EPM570T10015 - MAX II CPLD, 570 LEs, TQFP-100 | Intel / Altera
MPN: EPM570T10015 ✓ فعالEPM570T10015 جائزہ
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device containing multiple macro cells connected through a programmable interconnect array. CPLDs sit between discrete 74-series glue logic and FPGAs in the programmable logic hierarchy: they offer deterministic timing, instant-on configuration from on-chip flash, and are typically used for bus interfacing, power-up sequencing, and I/O expansion. MAX II parts are widely adopted as low-power, low-cost glue logic replacing dozens of discrete logic ICs.
Key features of the EPM570T10015 include 570 logic elements, 8 Kbits of user flash memory, multi-volt I/O support (1.5 V / 1.8 V / 2.5 V / 3.3 V) on the same bank, and JTAG-based in-system programmability (IEEE 1149.1 / IEEE Std 1532). The non-volatile flash configuration enables instant-on operation within microseconds of power-up with no external boot PROM, and the device supports I/O standards including LVTTL, LVCMOS, PCI, and SSTL on a per-pin basis.
Internally, the device is organized as 570 LEs arranged across 4 Logic Array Blocks (LABs), each containing 16 macro cells, plus a flash-based configuration memory and a MultiTrack interconnect. Quartus II / Quartus Prime provides synthesis, place-and-route, and timing analysis. Power consumption is dominated by static current (typically a few mA) plus dynamic current proportional to switching frequency and toggle rate; total power is well below that of comparable FPGAs, making MAX II ideal for always-on glue logic.
Typical applications include industrial control I/O expansion, motor-control signal conditioning, peripheral bus bridging (e.g. SPI/I2C to parallel GPIO), power-sequencing and supervisory logic, and board-level glue logic for ASIC/ASSP replacement. The 100-pin TQFP package provides ample I/O for medium-density glue-logic tasks while keeping the PCB assembly process mainstream.
When designing with this device, observe the I/O-bank voltage constraints - mixing 3.3 V and 1.8 V signals requires that they be assigned to different I/O banks. Always de-couple the VCCINT and VCCIO pins with 0.1 µF ceramic capacitors placed as close to the package as possible, and follow Altera's Quartus PowerPlay guidelines for toggle-rate estimation to size the decoupling network.
This page synthesizes distributor stock data, drop-in alternatives drawn from the same MAX II device family, and practical design notes not found in the manufacturer datasheet.
کے لیے ڈراپ اِن متبادل EPM570T10015 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPM570T10015 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Operating Temperature, Package, Programming Interface, Process Technology, Mounting Type.
EPM570GT100I5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPM570GT100C5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPM570F100I5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPM570F100C5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPM570GT100C5
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPM570GT100I5
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPM570T10015 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Device Family | MAX II |
| Logic Elements | 570 |
| Macro Cells | 440 |
| User Flash Memory | 8 Kbits |
| Maximum User I/O Pins | 76 |
| پیکیج | TQFP-100 (T100) 14 x 14 mm |
| Pin-to-Pin Delay (tPD) | 15 ns (commercial/industrial speed grade) |
| Supply Voltage - Core (VCCINT) | 3.3 V (2.5 V variants exist in MAX II family) |
| Supply Voltage - I/O (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-volt I/O) |
| آپریٹنگ درجہ حرارت رینج | -40 °C to +85 °C (industrial) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1 / IEEE Std 1532) |
| Supported I/O Standards | LVTTL, LVCMOS, PCI, SSTL (per pin) |
| Process Technology | 0.18 µm |
EPM570T10015 پن کنفیگریشن
| پن 1 | I/O — User I/O pin (bank 1) - bidirectional GPIO, multi-volt standard |
| پن 2 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 3 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 4 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 5 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 6 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 7 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 8 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 9 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 10 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 11 | GND — Ground |
| پن 12 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 13 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 14 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 15 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 16 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 17 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 18 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 19 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 20 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 21 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 22 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 23 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 24 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 25 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 26 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 27 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 28 | GND — Ground |
| پن 29 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 30 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 31 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 32 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 33 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 34 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 35 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 36 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 37 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 38 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 39 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 40 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 41 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 42 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 43 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 44 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 45 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 46 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 47 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 48 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 49 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 50 | GND — Ground |
| پن 51 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 52 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 53 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 54 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 55 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 56 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 57 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 58 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 59 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 60 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 61 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 62 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 63 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 64 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 65 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 66 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 67 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 68 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 69 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 70 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 71 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 72 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 73 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 74 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 75 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 76 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 77 | TDI — JTAG Test Data In |
| پن 78 | TMS — JTAG Test Mode Select |
| پن 79 | TCK — JTAG Test Clock |
| پن 80 | TDO — JTAG Test Data Out |
| پن 81 | nCONFIG — Configuration control (active-low) |
| پن 82 | nSTATUS — Configuration status (active-low) |
| پن 83 | CONF_DONE — Configuration done (open-drain) |
| پن 84 | VCCINT — Core supply voltage (3.3 V) |
| پن 85 | GND — Ground |
| پن 86 | VCCIO — I/O bank supply voltage |
| پن 87 | VCCIO — I/O bank supply voltage |
| پن 88 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 89 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 90 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 91 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 92 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 93 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 94 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 95 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 96 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 97 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 98 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 99 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| پن 100 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
عام استعمالات
EPM570T10015 کے لیے موزوں ہے 7 ایپلیکیشنs: Industrial Control I/O Expansion, Bus Bridging and Protocol Translation, Power-Sequencing and Supervisory Logic, Motor-Control Signal Conditioning, ASIC/ASSP Replacement Glue Logic, Peripheral I/O Expansion for SoCs, Display and Touch Interface Bridging.
Industrial Control I/O Expansion
The EPM570T10015's 570 logic elements and 76 user I/O pins make it well suited for expanding MCU or SoC GPIO in industrial control systems. The 100-pin TQFP package provides ample I/O for parallel-bus interfaces, sensor-multiplexer control, and isolated digital-input conditioning, while the instant-on flash configuration means no boot delay on cold-start machinery. Industrial temperature rating (-40 to +85 C) is critical for PLC backplanes and motor-drive control cards exposed to factory ambient swings.
تجویز کردہ
Bus Bridging and Protocol Translation
The EPM570T10015 is widely used as a glue-logic translator between SPI, I2C, UART, and parallel-bus peripherals that cannot be interfaced directly to a host processor. With 570 LEs it has the capacity to implement multiple protocol state machines concurrently, while the 15 ns pin-to-pin delay suits standard-mode bus speeds without timing closure issues. Multi-volt I/O support (1.5/1.8/2.5/3.3 V) lets the device bridge legacy 5 V-tolerant and modern low-voltage rails in the same design.
تجویز کردہ
Power-Sequencing and Supervisory Logic
Power-up and power-down sequencing in multi-rail systems is a classic MAX II use case, and the EPM570T10015 fits this role with deterministic timing and instant-on non-volatile configuration. The 570-LE capacity allows several rail-sequencer state machines plus watchdog logic and reset-distribution trees. Designers typically pair the CPLD with a supervisor or PMIC, using the CPLD to enforce sequence dependencies and fault responses that the PMIC alone cannot implement.
تجویز کردہ
Motor-Control Signal Conditioning
In motor-drive electronics, the EPM570T10015 is often used for Hall-sensor decoding, fault-input aggregation, and PWM-signal conditioning between an MCU and the gate driver stage. The 15 ns propagation delay is fast enough to handle encoder feedback in real time, and the 100-pin TQFP package supports the many parallel signals (Hall A/B/C, ENC_A, ENC_B, INDEX, FAULT_n, BRAKE_n) typical of BLDC and stepper systems. The industrial temperature grade suits under-hood automotive and traction environments.
تجویز کردہ
ASIC/ASSP Replacement Glue Logic
When a discrete 74-series logic implementation grows beyond a handful of packages, the EPM570T10015 can absorb the entire glue-logic netlist into a single 100-pin TQFP. This reduces PCB area, improves reliability by removing dozens of solder joints, and provides a programmable migration path when interface requirements change. Quartus II/Prime schematic capture lets engineers re-target 74-series symbols directly into the CPLD without HDL rewrite.
تجویز کردہ
Peripheral I/O Expansion for SoCs
Modern SoCs often expose high-speed serial interfaces (USB, PCIe, RGMII) but lack parallel GPIO for buttons, LEDs, and legacy peripherals; the EPM570T10015 fills this gap by providing up to 76 user I/O pins with multi-volt support. The non-volatile instant-on behavior means peripherals are available immediately at power-up without waiting for the SoC bootloader. JTAG-based in-system programmability supports field updates without re-balling the SoC.
تجویز کردہ
Display and Touch Interface Bridging
The EPM570T10015 can bridge between an application processor and LCD/touch-panel controllers that use legacy parallel RGB or SPI interfaces. Its 570-LE capacity allows pixel-data multiplexing, backlight PWM generation, and touch-event debouncing in a single device. The multi-volt I/O banks permit direct connection to both 1.8 V SoC pads and 3.3 V display-driver pads without level shifters, simplifying the BOM.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EPM570T10015 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EPM570GT100I5N | EPM570GT100C5N | EPM570F100I5N | EPM570F100C5N | EPM570GT100C5 | EPM570GT100I5 |
|---|---|---|---|---|---|---|---|
| Package | TQFP-100 (T100) 14 x 14 mm | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 570 |
| Speed Grade (tPD) | 15 ns | 5 ns (faster) | 5 ns (faster) | 5 ns (faster) | 5 ns (faster) | 5 ns (faster) | 5 ns (faster) |
| Operating Temperature Range | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) - same | 0 C to +85 C (commercial) | -40 C to +85 C (industrial) - same | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +85 C (industrial) - same |
| User I/O Pins | 76 | 76 | 76 | 76 | 76 | 76 | 76 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Device Family | MAX II | MAX II - same | MAX II - same | MAX II - same | MAX II - same | MAX II - same | MAX II - same |
اہم امتیازی خصوصیات
- Non-volatile instant-on configuration from on-chip flash (بمقابلہSRAM-based FPGAs (e.g. Cyclone, Spartan))
- Industrial temperature range in the same TQFP-100 footprint (بمقابلہEPM570GT100C5N (commercial temperature 0 to +85 C))
- Multi-volt I/O support on every pin (بمقابلہSingle-voltage glue-logic ICs (74-series))
ڈیزائن نوٹس
Decouple every VCCINT pin with a 0.1 µF X5R/X7R ceramic capacitor placed within 5 mm of the package pad, and bulk-decouple each VCCIO bank with a 4.7 µF to 10 µF ceramic or low-ESR tantalum capacitor. MAX II devices have separate VCCINT and VCCIO rails - do not tie them together if the I/O bank must operate at a different voltage than the core. Estimate: total quiescent current is typically 5-10 mA for a fully-utilized EPM570 design; dynamic current scales with toggle rate per the Quartus PowerPlay analyzer.
TQFP-100 has 0.5 mm pitch leads - use 0.20 mm trace/space design rules with via-in-pad or microvia escape routing for breakout. Place the JTAG header (TCK/TMS/TDI/TDO plus GND) at the board edge for production programming access. The exposed thermal pad on TQFP-100 is not present on MAX II; only the standard ground pins are used for thermal dissipation. Keep high-speed traces away from the JTAG signals to avoid coupling during in-system programming.
Group I/O pins by bank voltage on the schematic before pin assignment in Quartus - mixing 1.8 V and 3.3 V signals on the same bank is not allowed on MAX II. Use Quartus pin-planner to lock each I/O bank to a single VCCIO rail. Leave at least one GND pin per I/O bank to provide a low-impedance return path; the TQFP-100 package has GND on pins 11, 28, 50, and 85 - place decoupling capacitors adjacent to each.
Do not assume the EPM570T10015 is pin-compatible with newer MAX V or MAX 10 CPLDs - those families use different pinout maps even at the same TQFP-100 package. Always re-validate the pin assignment file when migrating between MAX II, MAX V, and MAX 10. Also note that the 'T' suffix in EPM570T10015 indicates TQFP-100, not 'turbo' or 'high-speed'; the speed-grade number follows the package code (e.g. '15' = 15 ns tPD).
تعمیل کی معلومات
RoHS/REACH status not confirmed in the verified web data; lead-free ('N' suffix) variants EPM570GT100I5N, EPM570GT100C5N, EPM570F100I5N, EPM570F100C5N are explicitly lead-free per Altera/Intel marking convention, while EPM570GT100C5 and EPM570GT100I5 are non-N (Pb-containing) finishes. AEC-Q100 not applicable to CPLDs.
