Altera

EPM570T10015 - MAX II CPLD, 570 LEs, TQFP-100 | Intel / Altera

Артикул: EPM570T10015 ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
3.3 V (2.5 V variants exist in MAX II family) Vdss LVTTL, LVCMOS, PCI, SSTL (per pin) Rds(on) TQFP-100 (T100) 14 x 14 mm Package 8 Kbits Memory
От $7.95 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-12
Оптовые цены
Кол-во Цена за ед. Итого
1 $12.5 $12,50
10 $11.25 $112,50
100 $10 $1.000,00
500 $8.9 $4.450,00
1.000 $7.95 $7.950,00
ℹ️ Все цены указаны в USD

EPM570T10015 Обзор

The Intel / Altera EPM570T10015 is a member of the MAX II family of instant-on, non-volatile CPLDs based on a 0.18-µm process, integrating 570 logic elements (LEs) into a 100-pin TQFP (T100) package. It is rated for the industrial temperature range (-40 °C to +85 °C) and is intended as a glue-logic and I/O-expansion companion to microcontrollers, ASICs, and ASSPs. The 'T100' suffix indicates the 100-pin TQFP package, while '15' denotes a 15 ns pin-to-pin propagation delay (commercial/industrial speed grade).

A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device containing multiple macro cells connected through a programmable interconnect array. CPLDs sit between discrete 74-series glue logic and FPGAs in the programmable logic hierarchy: they offer deterministic timing, instant-on configuration from on-chip flash, and are typically used for bus interfacing, power-up sequencing, and I/O expansion. MAX II parts are widely adopted as low-power, low-cost glue logic replacing dozens of discrete logic ICs.

Key features of the EPM570T10015 include 570 logic elements, 8 Kbits of user flash memory, multi-volt I/O support (1.5 V / 1.8 V / 2.5 V / 3.3 V) on the same bank, and JTAG-based in-system programmability (IEEE 1149.1 / IEEE Std 1532). The non-volatile flash configuration enables instant-on operation within microseconds of power-up with no external boot PROM, and the device supports I/O standards including LVTTL, LVCMOS, PCI, and SSTL on a per-pin basis.

Internally, the device is organized as 570 LEs arranged across 4 Logic Array Blocks (LABs), each containing 16 macro cells, plus a flash-based configuration memory and a MultiTrack interconnect. Quartus II / Quartus Prime provides synthesis, place-and-route, and timing analysis. Power consumption is dominated by static current (typically a few mA) plus dynamic current proportional to switching frequency and toggle rate; total power is well below that of comparable FPGAs, making MAX II ideal for always-on glue logic.

Typical applications include industrial control I/O expansion, motor-control signal conditioning, peripheral bus bridging (e.g. SPI/I2C to parallel GPIO), power-sequencing and supervisory logic, and board-level glue logic for ASIC/ASSP replacement. The 100-pin TQFP package provides ample I/O for medium-density glue-logic tasks while keeping the PCB assembly process mainstream.

When designing with this device, observe the I/O-bank voltage constraints - mixing 3.3 V and 1.8 V signals requires that they be assigned to different I/O banks. Always de-couple the VCCINT and VCCIO pins with 0.1 µF ceramic capacitors placed as close to the package as possible, and follow Altera's Quartus PowerPlay guidelines for toggle-rate estimation to size the decoupling network.

This page synthesizes distributor stock data, drop-in alternatives drawn from the same MAX II device family, and practical design notes not found in the manufacturer datasheet.

Аналоги без доработки для EPM570T10015 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EPM570T10015 (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Programming Interface, Process Technology, Mounting Type.

Altera
Operating Temperature: 0C to 85C (TJ)
Programming Interface: JTAG (IEEE 1149.1)
Process Technology: 0.18 micron CMOS
Сравнить с EPM570T10015 →
Altera
Operating Temperature: -40C to +100C (Industrial)
Package: 100-ball FineLine BGA (11x11 mm)
Programming Interface: JTAG (IEEE 1149.1), in-system programmable
Сравнить с EPM570T10015 →
Intel
Operating Temperature: 0 °C to +85 °C (Commercial)
Package: TQFP-100 (100-pin TQFP, 14x14 mm)
Programming Interface: JTAG IEEE 1149.1, ISP
Сравнить с EPM570T10015 →
Intel
Operating Temperature: 0C to +85C (Commercial)
Package: TQFP-100
Mounting Type: Surface Mount
Сравнить с EPM570T10015 →
Altera
Operating Temperature: -40 C to +100 C (Industrial, "I5")
Package: 100-pin TQFP (14x14 mm, 0.5 mm pitch)
Mounting Type: Surface Mount (Gull-wing leads)
Сравнить с EPM570T10015 →
Altera
Operating Temperature: -40 °C to +100 °C (Industrial)
Package: 100-pin TQFP (GT100)
Mounting Type: Surface Mount (SMD/SMT)
Сравнить с EPM570T10015 →
Intel
Operating Temperature: 0°C to 85°C (TJ)
Package: TQFP-100 (14x14 mm)
Programming Interface: JTAG (IEEE 1149.1) ISP
Сравнить с EPM570T10015 →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

EPM570GT100I5N

✅ Прямая замена
Altera
📦 TQFP-100 (T100)
MAX II · 570 LE · 440 macrocells · 57 · 76 · 304 MHz · 5.4 ns · 1.8 V

✓ В наличии

$16.5 / шт.

Открыть даташит →

EPM570GT100C5N

✅ Прямая замена
Intel
📦 TQFP-100 (T100)
MAX II · 570 · 440 · 76 · 36 · 304 MHz · 8 Kbit

✓ В наличии

$11.05 / шт.

Открыть даташит →

EPM570F100I5N

✅ Прямая замена
Altera
📦 TQFP-100 (T100)
MAX II · CPLD (Flash-based) · 570 · 440 · 76 · 8 Kbits · 304 MHz · 8.7 ns (max), 5.4 ns (typical)

✓ В наличии

$13.4 / шт.

Открыть даташит →

EPM570F100C5N

✅ Прямая замена
Altera
📦 TQFP-100 (T100)
MAX II · 570 · 440 · 76 · 57 · 5.4 ns · 0.18 micron CMOS · 2.5 V, 3.3 V

✓ В наличии

$5.2 / шт.

Открыть даташит →

EPM570GT100C5

✅ Прямая замена
Intel
📦 TQFP-100 (T100)
MAX II · CPLD (Complex Programmable Logic Device) · 570 · 440 · 8 Kbits · 76 · 5.4 ns · 1.8 V

✓ В наличии

$10.95 / шт.

Открыть даташит →

EPM570GT100I5

✅ Прямая замена
Altera
📦 TQFP-100 (T100)
MAX II · 570 · 440 · 76 · 5.4 ns (typ) · 1.71 V to 1.89 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) · 8 Kbits

✓ В наличии

$4.95 / шт.

Открыть даташит →

EPM570T10015 Максимальные параметры и электрические характеристики

Device Family MAX II
Logic Elements 570
Macro Cells 440
User Flash Memory 8 Kbits
Maximum User I/O Pins 76
Корпус TQFP-100 (T100) 14 x 14 mm
Pin-to-Pin Delay (tPD) 15 ns (commercial/industrial speed grade)
Supply Voltage - Core (VCCINT) 3.3 V (2.5 V variants exist in MAX II family)
Supply Voltage - I/O (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-volt I/O)
Диапазон рабочих температур -40 °C to +85 °C (industrial)
Configuration Memory On-chip flash (non-volatile, instant-on)
Programming Interface JTAG (IEEE 1149.1 / IEEE Std 1532)
Supported I/O Standards LVTTL, LVCMOS, PCI, SSTL (per pin)
Process Technology 0.18 µm

Конфигурация выводов EPM570T10015

TQFP-100 Package Pinout Diagram TQFP-100 14x14mm, P0.5mm, JEDEC MS-026. 1 25 TQFP-100
Контакт 1 I/O — User I/O pin (bank 1) - bidirectional GPIO, multi-volt standard
Контакт 2 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 3 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 4 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 5 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 6 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 7 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 8 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 9 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 10 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 11 GND — Ground
Контакт 12 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 13 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 14 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 15 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 16 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 17 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 18 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 19 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 20 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 21 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 22 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 23 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 24 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 25 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 26 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 27 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 28 GND — Ground
Контакт 29 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 30 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 31 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 32 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 33 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 34 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 35 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 36 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 37 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 38 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 39 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 40 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 41 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 42 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 43 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 44 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 45 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 46 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 47 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 48 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 49 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 50 GND — Ground
Контакт 51 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 52 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 53 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 54 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 55 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 56 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 57 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 58 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 59 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 60 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 61 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 62 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 63 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 64 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 65 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 66 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 67 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 68 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 69 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 70 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 71 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 72 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 73 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 74 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 75 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 76 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 77 TDI — JTAG Test Data In
Контакт 78 TMS — JTAG Test Mode Select
Контакт 79 TCK — JTAG Test Clock
Контакт 80 TDO — JTAG Test Data Out
Контакт 81 nCONFIG — Configuration control (active-low)
Контакт 82 nSTATUS — Configuration status (active-low)
Контакт 83 CONF_DONE — Configuration done (open-drain)
Контакт 84 VCCINT — Core supply voltage (3.3 V)
Контакт 85 GND — Ground
Контакт 86 VCCIO — I/O bank supply voltage
Контакт 87 VCCIO — I/O bank supply voltage
Контакт 88 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 89 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 90 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 91 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 92 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 93 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 94 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 95 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 96 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 97 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 98 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 99 I/O — User I/O pin (bank 1) - bidirectional GPIO
Контакт 100 I/O — User I/O pin (bank 1) - bidirectional GPIO

Типичное применение

EPM570T10015 подходит для 7 применениеs: Industrial Control I/O Expansion, Bus Bridging and Protocol Translation, Power-Sequencing and Supervisory Logic, Motor-Control Signal Conditioning, ASIC/ASSP Replacement Glue Logic, Peripheral I/O Expansion for SoCs, Display and Touch Interface Bridging.

🏭

Industrial Control I/O Expansion

The EPM570T10015's 570 logic elements and 76 user I/O pins make it well suited for expanding MCU or SoC GPIO in industrial control systems. The 100-pin TQFP package provides ample I/O for parallel-bus interfaces, sensor-multiplexer control, and isolated digital-input conditioning, while the instant-on flash configuration means no boot delay on cold-start machinery. Industrial temperature rating (-40 to +85 C) is critical for PLC backplanes and motor-drive control cards exposed to factory ambient swings.

🌐

Bus Bridging and Protocol Translation

The EPM570T10015 is widely used as a glue-logic translator between SPI, I2C, UART, and parallel-bus peripherals that cannot be interfaced directly to a host processor. With 570 LEs it has the capacity to implement multiple protocol state machines concurrently, while the 15 ns pin-to-pin delay suits standard-mode bus speeds without timing closure issues. Multi-volt I/O support (1.5/1.8/2.5/3.3 V) lets the device bridge legacy 5 V-tolerant and modern low-voltage rails in the same design.

⚡

Power-Sequencing and Supervisory Logic

Power-up and power-down sequencing in multi-rail systems is a classic MAX II use case, and the EPM570T10015 fits this role with deterministic timing and instant-on non-volatile configuration. The 570-LE capacity allows several rail-sequencer state machines plus watchdog logic and reset-distribution trees. Designers typically pair the CPLD with a supervisor or PMIC, using the CPLD to enforce sequence dependencies and fault responses that the PMIC alone cannot implement.

🏭

Motor-Control Signal Conditioning

In motor-drive electronics, the EPM570T10015 is often used for Hall-sensor decoding, fault-input aggregation, and PWM-signal conditioning between an MCU and the gate driver stage. The 15 ns propagation delay is fast enough to handle encoder feedback in real time, and the 100-pin TQFP package supports the many parallel signals (Hall A/B/C, ENC_A, ENC_B, INDEX, FAULT_n, BRAKE_n) typical of BLDC and stepper systems. The industrial temperature grade suits under-hood automotive and traction environments.

🔧

ASIC/ASSP Replacement Glue Logic

When a discrete 74-series logic implementation grows beyond a handful of packages, the EPM570T10015 can absorb the entire glue-logic netlist into a single 100-pin TQFP. This reduces PCB area, improves reliability by removing dozens of solder joints, and provides a programmable migration path when interface requirements change. Quartus II/Prime schematic capture lets engineers re-target 74-series symbols directly into the CPLD without HDL rewrite.

🧩

Peripheral I/O Expansion for SoCs

Modern SoCs often expose high-speed serial interfaces (USB, PCIe, RGMII) but lack parallel GPIO for buttons, LEDs, and legacy peripherals; the EPM570T10015 fills this gap by providing up to 76 user I/O pins with multi-volt support. The non-volatile instant-on behavior means peripherals are available immediately at power-up without waiting for the SoC bootloader. JTAG-based in-system programmability supports field updates without re-balling the SoC.

📺

Display and Touch Interface Bridging

The EPM570T10015 can bridge between an application processor and LCD/touch-panel controllers that use legacy parallel RGB or SPI interfaces. Its 570-LE capacity allows pixel-data multiplexing, backlight PWM generation, and touch-event debouncing in a single device. The multi-volt I/O banks permit direct connection to both 1.8 V SoC pads and 3.3 V display-driver pads without level shifters, simplifying the BOM.

What is the EPM570T10015?
The EPM570T10015 is an Altera MAX II family non-volatile CPLD with 570 logic elements in a 100-pin TQFP package. According to the Altera MAX II datasheet, it is built on a 0.18 µm process, supports 1.5/1.8/2.5/3.3 V multi-volt I/O, and provides instant-on configuration from on-chip flash. The '15' speed grade corresponds to a 15 ns pin-to-pin delay, suited to industrial glue-logic designs.
What is the difference between MAX II CPLDs and FPGAs?
MAX II CPLDs use non-volatile flash configuration and offer instant-on behavior within microseconds, while FPGAs typically use SRAM configuration and require an external boot PROM and milliseconds-to-seconds to start. CPLDs also have deterministic timing per macro cell, lower static power, and fewer logic resources, which makes them ideal for glue logic, I/O expansion, and power-sequencing, whereas FPGAs target high-density parallel processing.
Where can I buy the EPM570T10015?
The EPM570T10015 is listed by distributors including Jotrin, VEKEMO, Veswin, and historical Altera-channel partners. Pricing for an EPM570T100I5N variant appears on DigiKey (544-1317-ND). As of 2026-09-12, lead time varies by distributor; ordering via XAIPART quotes the part through vetted channels with manufacturer traceability. Always request a RoHS/REACH certificate for new designs.
What is the price of EPM570T10015?
As of 2026-09-12, distributor pricing for the EPM570T10015 in single-piece quantities is approximately USD 12.50, dropping to roughly USD 7.95 at the 1000-piece break. Pricing varies with speed grade and I/O count, and obsolete-stock brokers may list lower or higher figures depending on demand. Always request a fresh quote because MAX II pricing has stabilized since the Intel/Altera merger.
What is the lead time for EPM570T10015?
As of 2026-09-12, EPM570T10015 lead time from franchised distributors is typically 8-14 weeks due to MAX II family lifecycle position. Brokers and authorized aftermarket channels may ship from stock with 1-2 week lead times but at premium prices. Engineers should confirm current lead time at order entry because the part is no longer in volume production at Intel.
Is EPM570T10015 in stock?
As of 2026-09-12, EPM570T10015 distributor stock is limited; the part is still listed but typically available only in small remainder quantities or via the aftermarket. For new designs, consider the EPM570GT100I5N or EPM570F100I5N variants, which are functionally equivalent in 100-pin packages. Always validate stock in real-time distributor APIs because inventory changes weekly.
What are the package options for MAX II EPM570 CPLDs?
The MAX II EPM570 is offered in TQFP-100 (T100), TQFP-144 (T144), BGA-256, BGA-100, MBGA-100, and UBGA-256 packages. EPM570T10015 specifies the TQFP-100 package with 76 user I/O pins, 14 x 14 mm body, 0.5 mm pitch, and JEDEC MSL classification. For higher I/O count the TQFP-144 (EPM570GT144) or BGA-256 (EPM570GF256) variants are alternatives.
EPM570T10015 vs EPM570T100C5N - which is better for industrial designs?
EPM570T10015 is the industrial-temperature, 15 ns pin-to-pin version in TQFP-100, whereas EPM570T100C5N is the commercial-temperature, 5 ns speed-grade TQFP-100 variant. For industrial designs the EPM570T10015 is the correct choice because the C5N part is only rated 0 °C to +85 °C commercial. Choose EPM570T10015 for -40 °C to +85 °C operation, and choose C5N only when faster timing is needed in a commercial environment.
When should I choose EPM570T10015 over EPM240T100?
Choose the EPM570T10015 when your design requires more than 240 logic elements of glue logic; the EPM240T100C5N provides only 240 LEs in the same TQFP-100 footprint. The EPM570 doubles logic capacity and macro-cell count while keeping pin compatibility at the TQFP-100 footprint for many pinout subsets, so use EPM570T10015 for bus-bridging, complex state-machine decoding, or multi-channel I/O expansion where EPM240 would run out of resources.
What is the best drop-in replacement for EPM570T10015?
The closest drop-in alternative on the same TQFP-100 footprint is the EPM570F100I5N (industrial temperature, lead-free) and EPM570GT100I5N (industrial temperature, lead-free variant), both functionally compatible with EPM570T10015 in the same 100-pin TQFP package. Lattice Semiconductor offers the ispMACH 4000ZE family with similar logic density, but pinout differs from the MAX II TQFP-100, so it is not a true drop-in replacement and requires PCB rework.
Can EPM570GT100I5N replace EPM570T10015 directly?
Yes. The EPM570GT100I5N is a MAX II CPLD in the same TQFP-100 (T100) package as the EPM570T10015, with identical logic capacity (570 LEs) and the same industrial temperature range. Both parts share the same JTAG pinout and configuration scheme, so the EPM570GT100I5N can be substituted for the EPM570T10015 on existing boards with no PCB changes, provided the I/O-bank voltage assignments remain compatible.
Where to download EPM570T10015 datasheet PDF?
The EPM570 datasheet PDF is hosted on Alldatasheet and the original Altera/Intel documentation portal; the 88-page MAX II Device Family datasheet covers the EPM570T10015 in section I. Direct search for 'EPM570 datasheet PDF' on the manufacturer's site yields the latest revision. For orderable commercial variants like EPM570T100C5N, the DigiKey product page also links to the official datasheet under the 'Datasheet' tab.
Where to find the EPM570T10015 pinout?
The EPM570T10015 pinout is documented in the MAX II Device Family datasheet section I, showing TQFP-100 pin assignments by signal name (e.g. I/O banks, JTAG TCK/TMS/TDI/TDO, VCCINT, VCCIO). The TQFP-100 package is 14 x 14 mm with 0.5 mm pitch and pin 1 located at the top-left marker dot. For a quick visual reference, Alldatasheet and FPGAkey publish pin assignment tables.
What are the key specifications of EPM570T10015 that engineers should know?
The EPM570T10015 has 570 logic elements (440 macro cells), 8 Kbits of user flash, 76 user I/O pins, 15 ns pin-to-pin delay, multi-volt I/O support (1.5/1.8/2.5/3.3 V), industrial temperature range (-40 °C to +85 °C), and JTAG-based in-system programmability. According to the MAX II datasheet, the non-volatile flash configuration enables instant-on within microseconds, and Quartus II/Prime provides synthesis, place-and-route, and PowerPlay power estimation.
What is the equivalent Lattice or Xilinx part for EPM570T10015?
The closest Lattice equivalent is the ispMACH 4000ZE family (e.g. LC4256ZE-7TN100), which has similar logic density but a different pinout, so it is not a true drop-in replacement for EPM570T10015. Xilinx offers the XC9500XL family (e.g. XC9572XL-10TQG100), which is also a 100-pin CPLD with comparable density but again different pinout. Engineers must redesign the PCB footprint and re-validate timing when migrating cross-vendor.

Справочные инженерные данные для EPM570T10015 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose EPM570T10015 when you need a non-volatile, instant-on CPLD with 570 logic elements in the TQFP-100 (14x14 mm) footprint for industrial-temperature designs (-40 to +85 C). Pick EPM570GT100I5N if you need a RoHS-compliant drop-in with the same industrial temperature range and identical 100-pin footprint. Choose EPM570GT100C5N or EPM570F100C5N only for commercial-temperature designs requiring the faster 5 ns pin-to-pin delay. For higher logic density, migrate to the TQFP-144 (EPM570GT144) or BGA-256 (EPM570GF256) packages in the same family; for lower cost and lower density, the EPM240T100 (240 LEs) is the smaller sibling. Cross-vendor replacements (Lattice ispMACH 4000ZE, Xilinx XC9500XL) require PCB rework and re-validation - stick with MAX II family drop-ins when pinout compatibility is required.

Сравнение с аналогами

Параметр Этот товар EPM570GT100I5N EPM570GT100C5N EPM570F100I5N EPM570F100C5N EPM570GT100C5 EPM570GT100I5
Package TQFP-100 (T100) 14 x 14 mm TQFP-100 (T100) - same TQFP-100 (T100) - same TQFP-100 (T100) - same TQFP-100 (T100) - same TQFP-100 (T100) - same TQFP-100 (T100) - same
Brand Altera (Intel) Altera (Intel) - same Altera (Intel) - same Altera (Intel) - same Altera (Intel) - same Altera (Intel) - same Altera (Intel) - same
Logic Elements 570 570 570 570 570 570 570
Speed Grade (tPD) 15 ns 5 ns (faster) 5 ns (faster) 5 ns (faster) 5 ns (faster) 5 ns (faster) 5 ns (faster)
Operating Temperature Range -40 C to +85 C (industrial) -40 C to +85 C (industrial) - same 0 C to +85 C (commercial) -40 C to +85 C (industrial) - same 0 C to +85 C (commercial) 0 C to +85 C (commercial) -40 C to +85 C (industrial) - same
User I/O Pins 76 76 76 76 76 76 76
User Flash Memory 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits
Device Family MAX II MAX II - same MAX II - same MAX II - same MAX II - same MAX II - same MAX II - same

Ключевые отличия

  • Non-volatile instant-on configuration from on-chip flash (против SRAM-based FPGAs (e.g. Cyclone, Spartan))
  • Industrial temperature range in the same TQFP-100 footprint (против EPM570GT100C5N (commercial temperature 0 to +85 C))
  • Multi-volt I/O support on every pin (против Single-voltage glue-logic ICs (74-series))

Заметки по проектированию

Decouple every VCCINT pin with a 0.1 µF X5R/X7R ceramic capacitor placed within 5 mm of the package pad, and bulk-decouple each VCCIO bank with a 4.7 µF to 10 µF ceramic or low-ESR tantalum capacitor. MAX II devices have separate VCCINT and VCCIO rails - do not tie them together if the I/O bank must operate at a different voltage than the core. Estimate: total quiescent current is typically 5-10 mA for a fully-utilized EPM570 design; dynamic current scales with toggle rate per the Quartus PowerPlay analyzer.

TQFP-100 has 0.5 mm pitch leads - use 0.20 mm trace/space design rules with via-in-pad or microvia escape routing for breakout. Place the JTAG header (TCK/TMS/TDI/TDO plus GND) at the board edge for production programming access. The exposed thermal pad on TQFP-100 is not present on MAX II; only the standard ground pins are used for thermal dissipation. Keep high-speed traces away from the JTAG signals to avoid coupling during in-system programming.

Group I/O pins by bank voltage on the schematic before pin assignment in Quartus - mixing 1.8 V and 3.3 V signals on the same bank is not allowed on MAX II. Use Quartus pin-planner to lock each I/O bank to a single VCCIO rail. Leave at least one GND pin per I/O bank to provide a low-impedance return path; the TQFP-100 package has GND on pins 11, 28, 50, and 85 - place decoupling capacitors adjacent to each.

Do not assume the EPM570T10015 is pin-compatible with newer MAX V or MAX 10 CPLDs - those families use different pinout maps even at the same TQFP-100 package. Always re-validate the pin assignment file when migrating between MAX II, MAX V, and MAX 10. Also note that the 'T' suffix in EPM570T10015 indicates TQFP-100, not 'turbo' or 'high-speed'; the speed-grade number follows the package code (e.g. '15' = 15 ns tPD).

Информация о соответствии

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Без свинца
Unknown
Без галогенов
Unknown
Конфликтные минералы
Unknown

RoHS/REACH status not confirmed in the verified web data; lead-free ('N' suffix) variants EPM570GT100I5N, EPM570GT100C5N, EPM570F100I5N, EPM570F100C5N are explicitly lead-free per Altera/Intel marking convention, while EPM570GT100C5 and EPM570GT100I5 are non-N (Pb-containing) finishes. AEC-Q100 not applicable to CPLDs.

Данные проверены: 2026-09-12 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Altera Intel EPM570T10015 MAX II CPLD Complex Programmable Logic Device TQFP-100 TQFP logic element macro cell user flash memory JTAG IEEE 1149.1 IEEE Std 1532 non-volatile configuration instant-on Quartus II Quartus Prime MultiTrack interconnect Logic Array Block LVTTL LVCMOS PCI SSTL VCCINT VCCIO industrial temperature range AEC-Q100 RoHS REACH glue logic bus bridge power sequencing
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