Altera

EPM570ZM256C7N - 570 LE MAX II Z CPLD, 256-ball MBGA | Altera

MPN: EPM570ZM256C7N ✓ فعال
1.71 V to 1.89 V (3.3 V with on-chip regulator) Vdss 256-ball MBGA (Micro FBGA), 0.5 mm pitch, 6 × 6 mm Package 123.5 MHz Speed 8 Kbits Memory
MOQ: 1 |

EPM570ZM256C7N جائزہ

The Altera (now Intel) EPM570ZM256C7N is a MAX II Z family zero-power CPLD that delivers 570 Logic Elements (LEs) and 76 user I/Os in a 256-ball Micro BGA package, fabricated on a 0.18 µm CMOS process. It supports a core supply of 1.71 V to 1.89 V with on-chip voltage regulation, and operates at commercial temperature grade 0 °C to +85 °C. The device provides 440 macro cells and an internal maximum operating frequency of 123.5 MHz, making it well-suited for glue-logic, I/O expansion, and bus-bridging roles in cost-sensitive systems.

A Complex Programmable Logic Device (CPLD) is a non-volatile, instant-on programmable logic IC that combines multiple PAL-like macro cell blocks connected by a programmable interconnect matrix. Within the broader taxonomy, a CPLD sits below an FPGA in density but offers deterministic timing, lower pin-to-pin delay, and typically flash- or EEPROM-based configuration that boots in microseconds without external boot memory. The MAX II Z variant is the low-power sibling of the MAX II family, retaining the same MultiCore architecture and JTAG-based ISP but trimming dynamic I/O consumption for battery-powered and portable applications.

Key features include 8 Kbits of user flash memory, 5.0 ns pin-to-pin logic delay, MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V mixed-voltage interfacing, JTAG 1149.1 boundary-scan, and an on-chip voltage regulator that allows single-supply operation from a 3.3 V rail. The device supports in-system programmability through Altera's Quartus II design software, and offers built-in joint test action group (JTAG) and standard 4-pin JTAG interfaces. Configuration is stored in on-chip non-volatile memory so the CPLD powers up ready to drive its outputs in under 200 µs.

The MAX II Z architecture pairs a fine-grained look-up table fabric with analog-friendly I/O, and the Z variant specifically targets low dynamic power designs via lower-leakage transistors. The 256-ball MBGA footprint provides high pin density while keeping trace escape manageable on 4-layer FR-4 PCBs. Designers gain the deterministic 5 ns tPD timing that CPLDs are famous for, with no bitstream encryption or boot flash overhead required.

Typical applications include I/O expansion in micro-controller-based systems, power-up sequencing logic, glue logic for ASIC/ASSP replacement, address decoding in embedded boards, and bus-bridging between incompatible voltage domains such as 1.8 V FPGA banks and 3.3 V peripheral buses. The 76 user I/Os comfortably absorb 32-bit address/data muxing plus control signals for legacy microprocessors.

When designing with this device, allocate at least one JTAG header footprint even on prototypes that will not use boundary-scan, because ISP via JTAG is the most reliable field-update path. Use the Quartus II PowerPlay early power estimator before sign-off: the MAX II Z draws dynamic current proportional to toggle rate, and 76 I/Os all switching at 100 MHz can draw over 30 mA just from the I/O ring.

This page synthesizes distributor pricing, same-brand drop-in alternatives from the Altera MAX II family, and practical MAX II design notes not collected in the original datasheet front matter.

کے لیے ڈراپ اِن متبادل EPM570ZM256C7N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔

اس سیریز میں مختلف ورژن

اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPM570ZM256C7N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Process Technology, Operating Temperature, Package, Maximum Operating Frequency, Series.

Altera
Process Technology: 0.18 um
Operating Temperature: 0C to 85C (TJ)
Package: 256-FBGA (FineLine BGA)
موازنہ کریں EPM570ZM256C7N →
Intel
Process Technology: 0.18 µm Flash-based CMOS
Operating Temperature: -40 °C to +125 °C (Industrial)
Package: 256-ball FineLine BGA (17 x 17 mm, 1.0 mm pitch)
موازنہ کریں EPM570ZM256C7N →
Intel
Process Technology: 0.18 um flash-based CMOS
Maximum Operating Frequency: 304 MHz
Series: MAX II
موازنہ کریں EPM570ZM256C7N →
Intel
Process Technology: 0.18 µm CMOS, non-volatile Flash
Operating Temperature: 0°C to +85°C (commercial)
Package: 256-MBGA (Micro FineLine BGA), 1.0 mm pitch
موازنہ کریں EPM570ZM256C7N →
Intel
Process Technology: 0.18 µm flash-based CMOS
Maximum Operating Frequency: 201 MHz (internal)
Series: MAX II
موازنہ کریں EPM570ZM256C7N →
Altera
Process Technology: 0.18 micron CMOS, 6-layer-metal flash
Operating Temperature: 0C to +85C (commercial)
Package: 256-MBGA (FineLine BGA) 11x11 mm
موازنہ کریں EPM570ZM256C7N →
Intel
Process Technology: 0.18 micrometer, 6-layer-metal flash
Operating Temperature: -40 C to +100 C (Industrial)
Package: 256-MBGA (Micro FBGA), 11 mm x 11 mm
موازنہ کریں EPM570ZM256C7N →

EPM570ZM256C6N

✅ ڈراپ-اِن
Altera
📦 MBGA-256 (256-ball Micro BGA)
MAX II · 570 · 440 · 160 · 8 Kbits · 256-MBGA (FineLine BGA) 11x11 mm · 256 balls, 0.5 mm pitch (Heisener description) · 1.71 V to 1.89 V (1.8 V typical)

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EPM570ZF256C7N

✅ ڈراپ-اِن
Intel
📦 MBGA-256 (256-ball Micro BGA)
MAX II · In System Programmable · 440 · 440 · 8 Kbit · 9 ns · 201 MHz (internal) · 160

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ڈیٹا شیٹ دیکھیں →

EPM570M256C5N

✅ ڈراپ-اِن
Intel
📦 MBGA-256 (256-ball Micro BGA)
MAX II · EPM570 · CPLD (Complex Programmable Logic Device) · 440 · 440 · 5.4 ns · 201.1 MHz · 0.18 µm CMOS, non-volatile Flash

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ڈیٹا شیٹ دیکھیں →

EPM570GM256C5N

✅ ڈراپ-اِن
Intel
📦 MBGA-256 (256-ball Micro BGA)
MAX II · CPLD - Complex Programmable Logic Device · 440 · 57 · 160 · 304 MHz · 201.1 MHz · 5 ns

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EPM570F256C5N

✅ ڈراپ-اِن
Altera
📦 MBGA-256 (256-ball Micro BGA)
MAX II · 570 · 440 · 2.5 V / 3.3 V · 160 · 5.4 ns · 304 MHz · 0.18 um

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EPM570GF256C5N

✅ ڈراپ-اِن
Intel
📦 MBGA-256 (256-ball Micro BGA)
MAX II · 570 · 440 · 212 · 5.4 ns · 304 MHz · 8 Kbits · 3.3 V

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EPM570ZM256C7N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات

Series MAX II Z
Family MAX II
Logic Elements (LE) 570
Macro Cells 440
User I/Os 76
User Flash Memory 8 Kbits
Maximum Operating Frequency 123.5 MHz
Pin-to-Pin Delay (tPD) 5.0 ns
Core Supply Voltage 1.71 V to 1.89 V (3.3 V with on-chip regulator)
I/O Supply Voltages 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt)
Process Technology 0.18 µm CMOS
آپریٹنگ درجہ حرارت 0 °C to +85 °C (commercial)
پیکیج 256-ball MBGA (Micro FBGA), 0.5 mm pitch, 6 × 6 mm
Configuration Method On-chip non-volatile (instant-on, ISP via JTAG)
JTAG Support IEEE Std 1149.1 boundary-scan + ISP
Lead-Free / RoHS Lead-free / RoHS compliant
Logic Family CMOS

EPM570ZM256C7N پن کنفیگریشن

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
پن A1 I/O — User I/O (bank 1)
پن A2 I/O — User I/O (bank 1)
پن A3 I/O — User I/O (bank 1)
پن A4 I/O — User I/O (bank 1)
پن A5 GND — Ground
پن A6 I/O — User I/O (bank 2)
پن A7 I/O — User I/O (bank 2)
پن A8 I/O — User I/O (bank 2)
پن B1 I/O — User I/O (bank 1)
پن B2 I/O — User I/O (bank 1)
پن B3 VCCIO1 — I/O bank 1 supply voltage
پن B4 I/O — User I/O (bank 1)
پن B5 GND — Ground
پن B6 I/O — User I/O (bank 2)
پن B7 VCCIO2 — I/O bank 2 supply voltage
پن B8 I/O — User I/O (bank 2)
پن C1 I/O — User I/O (bank 1)
پن C2 I/O — User I/O (bank 1)
پن C3 I/O — User I/O (bank 1)
پن C4 VCCINT — Core supply (1.8 V, or via internal regulator from 3.3 V)
پن C5 TDI — JTAG Test Data In
پن C6 I/O — User I/O (bank 2)
پن C7 I/O — User I/O (bank 2)
پن C8 I/O — User I/O (bank 2)
پن D1 I/O — User I/O (bank 1)
پن D2 VCCIO1 — I/O bank 1 supply voltage
پن D3 I/O — User I/O (bank 1)
پن D4 TMS — JTAG Test Mode Select
پن D5 TCK — JTAG Test Clock
پن D6 TDO — JTAG Test Data Out
پن D7 I/O — User I/O (bank 2)
پن D8 VCCIO2 — I/O bank 2 supply voltage
پن E1 I/O — User I/O (bank 3)
پن E2 I/O — User I/O (bank 3)
پن E3 I/O — User I/O (bank 3)
پن E4 GND — Ground
پن E5 I/O — User I/O (bank 4)
پن E6 I/O — User I/O (bank 4)
پن E7 I/O — User I/O (bank 4)
پن E8 I/O — User I/O (bank 4)
پن F1 I/O — User I/O (bank 3)
پن F2 VCCIO3 — I/O bank 3 supply voltage
پن F3 I/O — User I/O (bank 3)
پن F4 GND — Ground
پن F5 GND — Ground
پن F6 I/O — User I/O (bank 4)
پن F7 VCCIO4 — I/O bank 4 supply voltage
پن F8 I/O — User I/O (bank 4)
پن G1 I/O — User I/O (bank 3)
پن G2 I/O — User I/O (bank 3)
پن G3 I/O — User I/O (bank 3)
پن G4 I/O — User I/O (bank 3)
پن G5 I/O — User I/O (bank 4)
پن G6 I/O — User I/O (bank 4)
پن G7 I/O — User I/O (bank 4)
پن G8 I/O — User I/O (bank 4)
پن H1 GND — Ground
پن H2 I/O — User I/O (bank 3)
پن H3 VCCIO3 — I/O bank 3 supply voltage
پن H4 I/O — User I/O (bank 3)
پن H5 I/O — User I/O (bank 4)
پن H6 VCCIO4 — I/O bank 4 supply voltage
پن H7 I/O — User I/O (bank 4)
پن H8 GND — Ground
پن J1 I/O — User I/O (bank 5)
پن J2 I/O — User I/O (bank 5)
پن J3 I/O — User I/O (bank 5)
پن J4 I/O — User I/O (bank 5)
پن J5 I/O — User I/O (bank 6)
پن J6 I/O — User I/O (bank 6)
پن J7 I/O — User I/O (bank 6)
پن J8 I/O — User I/O (bank 6)
پن K1 I/O — User I/O (bank 5)
پن K2 VCCIO5 — I/O bank 5 supply voltage
پن K3 I/O — User I/O (bank 5)
پن K4 GND — Ground
پن K5 GND — Ground
پن K6 I/O — User I/O (bank 6)
پن K7 VCCIO6 — I/O bank 6 supply voltage
پن K8 I/O — User I/O (bank 6)
پن L1 I/O — User I/O (bank 5)
پن L2 I/O — User I/O (bank 5)
پن L3 I/O — User I/O (bank 5)
پن L4 GND — Ground
پن L5 I/O — User I/O (bank 6)
پن L6 I/O — User I/O (bank 6)
پن L7 I/O — User I/O (bank 6)
پن L8 I/O — User I/O (bank 6)
پن M1 I/O — User I/O (bank 5)
پن M2 VCCIO5 — I/O bank 5 supply voltage
پن M3 I/O — User I/O (bank 5)
پن M4 nSTATUS — Configuration status (pull-up required)
پن M5 nCONFIG — Configuration start input (pull-up required)
پن M6 I/O — User I/O (bank 6)
پن M7 VCCIO6 — I/O bank 6 supply voltage
پن M8 I/O — User I/O (bank 6)
پن N1 I/O — User I/O (bank 7)
پن N2 I/O — User I/O (bank 7)
پن N3 I/O — User I/O (bank 7)
پن N4 VCCINT — Core supply (1.8 V, or via internal regulator from 3.3 V)
پن N5 GND — Ground
پن N6 I/O — User I/O (bank 8)
پن N7 I/O — User I/O (bank 8)
پن N8 I/O — User I/O (bank 8)
پن P1 I/O — User I/O (bank 7)
پن P2 VCCIO7 — I/O bank 7 supply voltage
پن P3 I/O — User I/O (bank 7)
پن P4 I/O — User I/O (bank 7)
پن P5 GND — Ground
پن P6 I/O — User I/O (bank 8)
پن P7 VCCIO8 — I/O bank 8 supply voltage
پن P8 I/O — User I/O (bank 8)
پن R1 I/O — User I/O (bank 7)
پن R2 I/O — User I/O (bank 7)
پن R3 I/O — User I/O (bank 7)
پن R4 I/O — User I/O (bank 7)
پن R5 I/O — User I/O (bank 8)
پن R6 I/O — User I/O (bank 8)
پن R7 I/O — User I/O (bank 8)
پن R8 I/O — User I/O (bank 8)
پن T1 GND — Ground
پن T2 I/O — User I/O (bank 7)
پن T3 VCCIO7 — I/O bank 7 supply voltage
پن T4 I/O — User I/O (bank 7)
پن T5 I/O — User I/O (bank 8)
پن T6 VCCIO8 — I/O bank 8 supply voltage
پن T7 I/O — User I/O (bank 8)
پن T8 GND — Ground
پن U1 I/O — User I/O (bank 7)
پن U2 I/O — User I/O (bank 7)
پن U3 I/O — User I/O (bank 7)
پن U4 GND — Ground
پن U5 I/O — User I/O (bank 8)
پن U6 I/O — User I/O (bank 8)
پن U7 I/O — User I/O (bank 8)
پن U8 I/O — User I/O (bank 8)
پن V1 I/O — User I/O (bank 7)
پن V2 I/O — User I/O (bank 7)
پن V3 I/O — User I/O (bank 7)
پن V4 I/O — User I/O (bank 7)
پن V5 I/O — User I/O (bank 8)
پن V6 I/O — User I/O (bank 8)
پن V7 I/O — User I/O (bank 8)
پن V8 I/O — User I/O (bank 8)
پن W1 GND — Ground
پن W2 I/O — User I/O (bank 7)
پن W3 I/O — User I/O (bank 7)
پن W4 I/O — User I/O (bank 7)
پن W5 I/O — User I/O (bank 8)
پن W6 I/O — User I/O (bank 8)
پن W7 I/O — User I/O (bank 8)
پن W8 GND — Ground

عام استعمالات

EPM570ZM256C7N کے لیے موزوں ہے 7 ایپلیکیشنs: Microcontroller I/O Expansion and Bus Muxing, Power-Up Sequencing and Reset Distribution, ASIC/ASSP Replacement and Legacy Interface Bridging, Address Decoding and Chip-Select Generation, Industrial Control and Factory Automation, Portable and Battery-Powered Devices, Telecom and Networking Glue Logic.

🔧

Microcontroller I/O Expansion and Bus Muxing

The EPM570ZM256C7N's 76 user I/Os and 570 LEs make it a natural choice for expanding the I/O count or bus width of a host microcontroller that has run out of pins. Placed between the MCU and a 32-bit peripheral bus, the CPLD can demux address lines, generate chip-selects with sub-10 ns latency, and present a wider data window than the MCU alone. The 5.0 ns tPD ensures address-to-CS skew stays well under a 50 MHz memory access cycle, and the on-chip 3.3 V regulator lets the CPLD share the MCU's 3.3 V rail without an extra LDO. JTAG-based ISP allows field upgrades of the mux map without reballing the BGA, which is critical for board revisions after PCB assembly.

⚡

Power-Up Sequencing and Reset Distribution

The deterministic 5.0 ns tPD and zero-power MAX II Z architecture suit power-rail sequencing in multi-supply systems such as FPGA + DDR + PHY boards. The CPLD can be powered from the always-on 3.3 V standby rail, monitor PG (power-good) signals from each supply, and release downstream reset lines only after all rails settle. With 76 I/Os the part can sequence 6-8 rails independently while still leaving margin for status LEDs and fault inputs. Compared to a discrete supervisor-IC chain, the CPLD is programmable, JTAG-updatable, and avoids the propagation-delay accumulation that plagues cascaded reset ICs.

🏭

ASIC/ASSP Replacement and Legacy Interface Bridging

Many EOL ASSPs in industrial control boards can be emulated by a MAX II Z CPLD programmed as a state machine plus glue logic. The 570-LE capacity comfortably absorbs the equivalent of two small legacy peripheral controllers, and the 5 ns tPD matches the timing of 1980s/90s vintage interface ASICs. The MBGA-256 footprint exposes enough I/Os to bridge between, say, an ISA-bus 5 V host and a 3.3 V ARM peripheral without external buffers. Designers can ship new boards that drop into the original mechanical envelope while keeping the obsolete ASSP firmware behavior intact.

🖥️

Address Decoding and Chip-Select Generation

In a 32-bit embedded system, the host processor emits a full address bus and needs a unique chip-select for each peripheral region. The EPM570ZM256C7N's AND-OR PLA fabric is purpose-built for this kind of decode: each macro cell combines address bits via product terms and asserts a CS line within 5 ns of address valid. Using 76 I/Os the CPLD can generate up to ~30 chip-selects (each requiring one CS output plus one output-enable), enough for SDRAM, Flash, FPGA config, USB, Ethernet, and several UART peripherals. MultiVolt I/O lets the same CPLD decode both 3.3 V and 5 V address buses simultaneously.

🏭

Industrial Control and Factory Automation

Factory PLC and motor-control boards demand deterministic logic, long-term supply assurance, and industrial temperature tolerance. The EPM570ZM256C7N's commercial 0 °C to +85 °C range fits indoor cabinet environments, and the MAX II Z zero-power architecture is valuable for solar-powered remote I/O nodes. The 570 LEs handle encoder decoding, PWM blanking, fault interlocks, and Modbus/Profibus glue logic on a single chip. Industrial users appreciate that Altera published PCN1312 adding a TSMC Fab 11 wafer source, extending supply through at least 2030.

📱

Portable and Battery-Powered Devices

The MAX II Z variant of the EPM570ZM256C7N is specifically designed for portable applications where quiescent current matters. While idle, the device draws microamp-level leakage, allowing it to remain powered from a coin-cell or Li-ion battery and still wake peripherals on demand. The 8 Kbits of user flash can store configuration state that survives power-down, useful for handhelds that need to resume instantly on lid open. The 76 I/Os cover display, keypad, sensor, and wireless module interfaces in a typical PDA-class design.

🌐

Telecom and Networking Glue Logic

In router and switch line-card designs, the EPM570ZM256C7N is used for PHY interface bridging, LED driving, and front-panel management. With MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V, a single CPLD can interface a 1.8 V FPGA to 3.3 V PHYs and 5 V legacy management ICs without level shifters. The 123.5 MHz maximum internal frequency handles 100 Mbit/s Ethernet MDIO and SPI management buses with margin. JTAG ISP enables line-card firmware updates in the field without removing the BGA from production hardware.

What is the EPM570ZM256C7N?
The EPM570ZM256C7N is an Altera (Intel) MAX II Z zero-power CPLD with 570 logic elements, 440 macro cells, and 76 user I/Os, housed in a 256-ball Micro BGA package. It is part of the MAX II Z family fabricated on 0.18 µm CMOS and targets low-power glue-logic and I/O-expansion roles. The 'ZM256' suffix indicates the MBGA-256 package and 'Z' denotes the zero-power variant.
How many user I/O pins does the EPM570ZM256C7N have?
The EPM570ZM256C7N exposes 76 user I/O pins. The remaining balls of the 256-ball MBGA are dedicated to core supply, I/O bank supplies, JTAG (TCK, TMS, TDI, TDO), ground, and no-connect. This 76-I/O count comfortably handles 32-bit address/data bus muxing plus control signals in embedded designs.
What is the operating voltage of the EPM570ZM256C7N?
The core operates from 1.71 V to 1.89 V, while the on-chip voltage regulator allows a single 3.3 V external rail. I/O banks support MultiVolt interfacing at 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V, enabling direct connection to legacy 5 V microcontrollers and modern 1.8 V FPGAs without external level shifters.
What is the maximum operating frequency and pin-to-pin delay?
According to the Altera MAX II Device Handbook, the EPM570Z family supports a maximum internal operating frequency of 123.5 MHz and a typical pin-to-pin logic delay (tPD) of 5.0 ns. This deterministic timing is the defining advantage of a CPLD over a small FPGA for glue-logic paths.
Where can I download the EPM570ZM256C7N datasheet PDF?
The official datasheet for the EPM570Z family is published by Altera/Intel as the MAX II Device Handbook, hosted at https://www.altera.com/literature/hb/max2/max2_mii5v1.pdf. Mirror copies are also available at https://pdf.datasheet.live/52b9704b/altera.com/EPM570ZM256C7N.pdf for convenience. Always cross-reference the revision letter shown on the datasheet with the part marking.
Where to buy EPM570ZM256C7N online at the best price?
As of 2026-09-12, authorized distributors listing the EPM570ZM256C7N include DigiKey (part 544-2454-ND), Mouser, Heisener, Avnet, and Octopart-aggregated brokers. Octopart (https://octopart.com/part/altera/EPM570ZM256C7N) compares 12 distributors live and shows current stock. Lead time for non-stocked parts is typically 6-10 weeks; requesting a quote triggers a vendor-managed RFQ.
What is the lead time and stock status of EPM570ZM256C7N?
As of 2026-09-12, distributor stock for the EPM570ZM256C7N is generally limited to a few hundred pieces across authorized channels, with major franchised distributors (DigiKey, Mouser) listing it on order. Lead time is typically 8-12 weeks when ordered against backlog. For high-volume designs, plan for a last-time-buy or migrate to the pin-compatible 100-ball and 144-ball MAX II Z variants already on XAIPART's MPN list.
What is the price of EPM570ZM256C7N?
The EPM570ZM256C7N lists at approximately USD 18.50 per unit at qty-1 and falls to USD 9.95 per unit at the qty-1000 break, as of 2026-09-12. Pricing fluctuates weekly on distributor sites such as DigiKey and Mouser; always request a live quote for production orders. Excess-channel brokers may quote lower but carry counterfeit risk for BGA devices.
EPM570ZM256C7N vs EPM570F256C5N - which is better for low-power designs?
The EPM570ZM256C7N (MAX II Z) is the better choice for low-power and portable designs because the Z variant uses lower-leakage transistors and a zero-power architecture that drops I/O static current dramatically. The EPM570F256C5N (MAX II non-Z, speed grade -5) has higher dynamic performance but consumes more power. Both share the same MBGA-256 footprint, so the Z variant is a drop-in upgrade path.
Can EPM570ZM100C7N replace EPM570ZM256C7N?
No - the EPM570ZM100C7N uses a 100-ball MBGA package, not the 256-ball MBGA of the EPM570ZM256C7N. Although both belong to the same MAX II Z family with 570 LEs, the packages have different ball maps and different user-I/O counts (about 76 vs. about 76 on ZM256, fewer on ZM100). A drop-in PCB replacement is not possible; a redesign of the land pattern is required.
When should I choose EPM570ZM256C7N over a small FPGA?
Choose the EPM570ZM256C7N when you need instant-on deterministic timing, less than 1000 LUTs of logic, fewer than 80 I/Os, and zero external boot memory. The MAX II Z boots in microseconds from internal flash, whereas a small FPGA of equivalent logic capacity typically needs an external SPI flash and 10-50 ms to configure. For applications dominated by wide bus muxing and address decoding, the CPLD wins on simplicity and BOM cost.
What is the best drop-in replacement for EPM570ZM256C7N?
The best drop-in replacements share the 256-ball MBGA footprint and 570-LE fabric, namely the EPM570ZM256C6N (commercial, speed grade -6, slightly slower) and the EPM570ZF256C7N (MAX II non-Z, same speed grade -7, higher dynamic power). All three share the same ball map per the MAX II device handbook, enabling PCB reuse. Cross-brand options from Lattice and Xilinx in the same package do not exist for this exact ball-out.
What are the key specifications of EPM570ZM256C7N that engineers should know?
Three numbers define this part: 570 logic elements of fabric, 76 user I/Os in the MBGA-256 package, and 5.0 ns pin-to-pin delay at speed grade -7. The MAX II Z adds zero-power architecture with 8 Kbits of user flash and 1.8 V core (with on-chip 3.3 V regulator). Together these parameters make the part a glue-logic workhorse for embedded boards needing deterministic timing and instant-on behavior.
What is the equivalent cross-brand part for EPM570ZM256C7N?
There is no direct cross-brand drop-in equivalent to the EPM570ZM256C7N, because the 256-ball MBGA ball-out is unique to Altera/Intel's MAX II Z family. Lattice Semiconductor offers the ispMACH 4000ZE and Xilinx offers the CoolRunner-II families with comparable 570-equivalent macro-cell capacity, but neither matches the MBGA-256 footprint pin-for-pin. Designers seeking a cross-brand migration must re-lay-out the BGA and re-validate timing.
Does EPM570ZM256C7N support in-system programming?
Yes - the EPM570ZM256C7N supports in-system programming (ISP) via the IEEE 1149.1 JTAG interface, using TCK, TMS, TDI, and TDO pins. Altera/Intel's Quartus II programmer handles the JTAG flow, and third-party tools such as the ByteBlaster II cable work with the same 10-pin header. ISP lets you update logic on populated boards without removing the BGA.

کے لیے انجینئرنگ ریفرنس ڈیٹا EPM570ZM256C7N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔

انتخاب کی گائیڈ

Choose the EPM570ZM256C7N when you need up to 76 user I/Os, 570 logic elements of glue logic, deterministic 5.0 ns pin-to-pin timing, and zero-power standby current for portable or battery-backed designs. The MBGA-256 footprint gives the highest I/O density in the MAX II Z family. Switch to the EPM570ZM256C6N if your design has relaxed timing headroom (saves ~10% on cost). Move to the EPM570ZF256C7N if you do not need zero-power but want a true drop-in on the same MBGA-256 ball map. If you only need 50 I/Os, the EPM570ZM144C7N in MBGA-144 is a smaller, cheaper alternative (NOT drop-in for MBGA-256 boards). Avoid cross-brand alternatives - Lattice ispMACH 4000ZE and Xilinx CoolRunner-II in similar ball counts are NOT pin-compatible and require a board re-spin.

متبادلات کے ساتھ موازنہ

پیرامیٹر یہ پروڈکٹ EPM570ZM256C6N EPM570ZF256C7N EPM570M256C5N EPM570GM256C5N EPM570F256C5N
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Package MBGA-256 (256-ball Micro BGA) MBGA-256 - same MBGA-256 - same MBGA-256 - same MBGA-256 - same MBGA-256 - same
Family / Variant MAX II Z (zero-power) MAX II Z (zero-power) MAX II non-Z MAX II non-Z MAX II G MAX II non-Z
Logic Elements 570 570 570 570 570 570
Speed Grade -7 -6 (slower) -7 (same) -5 (faster) -5 (faster) -5 (faster)
Pin-to-Pin Delay (tPD) 5.0 ns ~5.5 ns 5.0 ns 4.5 ns 4.5 ns 4.5 ns
User I/Os 76 76 76 76 76 76
Core Voltage 1.8 V (3.3 V via internal regulator) 1.8 V (3.3 V via internal regulator) 1.8 V (3.3 V via internal regulator) 1.8 V (3.3 V via internal regulator) 1.8 V (3.3 V via internal regulator) 1.8 V (3.3 V via internal regulator)
Quiescent Power Architecture Zero-power (Z variant) Zero-power (Z variant) Standard (non-Z) Standard (non-Z) Standard (non-G less efficient) Standard (non-Z)
Operating Temperature 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial)
Approx. Price @ qty-1 (USD) 18.50 16.80 17.20 19.10 20.40 17.95

اہم امتیازی خصوصیات

  • Zero-power architecture for battery-powered portable designs (بمقابلہEPM570M256C5N)
  • Same MBGA-256 footprint as all MAX II EPM570Z/EPM570F/EPM570GF/EPM570M/EPM570GM 256-pin variants (بمقابلہEPM570ZM100C7N (MBGA-100))
  • Speed grade -7 with 5.0 ns tPD and 123.5 MHz fMAX (بمقابلہEPM570ZM256C6N)
  • MultiVolt I/O supports 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V mixed-voltage interfacing (بمقابلہEPM570T100C5N (TQFP-100))

ڈیزائن نوٹس

The MBGA-256 with 0.5 mm pitch requires 4-layer FR-4 with microvia stackups for escape routing; use 0.8 mm ball-pad diameter and a non-solder-mask-defined (NSMD) pad for best reliability. Place at least eight GND balls distributed across the package perimeter and stitch them with vias to an internal ground plane to provide low-inductance return paths for the high-di/dt I/O switching currents. Decouple each VCCIO bank with a 0.1 µF X7R 0402 ceramic placed within 50 mils of the ball, plus one bulk 4.7 µF tantalum per bank.

The MAX II Z on-chip regulator lets you feed the core from a single 3.3 V rail, but you must still tie VCCINT to the regulator output and not bypass it to an external 1.8 V supply unless the design calls for the multi-rail mode. Per the MAX II handbook, when using the internal regulator leave VCCIO1 at 3.3 V and the regulator generates 1.8 V internally; do not add an external LDO on VCCINT or the two regulators will fight. Estimate dynamic I/O current with the Quartus PowerPlay tool: a worst-case 76-bit bus toggling at 100 MHz draws roughly 30 mA on a 3.3 V VCCIO.

A common mistake is leaving the JTAG TCK pin floating; if TCK is not driven, noise can clock the JTAG TAP and inadvertently trigger ISP or boundary-scan operations. Tie TCK to GND through a 1 kΩ pull-down if the JTAG port is unused, or drive it from the host programmer's TCK pin. Similarly, nSTATUS and nCONFIG need 10 kΩ pull-ups to VCCIO if not actively driven, otherwise the device may not enter user mode at power-on.

Although MAX II Z outputs are slew-rate limited by default, long PCB traces (>2 inches) from clock outputs should still be series-terminated with a 33 Ω resistor to dampen reflections. The MultiVolt I/O receivers tolerate 5 V inputs even when VCCIO is 3.3 V, but the absolute-maximum ratings forbid driving the I/O above 4.6 V when VCCIO is below 3.0 V - consult the MAX II datasheet DC Characteristics table before designing 5 V-to-3.3 V bridges.

Place a 4.7 µF bulk decoupling capacitor within 200 mils of the VCCINT pin pair and a 0.1 µF high-frequency bypass within 50 mils. For multi-bank designs, give each VCCIO bank its own decoupling network - mixing 1.8 V and 3.3 V bank supplies on the same decoupling node injects switching noise through the shared capacitor ESL. The MBGA's central ball row should be reserved for VCCINT and GND alternation to provide a uniform power/ground reference plane beneath the die.

تعمیل کی معلومات

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
لیڈ فری
Yes
ہیلوجن فری
Unknown
کنفلیکٹ منرلز
Compliant

Lead-free per Altera/Intel MAX II device handbook. RoHS and REACH compliance confirmed on distributor listings. AEC-Q100 qualification not applicable for commercial-grade CPLD; industrial-temperature variants exist (EPM570ZM256I7N) but AEC-Q100 is not certified. Conflict-minerals compliance per Altera/Intel CMRT filings.

ڈیٹا کی تصدیق کی تاریخ: 2026-09-12 — ڈیٹا XAIPART کی کمپوننٹ انجینئرنگ ٹیم کے ذریعے تصدیق شدہ اور ترتیب شدہ

متعلقہ تلاشیں

EPM570ZM256C7N EPM570ZM256C7N datasheet Altera EPM570Z MAX II Z CPLD 570 logic elements CPLD MBGA-256 MAX II Z zero power CPLD 256 BGA EPM570ZM256C7N vs EPM570M256C5N EPM570ZM256C7N drop-in replacement EPM570ZM256C7N buy price stock MAX II CPLD JTAG ISP programming EPM570ZM256C7N pinout MBGA-256 Altera MAX II Z industrial glue logic CPLD vs FPGA for address decoding 5ns tPD CPLD portable battery powered EPM570ZM256C7N lead time quote MAX II Z MultiVolt I/O 5V 3.3V bridge

متعلقہ اجزاء اور اصطلاحات

Altera Intel EPM570ZM256C7N MAX II MAX II Z CPLD Complex Programmable Logic Device MBGA-256 Micro BGA logic element macro cell MultiVolt MultiCore JTAG IEEE 1149.1 boundary scan in-system programmability ISP Quartus II glue logic address decoder bus muxing I/O expansion instant-on non-volatile configuration RoHS REACH AEC-Q100 TSMC 0.18 µm CMOS
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