on sequencing: VCC must rise before or simultaneously with VCCIO; failure causes latch-up.
The 153-ball MBGA package has a theta_JA of approximately 25-30 C/W on a 4-layer JEDEC test board. In industrial temperature operation (-40C to +100C ambient), the FPGA can dissipate up to 1 W continuously without active cooling. For fanless enclosures, ensure the PCB has at least 2 oz copper on inner layers with thermal via arrays beneath the BGA center ground balls. Avoid placing the FPGA adjacent to high-power regulators.
Route all 153 BGA escape traces on the top layer using 0.1 mm trace/space with microvia-in-pad for BGA breakouts. The 0.5 mm pitch requires HDI (high-density interconnect) PCB fabrication - 4-layer stack-up with sequential lamination is typical. Match JTAG trace lengths to TCK to within 25 mm. Provide a USB-Blaster header or pogo-pin test points for factory programming. Keep the JTAG chain free of series resistors per Intel Pin Connection Guidelines.
Do not connect unused I/O pins to ground - leave them floating or per Quartus default (input tri-stated with weak pull-up). Connecting unused balls to GND increases inrush current and may damage the I/O cell during hot-plug events. Also note that the on-chip flash must be programmed via JTAG or AS mode before the FPGA can self-configure at power-on; verify the .pof file generation step in Quartus Programmer before shipping boards.
Thông tin tuân thủ
RoHS compliant per 7G suffix in MPN. Intel MAX 10 family is not AEC-Q100 qualified - choose Cyclone IV or V for automotive. Halogen-free status not confirmed in available data.
