Intel

EPF6010ATC144-3N - FLEX 6000 10K Gates FPGA 102 I/O | Intel

Name: EPF6010ATC144-3N - FLEX 6000 10K Gates FPGA 102 I/O | Intel
Brand: Intel
SKU: EPF6010ATC144-3N

MPN: EPF6010ATC144-3N ✗ Cuối đời

3.3 V Vdss 144-pin TQFP (20x20 mm, 1.0 mm pitch) Package -3 Speed SRAM (volatile, requires external PROM) Memory

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MOQ: 1 |

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EPF6010ATC144-3N Tóm tắt

The Intel (formerly Altera) EPF6010ATC144-3N is a FLEX 6000 family Field Programmable Gate Array (FPGA) integrating 10,000 gates, 880 logic elements (cells), and 102 user I/Os in a 144-pin TQFP (20x20 mm) surface-mount package. It operates from a 3.3 V supply at up to 200 MHz internal performance on a 0.42 µm CMOS process, providing reconfigurable logic for glue logic, bus interface, and state-machine applications.

A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs sit hierarchically under programmable logic > logic ICs > integrated circuits > semiconductors, allowing hardware designers to implement custom digital circuits without the cost or lead-time of an ASIC. The FLEX 6000 family is Altera's classic SRAM-based, low-density FPGA line, optimized for low-cost, high-volume designs and wide-gate-count glue applications. Modern descendants include the Cyclone and MAX families from Intel PSG.

Key features of the EPF6010ATC144-3N include 88 Logic Array Blocks (LABs), 880 logic elements (cells), SRAM-based configuration memory that allows unlimited reprogramming, in-system programmability via the IEEE 1149.1 JTAG interface, and 4 dedicated clock input pins. The 144-pin TQFP package offers a 1.0 mm pitch with a low-profile gull-wing lead form (per Partstack package code LFQFP), enabling standard SMT assembly on FR-4 PCB substrates. Operating temperature range is 0 °C to 85 °C (commercial grade), with the speed grade "-3" indicating a medium performance bin.

Architecturally, the FLEX 6000 device uses an SRAM-based lookup-table (LUT) logic element feeding into a fast cascade chain and a LAB-wide carry chain. Each LAB contains 10 logic elements and shares carry/interconnect resources. Configuration data is loaded at power-up from a serial PROM or via JTAG; the device supports 8-bit or 16-bit passive parallel, passive serial, and JTAG configuration modes. Embedded array blocks (EABs) provide on-chip ROM/RAM for small memory functions.

Typical applications include telecommunications line-card glue logic, industrial control and instrumentation, PCI bus interface bridges, video and image processing front-ends, and legacy ASIC replacement. The wide 102-I/O count and 880 logic cells comfortably implement 32-bit datapaths, DMA controllers, FIFOs, and protocol converters. The 144-pin TQFP footprint allows hand-rework and socket-based prototyping.

Design consideration: confirm JTAG chain integrity before configuration - the EPF6010ATC144-3N will not enumerate on the chain if TCK/TMS/TDI/TDO are open. Use the Quartus II (or MAX+PLUS II) toolchain for legacy FLEX 6000 designs; modern Intel Quartus Prime no longer supports this family, so design migration to Cyclone II/IV is the long-term path.

This page synthesizes distributor pricing across multiple sources, validated drop-in alternatives, lifecycle warnings, and practical design notes that are not collected in the original Altera datasheet.

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Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF6010ATC144-3N (cùng hình factor và footprint) — khác nhau ở Process Technology, Package, Operating Temperature, Family, Speed Grade.

EPF10K30ATC144-3

Intel

Process Technology: CMOS

Package: 144-LQFP / TQFP-144

Operating Temperature: 0 C to 70 C (Commercial)