EPM570T10015 - MAX II CPLD, 570 LEs, TQFP-100 | Intel / Altera
MPN: EPM570T10015 ✓ Hoạt độngEPM570T10015 Tóm tắt
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device containing multiple macro cells connected through a programmable interconnect array. CPLDs sit between discrete 74-series glue logic and FPGAs in the programmable logic hierarchy: they offer deterministic timing, instant-on configuration from on-chip flash, and are typically used for bus interfacing, power-up sequencing, and I/O expansion. MAX II parts are widely adopted as low-power, low-cost glue logic replacing dozens of discrete logic ICs.
Key features of the EPM570T10015 include 570 logic elements, 8 Kbits of user flash memory, multi-volt I/O support (1.5 V / 1.8 V / 2.5 V / 3.3 V) on the same bank, and JTAG-based in-system programmability (IEEE 1149.1 / IEEE Std 1532). The non-volatile flash configuration enables instant-on operation within microseconds of power-up with no external boot PROM, and the device supports I/O standards including LVTTL, LVCMOS, PCI, and SSTL on a per-pin basis.
Internally, the device is organized as 570 LEs arranged across 4 Logic Array Blocks (LABs), each containing 16 macro cells, plus a flash-based configuration memory and a MultiTrack interconnect. Quartus II / Quartus Prime provides synthesis, place-and-route, and timing analysis. Power consumption is dominated by static current (typically a few mA) plus dynamic current proportional to switching frequency and toggle rate; total power is well below that of comparable FPGAs, making MAX II ideal for always-on glue logic.
Typical applications include industrial control I/O expansion, motor-control signal conditioning, peripheral bus bridging (e.g. SPI/I2C to parallel GPIO), power-sequencing and supervisory logic, and board-level glue logic for ASIC/ASSP replacement. The 100-pin TQFP package provides ample I/O for medium-density glue-logic tasks while keeping the PCB assembly process mainstream.
When designing with this device, observe the I/O-bank voltage constraints - mixing 3.3 V and 1.8 V signals requires that they be assigned to different I/O banks. Always de-couple the VCCINT and VCCIO pins with 0.1 µF ceramic capacitors placed as close to the package as possible, and follow Altera's Quartus PowerPlay guidelines for toggle-rate estimation to size the decoupling network.
This page synthesizes distributor stock data, drop-in alternatives drawn from the same MAX II device family, and practical design notes not found in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho EPM570T10015 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM570T10015 (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, Programming Interface, Process Technology, Mounting Type.
EPM570GT100I5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570GT100C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570F100I5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570F100C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570GT100C5
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570GT100I5
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570T10015 Tỷ lệ tối đa & tính chất điện
| Device Family | MAX II |
| Logic Elements | 570 |
| Macro Cells | 440 |
| User Flash Memory | 8 Kbits |
| Maximum User I/O Pins | 76 |
| Hộp | TQFP-100 (T100) 14 x 14 mm |
| Pin-to-Pin Delay (tPD) | 15 ns (commercial/industrial speed grade) |
| Supply Voltage - Core (VCCINT) | 3.3 V (2.5 V variants exist in MAX II family) |
| Supply Voltage - I/O (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-volt I/O) |
| Khoảng nhiệt độ hoạt động | -40 °C to +85 °C (industrial) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1 / IEEE Std 1532) |
| Supported I/O Standards | LVTTL, LVCMOS, PCI, SSTL (per pin) |
| Process Technology | 0.18 µm |
Cấu hình chân EPM570T10015
| Chân 1 | I/O — User I/O pin (bank 1) - bidirectional GPIO, multi-volt standard |
| Chân 2 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 3 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 4 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 5 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 6 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 7 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 8 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 9 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 10 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 11 | GND — Ground |
| Chân 12 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 13 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 14 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 15 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 16 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 17 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 18 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 19 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 20 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 21 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 22 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 23 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 24 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 25 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 26 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 27 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 28 | GND — Ground |
| Chân 29 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 30 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 31 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 32 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 33 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 34 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 35 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 36 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 37 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 38 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 39 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 40 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 41 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 42 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 43 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 44 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 45 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 46 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 47 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 48 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 49 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 50 | GND — Ground |
| Chân 51 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 52 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 53 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 54 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 55 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 56 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 57 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 58 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 59 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 60 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 61 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 62 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 63 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 64 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 65 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 66 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 67 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 68 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 69 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 70 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 71 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 72 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 73 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 74 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 75 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 76 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 77 | TDI — JTAG Test Data In |
| Chân 78 | TMS — JTAG Test Mode Select |
| Chân 79 | TCK — JTAG Test Clock |
| Chân 80 | TDO — JTAG Test Data Out |
| Chân 81 | nCONFIG — Configuration control (active-low) |
| Chân 82 | nSTATUS — Configuration status (active-low) |
| Chân 83 | CONF_DONE — Configuration done (open-drain) |
| Chân 84 | VCCINT — Core supply voltage (3.3 V) |
| Chân 85 | GND — Ground |
| Chân 86 | VCCIO — I/O bank supply voltage |
| Chân 87 | VCCIO — I/O bank supply voltage |
| Chân 88 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 89 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 90 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 91 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 92 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 93 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 94 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 95 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 96 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 97 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 98 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 99 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
| Chân 100 | I/O — User I/O pin (bank 1) - bidirectional GPIO |
Ứng dụng tiêu biểu
EPM570T10015 phù hợp cho 7 Áp dụngs: Industrial Control I/O Expansion, Bus Bridging and Protocol Translation, Power-Sequencing and Supervisory Logic, Motor-Control Signal Conditioning, ASIC/ASSP Replacement Glue Logic, Peripheral I/O Expansion for SoCs, Display and Touch Interface Bridging.
Industrial Control I/O Expansion
The EPM570T10015's 570 logic elements and 76 user I/O pins make it well suited for expanding MCU or SoC GPIO in industrial control systems. The 100-pin TQFP package provides ample I/O for parallel-bus interfaces, sensor-multiplexer control, and isolated digital-input conditioning, while the instant-on flash configuration means no boot delay on cold-start machinery. Industrial temperature rating (-40 to +85 C) is critical for PLC backplanes and motor-drive control cards exposed to factory ambient swings.
Được đề xuất
Bus Bridging and Protocol Translation
The EPM570T10015 is widely used as a glue-logic translator between SPI, I2C, UART, and parallel-bus peripherals that cannot be interfaced directly to a host processor. With 570 LEs it has the capacity to implement multiple protocol state machines concurrently, while the 15 ns pin-to-pin delay suits standard-mode bus speeds without timing closure issues. Multi-volt I/O support (1.5/1.8/2.5/3.3 V) lets the device bridge legacy 5 V-tolerant and modern low-voltage rails in the same design.
Được đề xuất
Power-Sequencing and Supervisory Logic
Power-up and power-down sequencing in multi-rail systems is a classic MAX II use case, and the EPM570T10015 fits this role with deterministic timing and instant-on non-volatile configuration. The 570-LE capacity allows several rail-sequencer state machines plus watchdog logic and reset-distribution trees. Designers typically pair the CPLD with a supervisor or PMIC, using the CPLD to enforce sequence dependencies and fault responses that the PMIC alone cannot implement.
Được đề xuất
Motor-Control Signal Conditioning
In motor-drive electronics, the EPM570T10015 is often used for Hall-sensor decoding, fault-input aggregation, and PWM-signal conditioning between an MCU and the gate driver stage. The 15 ns propagation delay is fast enough to handle encoder feedback in real time, and the 100-pin TQFP package supports the many parallel signals (Hall A/B/C, ENC_A, ENC_B, INDEX, FAULT_n, BRAKE_n) typical of BLDC and stepper systems. The industrial temperature grade suits under-hood automotive and traction environments.
Được đề xuất
ASIC/ASSP Replacement Glue Logic
When a discrete 74-series logic implementation grows beyond a handful of packages, the EPM570T10015 can absorb the entire glue-logic netlist into a single 100-pin TQFP. This reduces PCB area, improves reliability by removing dozens of solder joints, and provides a programmable migration path when interface requirements change. Quartus II/Prime schematic capture lets engineers re-target 74-series symbols directly into the CPLD without HDL rewrite.
Được đề xuất
Peripheral I/O Expansion for SoCs
Modern SoCs often expose high-speed serial interfaces (USB, PCIe, RGMII) but lack parallel GPIO for buttons, LEDs, and legacy peripherals; the EPM570T10015 fills this gap by providing up to 76 user I/O pins with multi-volt support. The non-volatile instant-on behavior means peripherals are available immediately at power-up without waiting for the SoC bootloader. JTAG-based in-system programmability supports field updates without re-balling the SoC.
Được đề xuất
Display and Touch Interface Bridging
The EPM570T10015 can bridge between an application processor and LCD/touch-panel controllers that use legacy parallel RGB or SPI interfaces. Its 570-LE capacity allows pixel-data multiplexing, backlight PWM generation, and touch-event debouncing in a single device. The multi-volt I/O banks permit direct connection to both 1.8 V SoC pads and 3.3 V display-driver pads without level shifters, simplifying the BOM.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPM570T10015 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPM570GT100I5N | EPM570GT100C5N | EPM570F100I5N | EPM570F100C5N | EPM570GT100C5 | EPM570GT100I5 |
|---|---|---|---|---|---|---|---|
| Package | TQFP-100 (T100) 14 x 14 mm | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same | TQFP-100 (T100) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 570 |
| Speed Grade (tPD) | 15 ns | 5 ns (faster) | 5 ns (faster) | 5 ns (faster) | 5 ns (faster) | 5 ns (faster) | 5 ns (faster) |
| Operating Temperature Range | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) - same | 0 C to +85 C (commercial) | -40 C to +85 C (industrial) - same | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +85 C (industrial) - same |
| User I/O Pins | 76 | 76 | 76 | 76 | 76 | 76 | 76 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Device Family | MAX II | MAX II - same | MAX II - same | MAX II - same | MAX II - same | MAX II - same | MAX II - same |
Bảo phân biệt quan trọng
- Non-volatile instant-on configuration from on-chip flash (vsSRAM-based FPGAs (e.g. Cyclone, Spartan))
- Industrial temperature range in the same TQFP-100 footprint (vsEPM570GT100C5N (commercial temperature 0 to +85 C))
- Multi-volt I/O support on every pin (vsSingle-voltage glue-logic ICs (74-series))
Ghi chú thiết kế
Decouple every VCCINT pin with a 0.1 µF X5R/X7R ceramic capacitor placed within 5 mm of the package pad, and bulk-decouple each VCCIO bank with a 4.7 µF to 10 µF ceramic or low-ESR tantalum capacitor. MAX II devices have separate VCCINT and VCCIO rails - do not tie them together if the I/O bank must operate at a different voltage than the core. Estimate: total quiescent current is typically 5-10 mA for a fully-utilized EPM570 design; dynamic current scales with toggle rate per the Quartus PowerPlay analyzer.
TQFP-100 has 0.5 mm pitch leads - use 0.20 mm trace/space design rules with via-in-pad or microvia escape routing for breakout. Place the JTAG header (TCK/TMS/TDI/TDO plus GND) at the board edge for production programming access. The exposed thermal pad on TQFP-100 is not present on MAX II; only the standard ground pins are used for thermal dissipation. Keep high-speed traces away from the JTAG signals to avoid coupling during in-system programming.
Group I/O pins by bank voltage on the schematic before pin assignment in Quartus - mixing 1.8 V and 3.3 V signals on the same bank is not allowed on MAX II. Use Quartus pin-planner to lock each I/O bank to a single VCCIO rail. Leave at least one GND pin per I/O bank to provide a low-impedance return path; the TQFP-100 package has GND on pins 11, 28, 50, and 85 - place decoupling capacitors adjacent to each.
Do not assume the EPM570T10015 is pin-compatible with newer MAX V or MAX 10 CPLDs - those families use different pinout maps even at the same TQFP-100 package. Always re-validate the pin assignment file when migrating between MAX II, MAX V, and MAX 10. Also note that the 'T' suffix in EPM570T10015 indicates TQFP-100, not 'turbo' or 'high-speed'; the speed-grade number follows the package code (e.g. '15' = 15 ns tPD).
Thông tin tuân thủ
RoHS/REACH status not confirmed in the verified web data; lead-free ('N' suffix) variants EPM570GT100I5N, EPM570GT100C5N, EPM570F100I5N, EPM570F100C5N are explicitly lead-free per Altera/Intel marking convention, while EPM570GT100C5 and EPM570GT100I5 are non-N (Pb-containing) finishes. AEC-Q100 not applicable to CPLDs.
