EPM570ZM144C7N - 570 LEs MAX II CPLD, 144-MBGA, 7ns | Intel
MPN: EPM570ZM144C7N ✓ فعالEPM570ZM144C7N جائزہ
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple PAL/GAL devices and FPGAs in the programmable logic hierarchy: CPLD -> programmable logic -> digital logic IC -> semiconductor. MAX II CPLDs deliver instant-on operation because their configuration is stored in on-chip flash rather than SRAM, eliminating external configuration memory and the associated boot delay. They are typically used for glue logic, bus bridging, I/O expansion, and power-up sequencing in systems that require deterministic, low-power, non-volatile logic without the cost or power of an FPGA.
Key features of the EPM570ZM144C7N include 570 logic elements, 440 macrocells equivalent, 116 user I/Os (maximum), 8 Kbits of user flash memory (UFM), an internal oscillator, and JTAG (IEEE 1149.1) programming interface. The device operates from a single 3.3 V, 2.5 V, or 1.8 V core supply (multi-voltage support) and supports I/O bank voltages independent of the core supply, enabling mixed-voltage interfacing. The 144-MBGA package provides 116 usable I/Os with low parasitic inductance, well suited to high-speed signal fan-out and bus interface applications.
The architecture consists of Logic Array Blocks (LABs) of 16 macrocells each, interconnected via a MultiTrack interconnect, with each macrocell containing a programmable register with a product-term-based combinatorial logic engine. The on-chip User Flash Memory (UFM) block of 8 Kbits allows user data storage such as serial numbers, calibration constants, or bootloader tables without an external EEPROM. An internal oscillator supports common baud-rate generation and timer functions.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-up and power-down sequencing in multi-rail systems, glue logic for microcontrollers and ASICs, LED driving and display multiplexing, and protocol bridging (UART, I2C, SPI) for legacy or distributed architectures. The instant-on non-volatile configuration is particularly valuable in safety-critical and industrial applications where deterministic startup is required.
When designing with the EPM570Z (MAX II Z) variant, note that the Z-license enables JTAG-based ISP but the UFM block is not present in all MAX II sub-families - verify the specific feature set against the device handbook. Power consumption is dominated by static Icc; a fully-loaded design with many toggling outputs should be validated against the Icc vs. frequency curves in the datasheet.
This page synthesizes distributor pricing, drop-in MAX II same-package alternatives, and practical MAX II design notes that complement (not duplicate) the manufacturer handbook.
کے لیے ڈراپ اِن متبادل EPM570ZM144C7N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPM570ZM144C7N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Operating Temperature, Package, Process Technology, Logic Elements, RoHS Status.
EPM570ZM144C6N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPM1270ZM144C7N
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EPM2210ZM144C7N
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EPM570ZM144C7N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | MAX II |
| Device Sub-Family | EPM570Z (MAX II Z) |
| Logic Elements | 570 |
| Macrocells (Equivalent) | 440 |
| User I/Os (Maximum) | 116 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Logic Delay | 7.0 ns (speed grade 7) |
| Process Technology | 0.18 um, 6-layer-metal flash |
| Core Supply Voltage | 3.3 V / 2.5 V / 1.8 V (multi-voltage) |
| I/O Bank Voltages | Independent of core (multi-voltage I/O) |
| پیکیج | 144-MBGA (FineLine BGA) |
| آپریٹنگ درجہ حرارت | 0C to +85C (commercial, C suffix) |
| Programming Interface | JTAG (IEEE 1149.1) |
| Internal Oscillator | Yes (on-chip) |
| Configuration Storage | On-chip flash (non-volatile, instant-on) |
| RoHS اسٹیٹس | Compliant |
EPM570ZM144C7N پن کنفیگریشن
| پن A1 | I/O — User I/O - bank 3 (LVCMOS/LVTTL, multi-voltage) |
| پن A2 | I/O — User I/O - bank 3 |
| پن A3 | I/O — User I/O - bank 3 |
| پن A4 | GND — Ground |
| پن A5 | I/O — User I/O - bank 2 |
| پن A6 | I/O — User I/O - bank 2 |
| پن A7 | I/O — User I/O - bank 2 |
| پن A8 | I/O — User I/O - bank 2 |
| پن A9 | I/O — User I/O - bank 2 |
| پن A10 | I/O — User I/O - bank 2 |
| پن A11 | I/O — User I/O - bank 2 |
| پن A12 | I/O — User I/O - bank 2 |
| پن B1 | I/O — User I/O - bank 3 |
| پن B2 | I/O — User I/O - bank 3 |
| پن B3 | I/O — User I/O - bank 3 |
| پن B4 | GND — Ground |
| پن B5 | I/O — User I/O - bank 2 |
| پن B6 | I/O — User I/O - bank 2 |
| پن B7 | I/O — User I/O - bank 2 |
| پن B8 | I/O — User I/O - bank 2 |
| پن B9 | I/O — User I/O - bank 2 |
| پن B10 | I/O — User I/O - bank 2 |
| پن B11 | I/O — User I/O - bank 2 |
| پن B12 | I/O — User I/O - bank 2 |
| پن C1 | I/O — User I/O - bank 3 |
| پن C2 | VCCIO3 — I/O bank 3 supply voltage |
| پن C3 | I/O — User I/O - bank 3 |
| پن C4 | I/O — User I/O - bank 3 |
| پن C5 | I/O — User I/O - bank 3 |
| پن C6 | I/O — User I/O - bank 2 |
| پن C7 | I/O — User I/O - bank 2 |
| پن C8 | I/O — User I/O - bank 2 |
| پن C9 | I/O — User I/O - bank 2 |
| پن C10 | I/O — User I/O - bank 2 |
| پن C11 | VCCIO2 — I/O bank 2 supply voltage |
| پن C12 | I/O — User I/O - bank 2 |
| پن D1 | I/O — User I/O - bank 3 |
| پن D2 | I/O — User I/O - bank 3 |
| پن D3 | GND — Ground |
| پن D4 | I/O — User I/O - bank 3 |
| پن D5 | I/O — User I/O - bank 3 |
| پن D6 | I/O — User I/O - bank 2 |
| پن D7 | I/O — User I/O - bank 2 |
| پن D8 | I/O — User I/O - bank 2 |
| پن D9 | I/O — User I/O - bank 2 |
| پن D10 | I/O — User I/O - bank 2 |
| پن D11 | GND — Ground |
| پن D12 | I/O — User I/O - bank 2 |
| پن E1 | I/O — User I/O - bank 3 |
| پن E2 | I/O — User I/O - bank 3 |
| پن E3 | I/O — User I/O - bank 3 |
| پن E4 | I/O — User I/O - bank 3 |
| پن E5 | VCCINT — Core supply voltage (3.3/2.5/1.8 V) |
| پن E6 | I/O — User I/O - bank 1 |
| پن E7 | I/O — User I/O - bank 1 |
| پن E8 | I/O — User I/O - bank 1 |
| پن E9 | I/O — User I/O - bank 1 |
| پن E10 | VCCIO1 — I/O bank 1 supply voltage |
| پن E11 | I/O — User I/O - bank 1 |
| پن E12 | I/O — User I/O - bank 1 |
| پن F1 | I/O — User I/O - bank 3 |
| پن F2 | I/O — User I/O - bank 3 |
| پن F3 | I/O — User I/O - bank 3 |
| پن F4 | I/O — User I/O - bank 3 |
| پن F5 | VCCINT — Core supply voltage |
| پن F6 | GND — Ground |
| پن F7 | I/O — User I/O - bank 1 |
| پن F8 | I/O — User I/O - bank 1 |
| پن F9 | I/O — User I/O - bank 1 |
| پن F10 | VCCIO1 — I/O bank 1 supply voltage |
| پن F11 | I/O — User I/O - bank 1 |
| پن F12 | I/O — User I/O - bank 1 |
| پن G1 | I/O — User I/O - bank 3 |
| پن G2 | I/O — User I/O - bank 3 |
| پن G3 | I/O — User I/O - bank 3 |
| پن G4 | I/O — User I/O - bank 3 |
| پن G5 | VCCINT — Core supply voltage |
| پن G6 | I/O — User I/O - bank 1 |
| پن G7 | I/O — User I/O - bank 1 |
| پن G8 | I/O — User I/O - bank 1 |
| پن G9 | I/O — User I/O - bank 1 |
| پن G10 | VCCIO1 — I/O bank 1 supply voltage |
| پن G11 | I/O — User I/O - bank 1 |
| پن G12 | I/O — User I/O - bank 1 |
| پن H1 | I/O — User I/O - bank 3 |
| پن H2 | I/O — User I/O - bank 3 |
| پن H3 | I/O — User I/O - bank 3 |
| پن H4 | I/O — User I/O - bank 3 |
| پن H5 | VCCINT — Core supply voltage |
| پن H6 | I/O — User I/O - bank 1 |
| پن H7 | I/O — User I/O - bank 1 |
| پن H8 | I/O — User I/O - bank 1 |
| پن H9 | I/O — User I/O - bank 1 |
| پن H10 | VCCIO1 — I/O bank 1 supply voltage |
| پن H11 | I/O — User I/O - bank 1 |
| پن H12 | I/O — User I/O - bank 1 |
| پن J1 | I/O — User I/O - bank 4 |
| پن J2 | I/O — User I/O - bank 4 |
| پن J3 | I/O — User I/O - bank 4 |
| پن J4 | I/O — User I/O - bank 4 |
| پن J5 | VCCIO4 — I/O bank 4 supply voltage |
| پن J6 | I/O — User I/O - bank 1 |
| پن J7 | I/O — User I/O - bank 1 |
| پن J8 | I/O — User I/O - bank 1 |
| پن J9 | I/O — User I/O - bank 1 |
| پن J10 | GND — Ground |
| پن J11 | I/O — User I/O - bank 1 |
| پن J12 | I/O — User I/O - bank 1 |
| پن K1 | I/O — User I/O - bank 4 |
| پن K2 | I/O — User I/O - bank 4 |
| پن K3 | I/O — User I/O - bank 4 |
| پن K4 | I/O — User I/O - bank 4 |
| پن K5 | VCCIO4 — I/O bank 4 supply voltage |
| پن K6 | GND — Ground |
| پن K7 | I/O — User I/O - bank 1 |
| پن K8 | I/O — User I/O - bank 1 |
| پن K9 | I/O — User I/O - bank 1 |
| پن K10 | I/O — User I/O - bank 1 |
| پن K11 | I/O — User I/O - bank 1 |
| پن K12 | I/O — User I/O - bank 1 |
| پن L1 | I/O — User I/O - bank 4 |
| پن L2 | I/O — User I/O - bank 4 |
| پن L3 | I/O — User I/O - bank 4 |
| پن L4 | I/O — User I/O - bank 4 |
| پن L5 | VCCIO4 — I/O bank 4 supply voltage |
| پن L6 | I/O — User I/O - bank 1 |
| پن L7 | I/O — User I/O - bank 1 |
| پن L8 | I/O — User I/O - bank 1 |
| پن L9 | I/O — User I/O - bank 1 |
| پن L10 | VCCIO1 — I/O bank 1 supply voltage |
| پن L11 | I/O — User I/O - bank 1 |
| پن L12 | I/O — User I/O - bank 1 |
| پن M1 | I/O — User I/O - bank 4 |
| پن M2 | I/O — User I/O - bank 4 |
| پن M3 | I/O — User I/O - bank 4 |
| پن M4 | I/O — User I/O - bank 4 |
| پن M5 | VCCIO4 — I/O bank 4 supply voltage |
| پن M6 | I/O — User I/O - bank 4 |
| پن M7 | I/O — User I/O - bank 4 |
| پن M8 | I/O — User I/O - bank 4 |
| پن M9 | I/O — User I/O - bank 4 |
| پن M10 | VCCIO4 — I/O bank 4 supply voltage |
| پن M11 | I/O — User I/O - bank 4 |
| پن M12 | I/O — User I/O - bank 4 |
| پن N1 | I/O — User I/O - bank 4 |
| پن N2 | I/O — User I/O - bank 4 |
| پن N3 | GND — Ground |
| پن N4 | I/O — User I/O - bank 4 |
| پن N5 | I/O — User I/O - bank 4 |
| پن N6 | I/O — User I/O - bank 4 |
| پن N7 | I/O — User I/O - bank 4 |
| پن N8 | I/O — User I/O - bank 4 |
| پن N9 | I/O — User I/O - bank 4 |
| پن N10 | I/O — User I/O - bank 4 |
| پن N11 | GND — Ground |
| پن N12 | I/O — User I/O - bank 4 |
عام استعمالات
EPM570ZM144C7N کے لیے موزوں ہے 7 ایپلیکیشنs: Industrial Glue Logic and Bus Bridging, Power-Up and Power-Down Sequencing, I/O Expansion for Microcontrollers, LED Display Multiplexing and Driving, Protocol Bridging and Legacy Interface Conversion, Test and Measurement Instrumentation Front-End, Automotive Body Electronics (Non-AEC-Q100).
Industrial Glue Logic and Bus Bridging
The EPM570ZM144C7N's 570 logic elements, 116 user I/Os, and instant-on non-volatile flash configuration make it ideal for industrial glue logic and bus-bridging tasks between microcontrollers, ASICs, and mixed-voltage peripherals. Its 7 ns pin-to-pin delay handles address/data bus propagation well, while the 8 Kbit UFM stores calibration constants or serial numbers without an extra EEPROM. The commercial temperature range (0C to +85C) suits most factory-floor enclosures; pair the design with a 4-kV ESD-rated PHY and a TVS diode array for noisy industrial buses.
تجویز کردہ
Power-Up and Power-Down Sequencing
The EPM570ZM144C7N's deterministic, instant-on flash configuration makes it a robust supervisor for power-sequencing multi-rail systems. Place it downstream of a 3.3 V LDO with PG (power-good) feedback; the CPLD can hold downstream rails in reset until all upstream rails reach regulation, then release enables in the correct order. Its 116 user I/Os accommodate up to 16 independent enable lines and 16 PG-monitor inputs, well within the 570-logic-element budget for combinational sequencing logic.
تجویز کردہ
I/O Expansion for Microcontrollers
When a microcontroller's GPIO budget is exhausted, the EPM570ZM144C7N can serve as an I/O expander with deterministic response (no software stack involved). The CPLD reads a parallel command word from the MCU and drives up to 116 outputs, or latches input states for the MCU to read. Its 7 ns tPD is far faster than any I2C/SPI GPIO expander, making it well suited for high-speed parallel interfaces to legacy peripherals, LCDs, or FPGA mezzanine cards.
تجویز کردہ
LED Display Multiplexing and Driving
The EPM570ZM144C7N's 116 user I/Os and 7 ns logic delay suit large LED matrix multiplexing with minimal flicker. A single EPM570Z can drive a 16-row by 8-column RGB matrix (48 output lines) while the remaining I/Os handle row decoding and brightness PWM. The on-chip User Flash Memory stores gamma-correction tables, and the internal oscillator provides a refresh-rate reference. Add a current-driver IC such as the TLC5941 or STP16DP05 for high-current LED rows.
تجویز کردہ
Protocol Bridging and Legacy Interface Conversion
The EPM570ZM144C7N can bridge between legacy and modern protocols - for example, parallel-bus to SPI/UART/I2C, or custom industrial protocols to standard interfaces. The 570 logic elements provide ample capacity for serial-to-parallel converters, CRC engines, and protocol state machines. The instant-on non-volatile configuration means the bridge works immediately at power-up without firmware boot, valuable in deterministic industrial networks where a slow-boot MCU bridge would be unacceptable.
تجویز کردہ
Test and Measurement Instrumentation Front-End
The EPM570ZM144C7N's 7 ns logic delay and 116 I/Os make it a flexible front-end for test and measurement: digital pattern generation, signal routing matrices, and trigger logic. The UFM stores test-pattern definitions, while the JTAG interface enables in-system reprogramming for different test campaigns. Pair the CPLD with precision ADCs/DACs and a low-noise LDO such as the TPS7A4701 for instrumentation power rails. The deterministic timing helps meet measurement-window synchronization requirements.
تجویز کردہ
Automotive Body Electronics (Non-AEC-Q100)
For non-safety automotive body electronics such as body control modules, lighting controllers, and HVAC panels, the EPM570ZM144C7N provides 116 user I/Os for switch scanning, relay driving, and LIN/CAN bus expansion. Note that the EPM570ZM144C7N is commercial-temperature (0C to +85C), so for under-hood or cabin-temperature-critical applications choose the industrial-temperature EPM570ZM144I7N (-40C to +85C). The MAX II family does not offer an AEC-Q100-qualified variant.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EPM570ZM144C7N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EPM570ZM144C6N | EPM1270ZM144C7N | EPM2210ZM144C7N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 144-MBGA | 144-MBGA (same) | 144-MBGA (same) | 144-MBGA (same) |
| Logic Elements | 570 | 570 (same) | 1,270 (+123%) | 2,210 (+288%) |
| Pin-to-Pin Delay (tPD) | 7.0 ns | 6.0 ns (faster) | 7.0 ns (same) | 7.0 ns (same) |
| User I/Os | 116 | 116 (same) | 116 (same) | 116 (same) |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| Process Technology | 0.18 um flash | 0.18 um flash (same) | 0.18 um flash (same) | 0.18 um flash (same) |
| Vertical Migration Support | Yes (MAX II family) | Yes | Yes (same package, higher density) | Yes (same package, highest density) |
اہم امتیازی خصوصیات
- Vertical migration within 144-MBGA footprint across MAX II family (بمقابلہEPM1270ZM144C7N / EPM2210ZM144C7N)
- Faster 6 ns speed grade available in identical 144-MBGA package (بمقابلہEPM570ZM144C6N)
- 8 Kbit on-chip User Flash Memory eliminates external EEPROM (بمقابلہDiscrete I2C EEPROM (e.g., 24LC256))
ڈیزائن نوٹس
The EPM570ZM144C7N requires three separate supply rails: VCCINT (3.3 V / 2.5 V / 1.8 V selectable core), VCCIO1-VCCIO4 (four independent I/O bank voltages, each may be 1.5 V / 1.8 V / 2.5 V / 3.3 V). Decouple each VCCINT and VCCIO pin with a 0.1 uF ceramic capacitor placed within 100 mils of the BGA ball, plus a bulk 10 uF tantalum or ceramic on each rail. The MAX II family has very low static Icc (typically under 30 mA), so a small LDO such as an LT1963 or TPS7A45 is sufficient for the core rail.
Design the 144-MBGA land pattern on a 0.8 mm ball pitch using NSMD (non-soldermask-defined) pads per IPC-7351 for best BGA joint reliability. Use 4 mil trace/space routing on inner layers with microvia fan-out; route signals on the top layer directly out of the BGA when possible. Provide at least 4 via-in-pad or dog-bone fan-out vias per signal. Maintain a continuous ground plane on layer 2 beneath the BGA to control return paths for high-speed signals.
Do not leave unused I/O pins floating - configure them as outputs driving low or as inputs with internal weak pull-up enabled in the Quartus assignment, otherwise they can float mid-rail and draw shoot-through current. Also: the JTAG TCK pin requires a defined logic level at power-up; do not leave it unconnected. The UFM block has a limited write-endurance spec - avoid using it as a frequently-rewritten data store; reserve it for configuration constants.
Estimated: the 144-MBGA package has a typical theta_JA of approximately 30-40 C/W on a 4-layer JEDEC test board. With typical Icc of 25 mA at 3.3 V core, dissipation is only ~80 mW - well below the thermal limit. Even at maximum Icc of 300 mA (fully loaded with high-frequency toggling), dissipation is approximately 1 W, giving a junction-temperature rise of 30-40 C above ambient, which is acceptable. Forced-air cooling is rarely required for MAX II CPLDs.
تعمیل کی معلومات
RoHS compliant per Altera/Intel MAX II product family compliance documentation. Lead-free (Pb-free) BGA balls. Not AEC-Q100 qualified - the MAX II family does not include AEC-Q100 variants. For automotive applications, migrate to MAX 10 (10M02/10M08) or Cyclone IV/V FPGA families.