Intel

EPF6010ATC144-3N - FLEX 6000 10K Gates FPGA 102 I/O | Intel

Name: EPF6010ATC144-3N - FLEX 6000 10K Gates FPGA 102 I/O | Intel
Brand: Intel
SKU: EPF6010ATC144-3N

MPN: EPF6010ATC144-3N ✗ اختتامِ زندگی

3.3 V Vdss 144-pin TQFP (20x20 mm, 1.0 mm pitch) Package -3 Speed SRAM (volatile, requires external PROM) Memory

قیمت کی درخواست کریں

MOQ: 1 |

ڈیٹا شیٹ دیکھیں (PDF) متبادل دیکھیں

مقدار

EPF6010ATC144-3N جائزہ

The Intel (formerly Altera) EPF6010ATC144-3N is a FLEX 6000 family Field Programmable Gate Array (FPGA) integrating 10,000 gates, 880 logic elements (cells), and 102 user I/Os in a 144-pin TQFP (20x20 mm) surface-mount package. It operates from a 3.3 V supply at up to 200 MHz internal performance on a 0.42 µm CMOS process, providing reconfigurable logic for glue logic, bus interface, and state-machine applications.

A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs sit hierarchically under programmable logic > logic ICs > integrated circuits > semiconductors, allowing hardware designers to implement custom digital circuits without the cost or lead-time of an ASIC. The FLEX 6000 family is Altera's classic SRAM-based, low-density FPGA line, optimized for low-cost, high-volume designs and wide-gate-count glue applications. Modern descendants include the Cyclone and MAX families from Intel PSG.

Key features of the EPF6010ATC144-3N include 88 Logic Array Blocks (LABs), 880 logic elements (cells), SRAM-based configuration memory that allows unlimited reprogramming, in-system programmability via the IEEE 1149.1 JTAG interface, and 4 dedicated clock input pins. The 144-pin TQFP package offers a 1.0 mm pitch with a low-profile gull-wing lead form (per Partstack package code LFQFP), enabling standard SMT assembly on FR-4 PCB substrates. Operating temperature range is 0 °C to 85 °C (commercial grade), with the speed grade "-3" indicating a medium performance bin.

Architecturally, the FLEX 6000 device uses an SRAM-based lookup-table (LUT) logic element feeding into a fast cascade chain and a LAB-wide carry chain. Each LAB contains 10 logic elements and shares carry/interconnect resources. Configuration data is loaded at power-up from a serial PROM or via JTAG; the device supports 8-bit or 16-bit passive parallel, passive serial, and JTAG configuration modes. Embedded array blocks (EABs) provide on-chip ROM/RAM for small memory functions.

Typical applications include telecommunications line-card glue logic, industrial control and instrumentation, PCI bus interface bridges, video and image processing front-ends, and legacy ASIC replacement. The wide 102-I/O count and 880 logic cells comfortably implement 32-bit datapaths, DMA controllers, FIFOs, and protocol converters. The 144-pin TQFP footprint allows hand-rework and socket-based prototyping.

Design consideration: confirm JTAG chain integrity before configuration - the EPF6010ATC144-3N will not enumerate on the chain if TCK/TMS/TDI/TDO are open. Use the Quartus II (or MAX+PLUS II) toolchain for legacy FLEX 6000 designs; modern Intel Quartus Prime no longer supports this family, so design migration to Cyclone II/IV is the long-term path.

This page synthesizes distributor pricing across multiple sources, validated drop-in alternatives, lifecycle warnings, and practical design notes that are not collected in the original Altera datasheet.

کے لیے ڈراپ اِن متبادل EPF6010ATC144-3N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔

اس سیریز میں مختلف ورژن

اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPF6010ATC144-3N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Process Technology, Package, Operating Temperature, Family, Speed Grade.

EPF10K30ATC144-3

Intel

Process Technology: CMOS

Package: 144-LQFP / TQFP-144

Operating Temperature: 0 C to 70 C (Commercial)