M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
料号： M1AFS250-2FGG256I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $103.9 | $103.90 |
| 10 | $98.71 | $987.10 |
| 100 | $93.51 | $9,351.00 |
| 500 | $88.31 | $44,155.00 |
| 1,000 | $83.12 | $83,120.00 |
M1AFS250-2FGG256I 概述
A Fusion FPGA is a type of field-programmable gate array that integrates programmable logic, flash configuration memory, and analog mixed-signal peripherals on a single die. Within the programmable logic hierarchy (FPGA -> programmable logic device -> programmable semiconductor), the Fusion family is distinctive because it adds analog-to-digital conversion, voltage/temperature monitoring, and power-management functionality alongside the fabric and the ARM Cortex-M1 soft-to-hard MCU integration, enabling true single-chip system solutions.
Key features include nonvolatile Flash configuration that retains the program when powered off, Live-at-Power-Up (LAPU) operation so the device is functional as soon as system power is applied within normal operating specifications, and integrated security: a 128-bit flash-based lock and industry-leading AES decryption to protect programmed IP and configuration data. The -2 speed grade and industrial (I) temperature grade make the device suited to harsh-environment embedded control.
Technical depth: because configuration storage is Flash rather than SRAM, no external configuration PROM is required, reducing board area and BOM cost while improving configuration-data security. The embedded ARM Cortex-M1 processor allows firmware plus programmable logic in one chip, and the analog subsystem (ADC, monitoring blocks) eliminates external supervisory components in many designs.
Typical applications include industrial automation and motor-control interfaces, power-supply and system monitoring, portable and low-power instrumentation, and embedded controllers that combine an MCU with glue logic and analog sensing.
Design consideration: verify I/O bank voltage assignments and analog pin usage early in the FGG256 footprint layout, since mixed-signal pin multiplexing constrains placement more than a pure-digital FPGA.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： M1AFS250-2FGG256I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： M1AFS250-2FGG256I （相同外形与封装尺寸） ——差异在于 Package, Family, RoHS Status, System Gates, Configuration Memory.
快速对比工具——选择替代料号进行并排对比：
M1AFS250-2FG256
✅ 直接替换✓ 有现货
$28.75 / 个
查看数据手册 →M1AFS250-1FGG256
✅ 直接替换✓ 有现货
$30.6 / 个
查看数据手册 →M1AFS600-FG256
✅ 直接替换✓ 有现货
$22 / 个
查看数据手册 →M1AFS600-1FG256
✅ 直接替换✓ 有现货
$69.15 / 个
查看数据手册 →M1AFS250-2FGG256I 最大额定值与电气特性
| Family | Actel Fusion (Mixed-Signal FPGA) |
| System Gates | 250000 gates |
| Registers (DFFs) | 36864 |
| User I/Os | 114 |
| Embedded Processor | ARM Cortex-M1 |
| Configuration Technology | Flash-based, nonvolatile |
| Process Technology | 130 nm, 7-layer metal CMOS |
| System Performance | Up to 350 MHz |
| Speed Grade | -2 |
| Core Supply Voltage | 1.5 V |
| 封装 | 256-ball FBGA (FGG256) |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +85C (industrial, I grade) |
| Security | 128-bit Flash lock, AES decryption |
| Power-Up Behavior | Live at Power-Up (LAPU) |
| RoHS 状态 | Compliant (FGG = Pb-free balls) |
M1AFS250-2FGG256I 256-ball fbga (fgg256) 引脚配置指南
M1AFS250-2FGG256I（256-ball fbga (fgg256) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： M1AFS250-2FGG256I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
M1AFS250-2FGG256I 适用于 6 应用s: Industrial Automation and Control, Power Supply and System Monitoring, Secure Embedded Controllers, Portable and Low-Power Instrumentation, Motor Drive and Motion Control, Test and Measurement Equipment.
Industrial Automation and Control
The M1AFS250-2FGG256I fits factory automation nodes that combine programmable sequencing, analog monitoring, and firmware control in one device. Its 250K gates with 114 user I/Os handle sensor aggregation, PWM generation, and field-bus glue logic, while the embedded ARM Cortex-M1 runs the deterministic control loop at firmware speed. The industrial -40C to +85C rating guarantees timing over harsh cabinet temperatures, and Flash nonvolatility means the machine boots into a known state instantly at power-up without an external configuration PROM. Using the on-chip analog subsystem for voltage and temperature supervision eliminates discrete monitoring ICs, cutting BOM count and board area in dense I/O modules.
推荐
Power Supply and System Monitoring
Because Fusion devices are Live-at-Power-Up (LAPU), the M1AFS250-2FGG256I is functional as soon as system power is applied within normal operating specifications - exactly the behavior required for power-supply supervision, brown-out detection, and sequencing control. The mixed-signal fabric digitizes rail voltages and die temperature through the on-chip ADC, while programmable logic implements comparator thresholds, fault latching, and PMBus-style sequencing state machines. The ARM Cortex-M1 can host higher-level telemetry firmware on the same die. Designers benefit from a 1.5 V core supply and Flash retention that keeps trip-point settings through power cycles without external NVM.
推荐
Secure Embedded Controllers
The M1AFS250-2FGG256I provides a 128-bit Flash-based lock and industry-leading AES decryption to protect programmed IP and configuration data, per the manufacturer datasheet. Combined with nonvolatile on-chip configuration, this removes the external bitstream attack surface that SRAM FPGAs expose, making the device a strong fit for secure embedded controllers in industrial equipment, access systems, and licensed-feature hardware. The ARM Cortex-M1 core runs application firmware alongside hardware security logic, so encryption engines, key handling, and tamper-response state machines execute in fabric while protocol stacks run on the processor - all isolated on a single 130-nm die.
推荐
Portable and Low-Power Instrumentation
Handheld and battery-powered instruments benefit from the single-chip approach of the M1AFS250-2FGG256I: Flash FPGAs consume no configuration boot power and eliminate the external PROM, reducing quiescent board draw and standby current. The 1.5 V core supply suits modern low-voltage rails, and integrating the analog monitoring subsystem means fewer active components between measurements. With 250K gates, the fabric implements acquisition timing, DSP pre-processing, and display interface logic, while the Cortex-M1 manages UI and communication firmware. The FGG256 1.0 mm-pitch ball grid array keeps routing compact in tightly packaged portable enclosures.
推荐
Motor Drive and Motion Control
Motion-control subsystems use the M1AFS250-2FGG256I to merge position-feedback decoding (quadrature, resolver-style interfaces in fabric), PWM generation, and safety interlocks in programmable logic while the ARM Cortex-M1 executes the speed/current loops in firmware. The 114 user I/Os provide headroom for encoder inputs, gate-driver PWM outputs, and fault feedback lines. Industrial temperature qualification ensures behavior is guaranteed in drive enclosures, and LAPU operation allows the drive to enter a defined safe state immediately at power application. The 350 MHz-class fabric timing (-2 grade) supports fine-grained PWM resolution at switching frequencies used in servo drives.
推荐
Test and Measurement Equipment
Bench and rack instruments use the M1AFS250-2FGG256I as a flexible timing, trigger, and interface controller. Flash configuration allows the instrument to be measurement-ready the instant power is applied, shortening perceived startup time, and the fabric implements time-critical trigger state machines, counter/timer channels, and bus bridges (UART/SPI/I2C to USB or Ethernet glue logic). The 36864 registers provide ample sequential depth for pattern generators, and 114 I/Os connect front-end circuitry directly. On-chip voltage/temperature monitoring supports self-test routines executed by the ARM Cortex-M1 at boot and during calibration cycles.
推荐
推荐产品汇总
工程参考数据： M1AFS250-2FGG256I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | M1AFS250-2FG256 | M1AFS250-1FGG256 | M1AFS600-FG256 | M1AFS600-1FG256 |
|---|---|---|---|---|---|
| Package | 256-ball FBGA (FGG256) | 256-ball FBGA (FGG256) - same footprint | 256-ball FBGA (FGG256) - same footprint | 256-ball FBGA (FGG256) - same footprint | 256-ball FBGA (FGG256) - same footprint |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250K | 250K | 250K | 600K | 600K |
| Speed Grade | -2 | -2 | -1 (slower) | standard | -1 |
| Temperature Grade | Industrial (I, -40C to +85C) | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) |
| Embedded Processor | ARM Cortex-M1 (optional) | ARM Cortex-M1 (optional) | ARM Cortex-M1 (optional) | ARM Cortex-M1 (optional) | ARM Cortex-M1 (optional) |
| Configuration Technology | Flash, nonvolatile, AES + 128-bit lock | Flash, nonvolatile, AES + 128-bit lock | Flash, nonvolatile, AES + 128-bit lock | Flash, nonvolatile, AES + 128-bit lock | Flash, nonvolatile, AES + 128-bit lock |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
关键差异点
- Nonvolatile Flash configuration with Live-at-Power-Up （对比 M1AFS600-FG256)
- Faster timing in the same footprint （对比 M1AFS250-1FGG256)
- Integrated ARM Cortex-M1 plus mixed-signal analog in one chip （对比 M1AFS250-2FG256)
设计说明
The M1AFS250-2FGG256I uses a 1.5 V core supply on a 130-nm process. Estimated: budget the core rail for worst-case switching activity (recommended to size the core regulator with at least 50% margin over typical current, computed in Microchip Libero power tools for your actual design). I/O bank rails are set independently per bank, so plan the board's rail map before pin assignment to avoid bank-voltage conflicts that force a PCB respin.
The 256-ball FGG256 BGA requires controlled-impedance multilayer routing; use via-in-pad or dogbone fanout on a 1.0 mm pitch and reserve at least two inner layers as a solid ground/power plane pair under the device. Keep analog monitoring inputs routed away from switching I/O to preserve ADC accuracy, and follow the datasheet decoupling network (bulk plus high-frequency ceramics at each supply pin group). Confirm ball finish (Pb-free 'GG') in your assembly profile.
Do not substitute speed or temperature grades without re-running static timing: M1AFS250-1FGG256 is drop-in pin-compatible but slower (-1), and M1AFS600 variants change fabric capacity though not the footprint. Also, Flash FPGAs configure instantly (LAPU), so do not rely on configuration delay for power-rail settling; implement explicit reset/monitoring logic in fabric. Finally, lock Flash IP with the 128-bit lock and AES features before production programming.
合规信息
The FGG (GG) suffix denotes Pb-free balls and RoHS-compliant construction per Microsemi/Microchip ordering nomenclature. REACH, halogen-free, and conflict-minerals status should be confirmed via the Microchip product compliance portal.
