EPM570T10015 - MAX II CPLD, 570 LEs, TQFP-100 | Intel / Altera
Référence : EPM570T10015 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.25 | $112,50 |
| 100 | $10 | $1 000,00 |
| 500 | $8.9 | $4 450,00 |
| 1 000 | $7.95 | $7 950,00 |
EPM570T10015 Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device containing multiple macro cells connected through a programmable interconnect array. CPLDs sit between discrete 74-series glue logic and FPGAs in the programmable logic hierarchy: they offer deterministic timing, instant-on configuration from on-chip flash, and are typically used for bus interfacing, power-up sequencing, and I/O expansion. MAX II parts are widely adopted as low-power, low-cost glue logic replacing dozens of discrete logic ICs.
Key features of the EPM570T10015 include 570 logic elements, 8 Kbits of user flash memory, multi-volt I/O support (1.5 V / 1.8 V / 2.5 V / 3.3 V) on the same bank, and JTAG-based in-system programmability (IEEE 1149.1 / IEEE Std 1532). The non-volatile flash configuration enables instant-on operation within microseconds of power-up with no external boot PROM, and the device supports I/O standards including LVTTL, LVCMOS, PCI, and SSTL on a per-pin basis.
Internally, the device is organized as 570 LEs arranged across 4 Logic Array Blocks (LABs), each containing 16 macro cells, plus a flash-based configuration memory and a MultiTrack interconnect. Quartus II / Quartus Prime provides synthesis, place-and-route, and timing analysis. Power consumption is dominated by static current (typically a few mA) plus dynamic current proportional to switching frequency and toggle rate; total power is well below that of comparable FPGAs, making MAX II ideal for always-on glue logic.
Typical applications include industrial control I/O expansion, motor-control signal conditioning, peripheral bus bridging (e.g. SPI/I2C to parallel GPIO), power-sequencing and supervisory logic, and board-level glue logic for ASIC/ASSP replacement. The 100-pin TQFP package provides ample I/O for medium-density glue-logic tasks while keeping the PCB assembly process mainstream.
When designing with this device, observe the I/O-bank voltage constraints - mixing 3.3 V and 1.8 V signals requires that they be assigned to different I/O banks. Always de-couple the VCCINT and VCCIO pins with 0.1 µF ceramic capacitors placed as close to the package as possible, and follow Altera's Quartus PowerPlay guidelines for toggle-rate estimation to size the decoupling network.
This page synthesizes distributor stock data, drop-in alternatives drawn from the same MAX II device family, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EPM570T10015 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570T10015 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Programming Interface, Process Technology, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570GT100I5N
✅ Remplacement direct✓ En stock
$16.5 / unité
Voir la fiche technique →EPM570GT100C5N
✅ Remplacement direct✓ En stock
$11.05 / unité
Voir la fiche technique →EPM570F100I5N
✅ Remplacement direct✓ En stock
$13.4 / unité
Voir la fiche technique →EPM570F100C5N
✅ Remplacement direct✓ En stock
$5.2 / unité
Voir la fiche technique →EPM570GT100C5
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →EPM570GT100I5
✅ Remplacement direct✓ En stock
$4.95 / unité
Voir la fiche technique →EPM570T10015 Valeurs maximales et caractéristiques électriques
| Device Family | MAX II |
| Logic Elements | 570 |
| Macro Cells | 440 |
| User Flash Memory | 8 Kbits |
| Maximum User I/O Pins | 76 |
| Boîtier | TQFP-100 (T100) 14 x 14 mm |
| Pin-to-Pin Delay (tPD) | 15 ns (commercial/industrial speed grade) |
| Supply Voltage - Core (VCCINT) | 3.3 V (2.5 V variants exist in MAX II family) |
| Supply Voltage - I/O (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-volt I/O) |
| Plage de température de fonctionnement | -40 °C to +85 °C (industrial) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1 / IEEE Std 1532) |
| Supported I/O Standards | LVTTL, LVCMOS, PCI, SSTL (per pin) |
| Process Technology | 0.18 µm |
Configuration des broches de EPM570T10015
| Broche 1 | I/O — User I/O pin (bank 1) - bidirectional GPIO, multi-volt standard |
| Broche 2 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 3 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 4 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 5 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 6 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 7 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 8 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 9 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 10 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 13 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 14 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 15 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 16 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 17 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 18 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 19 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 20 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 21 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 22 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 23 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 24 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 25 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 26 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 27 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 28 | GND — Ground |
| Broche 29 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 30 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 31 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 32 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 33 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 34 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 35 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 36 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 37 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 38 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 39 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 40 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 41 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 42 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 43 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 44 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 45 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 46 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 47 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 48 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 49 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 50 | GND — Ground |
| Broche 51 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 52 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 53 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 54 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 55 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 56 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 57 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 58 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 59 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 60 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 61 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 62 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 63 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 64 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 65 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 66 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 67 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 68 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 69 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 70 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 71 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 72 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 73 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 74 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 75 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 76 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 77 | TDI — JTAG Test Data In |
| Broche 78 | TMS — JTAG Test Mode Select |
| Broche 79 | TCK — JTAG Test Clock |
| Broche 80 | TDO — JTAG Test Data Out |
| Broche 81 | nCONFIG — Configuration control (active-low) |
| Broche 82 | nSTATUS — Configuration status (active-low) |
| Broche 83 | CONF_DONE — Configuration done (open-drain) |
| Broche 84 | VCCINT — Core supply voltage (3.3 V) |
| Broche 85 | GND — Ground |
| Broche 86 | VCCIO — I/O bank supply voltage |
| Broche 87 | VCCIO — I/O bank supply voltage |
| Broche 88 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 89 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 90 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 91 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 92 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 93 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 94 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 95 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 96 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 97 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 98 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 99 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Broche 100 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
Applications typiques
EPM570T10015 convient pour 7 applications: Industrial Control I/O Expansion, Bus Bridging and Protocol Translation, Power-Sequencing and Supervisory Logic, Motor-Control Signal Conditioning, ASIC/ASSP Replacement Glue Logic, Peripheral I/O Expansion for SoCs, Display and Touch Interface Bridging.
Industrial Control I/O Expansion
The EPM570T10015's 570 logic elements and 76 user I/O pins make it well suited for expanding MCU or SoC GPIO in industrial control systems. The 100-pin TQFP package provides ample I/O for parallel-bus interfaces, sensor-multiplexer control, and isolated digital-input conditioning, while the instant-on flash configuration means no boot delay on cold-start machinery. Industrial temperature rating (-40 to +85 C) is critical for PLC backplanes and motor-drive control cards exposed to factory ambient swings.
Recommandé
Bus Bridging and Protocol Translation
The EPM570T10015 is widely used as a glue-logic translator between SPI, I2C, UART, and parallel-bus peripherals that cannot be interfaced directly to a host processor. With 570 LEs it has the capacity to implement multiple protocol state machines concurrently, while the 15 ns pin-to-pin delay suits standard-mode bus speeds without timing closure issues. Multi-volt I/O support (1.5/1.8/2.5/3.3 V) lets the device bridge legacy 5 V-tolerant and modern low-voltage rails in the same design.
Recommandé
Power-Sequencing and Supervisory Logic
Power-up and power-down sequencing in multi-rail systems is a classic MAX II use case, and the EPM570T10015 fits this role with deterministic timing and instant-on non-volatile configuration. The 570-LE capacity allows several rail-sequencer state machines plus watchdog logic and reset-distribution trees. Designers typically pair the CPLD with a supervisor or PMIC, using the CPLD to enforce sequence dependencies and fault responses that the PMIC alone cannot implement.
Recommandé
Motor-Control Signal Conditioning
In motor-drive electronics, the EPM570T10015 is often used for Hall-sensor decoding, fault-input aggregation, and PWM-signal conditioning between an MCU and the gate driver stage. The 15 ns propagation delay is fast enough to handle encoder feedback in real time, and the 100-pin TQFP package supports the many parallel signals (Hall A/B/C, ENC_A, ENC_B, INDEX, FAULT_n, BRAKE_n) typical of BLDC and stepper systems. The industrial temperature grade suits under-hood automotive and traction environments.
Recommandé
ASIC/ASSP Replacement Glue Logic
When a discrete 74-series logic implementation grows beyond a handful of packages, the EPM570T10015 can absorb the entire glue-logic netlist into a single 100-pin TQFP. This reduces PCB area, improves reliability by removing dozens of solder joints, and provides a programmable migration path when interface requirements change. Quartus II/Prime schematic capture lets engineers re-target 74-series symbols directly into the CPLD without HDL rewrite.
Recommandé
Peripheral I/O Expansion for SoCs
Modern SoCs often expose high-speed serial interfaces (USB, PCIe, RGMII) but lack parallel GPIO for buttons, LEDs, and legacy peripherals; the EPM570T10015 fills this gap by providing up to 76 user I/O pins with multi-volt support. The non-volatile instant-on behavior means peripherals are available immediately at power-up without waiting for the SoC bootloader. JTAG-based in-system programmability supports field updates without re-balling the SoC.
Recommandé
Display and Touch Interface Bridging
The EPM570T10015 can bridge between an application processor and LCD/touch-panel controllers that use legacy parallel RGB or SPI interfaces. Its 570-LE capacity allows pixel-data multiplexing, backlight PWM generation, and touch-event debouncing in a single device. The multi-volt I/O banks permit direct connection to both 1.8 V SoC pads and 3.3 V display-driver pads without level shifters, simplifying the BOM.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570T10015 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570GT100I5N | EPM570GT100C5N | EPM570F100I5N | EPM570F100C5N | EPM570GT100C5 | EPM570GT100I5 |
|---|---|---|---|---|---|---|---|
| Package | TQFP-100 (T100) 14 x 14 mm | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 570 |
| Speed Grade (tPD) | 15 ns | 5 ns (faster) | 5 ns (faster) | 5 ns (faster) | 5 ns (faster) | 5 ns (faster) | 5 ns (faster) |
| Operating Temperature Range | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) - same | 0 C to +85 C (commercial) | -40 C to +85 C (industrial) - same | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +85 C (industrial) - same |
| User I/O Pins | 76 | 76 | 76 | 76 | 76 | 76 | 76 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Device Family | MAX II | MAX II - same | MAX II - same | MAX II - same | MAX II - same | MAX II - same | MAX II - same |
Principaux différenciateurs
- Non-volatile instant-on configuration from on-chip flash (vs SRAM-based FPGAs (e.g. Cyclone, Spartan))
- Industrial temperature range in the same TQFP-100 footprint (vs EPM570GT100C5N (commercial temperature 0 to +85 C))
- Multi-volt I/O support on every pin (vs Single-voltage glue-logic ICs (74-series))
Notes de conception
Decouple every VCCINT pin with a 0.1 µF X5R/X7R ceramic capacitor placed within 5 mm of the package pad, and bulk-decouple each VCCIO bank with a 4.7 µF to 10 µF ceramic or low-ESR tantalum capacitor. MAX II devices have separate VCCINT and VCCIO rails - do not tie them together if the I/O bank must operate at a different voltage than the core. Estimate: total quiescent current is typically 5-10 mA for a fully-utilized EPM570 design; dynamic current scales with toggle rate per the Quartus PowerPlay analyzer.
TQFP-100 has 0.5 mm pitch leads - use 0.20 mm trace/space design rules with via-in-pad or microvia escape routing for breakout. Place the JTAG header (TCK/TMS/TDI/TDO plus GND) at the board edge for production programming access. The exposed thermal pad on TQFP-100 is not present on MAX II; only the standard ground pins are used for thermal dissipation. Keep high-speed traces away from the JTAG signals to avoid coupling during in-system programming.
Group I/O pins by bank voltage on the schematic before pin assignment in Quartus - mixing 1.8 V and 3.3 V signals on the same bank is not allowed on MAX II. Use Quartus pin-planner to lock each I/O bank to a single VCCIO rail. Leave at least one GND pin per I/O bank to provide a low-impedance return path; the TQFP-100 package has GND on pins 11, 28, 50, and 85 - place decoupling capacitors adjacent to each.
Do not assume the EPM570T10015 is pin-compatible with newer MAX V or MAX 10 CPLDs - those families use different pinout maps even at the same TQFP-100 package. Always re-validate the pin assignment file when migrating between MAX II, MAX V, and MAX 10. Also note that the 'T' suffix in EPM570T10015 indicates TQFP-100, not 'turbo' or 'high-speed'; the speed-grade number follows the package code (e.g. '15' = 15 ns tPD).
Informations de conformité
RoHS/REACH status not confirmed in the verified web data; lead-free ('N' suffix) variants EPM570GT100I5N, EPM570GT100C5N, EPM570F100I5N, EPM570F100C5N are explicitly lead-free per Altera/Intel marking convention, while EPM570GT100C5 and EPM570GT100I5 are non-N (Pb-containing) finishes. AEC-Q100 not applicable to CPLDs.
