M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
MPN: M1AFS250-2FGG256I ✓ فعالM1AFS250-2FGG256I جائزہ
A Fusion FPGA is a type of field-programmable gate array that integrates programmable logic, flash configuration memory, and analog mixed-signal peripherals on a single die. Within the programmable logic hierarchy (FPGA -> programmable logic device -> programmable semiconductor), the Fusion family is distinctive because it adds analog-to-digital conversion, voltage/temperature monitoring, and power-management functionality alongside the fabric and the ARM Cortex-M1 soft-to-hard MCU integration, enabling true single-chip system solutions.
Key features include nonvolatile Flash configuration that retains the program when powered off, Live-at-Power-Up (LAPU) operation so the device is functional as soon as system power is applied within normal operating specifications, and integrated security: a 128-bit flash-based lock and industry-leading AES decryption to protect programmed IP and configuration data. The -2 speed grade and industrial (I) temperature grade make the device suited to harsh-environment embedded control.
Technical depth: because configuration storage is Flash rather than SRAM, no external configuration PROM is required, reducing board area and BOM cost while improving configuration-data security. The embedded ARM Cortex-M1 processor allows firmware plus programmable logic in one chip, and the analog subsystem (ADC, monitoring blocks) eliminates external supervisory components in many designs.
Typical applications include industrial automation and motor-control interfaces, power-supply and system monitoring, portable and low-power instrumentation, and embedded controllers that combine an MCU with glue logic and analog sensing.
Design consideration: verify I/O bank voltage assignments and analog pin usage early in the FGG256 footprint layout, since mixed-signal pin multiplexing constrains placement more than a pure-digital FPGA.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
کے لیے ڈراپ اِن متبادل M1AFS250-2FGG256I — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں M1AFS250-2FGG256I (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Family, RoHS Status, System Gates, Configuration Memory.
M1AFS250-2FG256
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →M1AFS250-1FGG256
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →M1AFS600-FG256
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →M1AFS600-1FG256
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →M1AFS250-2FGG256I زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | Actel Fusion (Mixed-Signal FPGA) |
| System Gates | 250000 gates |
| Registers (DFFs) | 36864 |
| User I/Os | 114 |
| Embedded Processor | ARM Cortex-M1 |
| Configuration Technology | Flash-based, nonvolatile |
| Process Technology | 130 nm, 7-layer metal CMOS |
| System Performance | Up to 350 MHz |
| Speed Grade | -2 |
| Core Supply Voltage | 1.5 V |
| پیکیج | 256-ball FBGA (FGG256) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| آپریٹنگ درجہ حرارت | -40C to +85C (industrial, I grade) |
| Security | 128-bit Flash lock, AES decryption |
| Power-Up Behavior | Live at Power-Up (LAPU) |
| RoHS اسٹیٹس | Compliant (FGG = Pb-free balls) |
M1AFS250-2FGG256I 256-ball fbga (fgg256) پن کنفیگریشن گائیڈ
M1AFS250-2FGG256I (256-ball fbga (fgg256) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں M1AFS250-2FGG256I.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
M1AFS250-2FGG256I کے لیے موزوں ہے 6 ایپلیکیشنs: Industrial Automation and Control, Power Supply and System Monitoring, Secure Embedded Controllers, Portable and Low-Power Instrumentation, Motor Drive and Motion Control, Test and Measurement Equipment.
Industrial Automation and Control
The M1AFS250-2FGG256I fits factory automation nodes that combine programmable sequencing, analog monitoring, and firmware control in one device. Its 250K gates with 114 user I/Os handle sensor aggregation, PWM generation, and field-bus glue logic, while the embedded ARM Cortex-M1 runs the deterministic control loop at firmware speed. The industrial -40C to +85C rating guarantees timing over harsh cabinet temperatures, and Flash nonvolatility means the machine boots into a known state instantly at power-up without an external configuration PROM. Using the on-chip analog subsystem for voltage and temperature supervision eliminates discrete monitoring ICs, cutting BOM count and board area in dense I/O modules.
تجویز کردہ
Power Supply and System Monitoring
Because Fusion devices are Live-at-Power-Up (LAPU), the M1AFS250-2FGG256I is functional as soon as system power is applied within normal operating specifications - exactly the behavior required for power-supply supervision, brown-out detection, and sequencing control. The mixed-signal fabric digitizes rail voltages and die temperature through the on-chip ADC, while programmable logic implements comparator thresholds, fault latching, and PMBus-style sequencing state machines. The ARM Cortex-M1 can host higher-level telemetry firmware on the same die. Designers benefit from a 1.5 V core supply and Flash retention that keeps trip-point settings through power cycles without external NVM.
تجویز کردہ
Secure Embedded Controllers
The M1AFS250-2FGG256I provides a 128-bit Flash-based lock and industry-leading AES decryption to protect programmed IP and configuration data, per the manufacturer datasheet. Combined with nonvolatile on-chip configuration, this removes the external bitstream attack surface that SRAM FPGAs expose, making the device a strong fit for secure embedded controllers in industrial equipment, access systems, and licensed-feature hardware. The ARM Cortex-M1 core runs application firmware alongside hardware security logic, so encryption engines, key handling, and tamper-response state machines execute in fabric while protocol stacks run on the processor - all isolated on a single 130-nm die.
تجویز کردہ
Portable and Low-Power Instrumentation
Handheld and battery-powered instruments benefit from the single-chip approach of the M1AFS250-2FGG256I: Flash FPGAs consume no configuration boot power and eliminate the external PROM, reducing quiescent board draw and standby current. The 1.5 V core supply suits modern low-voltage rails, and integrating the analog monitoring subsystem means fewer active components between measurements. With 250K gates, the fabric implements acquisition timing, DSP pre-processing, and display interface logic, while the Cortex-M1 manages UI and communication firmware. The FGG256 1.0 mm-pitch ball grid array keeps routing compact in tightly packaged portable enclosures.
تجویز کردہ
Motor Drive and Motion Control
Motion-control subsystems use the M1AFS250-2FGG256I to merge position-feedback decoding (quadrature, resolver-style interfaces in fabric), PWM generation, and safety interlocks in programmable logic while the ARM Cortex-M1 executes the speed/current loops in firmware. The 114 user I/Os provide headroom for encoder inputs, gate-driver PWM outputs, and fault feedback lines. Industrial temperature qualification ensures behavior is guaranteed in drive enclosures, and LAPU operation allows the drive to enter a defined safe state immediately at power application. The 350 MHz-class fabric timing (-2 grade) supports fine-grained PWM resolution at switching frequencies used in servo drives.
تجویز کردہ
Test and Measurement Equipment
Bench and rack instruments use the M1AFS250-2FGG256I as a flexible timing, trigger, and interface controller. Flash configuration allows the instrument to be measurement-ready the instant power is applied, shortening perceived startup time, and the fabric implements time-critical trigger state machines, counter/timer channels, and bus bridges (UART/SPI/I2C to USB or Ethernet glue logic). The 36864 registers provide ample sequential depth for pattern generators, and 114 I/Os connect front-end circuitry directly. On-chip voltage/temperature monitoring supports self-test routines executed by the ARM Cortex-M1 at boot and during calibration cycles.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا M1AFS250-2FGG256I — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | M1AFS250-2FG256 | M1AFS250-1FGG256 | M1AFS600-FG256 | M1AFS600-1FG256 |
|---|---|---|---|---|---|
| Package | 256-ball FBGA (FGG256) | 256-ball FBGA (FGG256) - same footprint | 256-ball FBGA (FGG256) - same footprint | 256-ball FBGA (FGG256) - same footprint | 256-ball FBGA (FGG256) - same footprint |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250K | 250K | 250K | 600K | 600K |
| Speed Grade | -2 | -2 | -1 (slower) | standard | -1 |
| Temperature Grade | Industrial (I, -40C to +85C) | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) |
| Embedded Processor | ARM Cortex-M1 (optional) | ARM Cortex-M1 (optional) | ARM Cortex-M1 (optional) | ARM Cortex-M1 (optional) | ARM Cortex-M1 (optional) |
| Configuration Technology | Flash, nonvolatile, AES + 128-bit lock | Flash, nonvolatile, AES + 128-bit lock | Flash, nonvolatile, AES + 128-bit lock | Flash, nonvolatile, AES + 128-bit lock | Flash, nonvolatile, AES + 128-bit lock |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
اہم امتیازی خصوصیات
- Nonvolatile Flash configuration with Live-at-Power-Up (بمقابلہM1AFS600-FG256)
- Faster timing in the same footprint (بمقابلہM1AFS250-1FGG256)
- Integrated ARM Cortex-M1 plus mixed-signal analog in one chip (بمقابلہM1AFS250-2FG256)
ڈیزائن نوٹس
The M1AFS250-2FGG256I uses a 1.5 V core supply on a 130-nm process. Estimated: budget the core rail for worst-case switching activity (recommended to size the core regulator with at least 50% margin over typical current, computed in Microchip Libero power tools for your actual design). I/O bank rails are set independently per bank, so plan the board's rail map before pin assignment to avoid bank-voltage conflicts that force a PCB respin.
The 256-ball FGG256 BGA requires controlled-impedance multilayer routing; use via-in-pad or dogbone fanout on a 1.0 mm pitch and reserve at least two inner layers as a solid ground/power plane pair under the device. Keep analog monitoring inputs routed away from switching I/O to preserve ADC accuracy, and follow the datasheet decoupling network (bulk plus high-frequency ceramics at each supply pin group). Confirm ball finish (Pb-free 'GG') in your assembly profile.
Do not substitute speed or temperature grades without re-running static timing: M1AFS250-1FGG256 is drop-in pin-compatible but slower (-1), and M1AFS600 variants change fabric capacity though not the footprint. Also, Flash FPGAs configure instantly (LAPU), so do not rely on configuration delay for power-rail settling; implement explicit reset/monitoring logic in fabric. Finally, lock Flash IP with the 128-bit lock and AES features before production programming.
تعمیل کی معلومات
The FGG (GG) suffix denotes Pb-free balls and RoHS-compliant construction per Microsemi/Microchip ordering nomenclature. REACH, halogen-free, and conflict-minerals status should be confirmed via the Microchip product compliance portal.
