10CX220YF672I5G - 220K LE Cyclone 10 GX FPGA, 672-FCBGA
부품 번호: 10CX220YF672I5G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $800 | $8,000.00 |
| 100 | $720 | $72,000.00 |
| 500 | $660 | $330,000.00 |
| 1,000 | $600 | $600,000.00 |
10CX220YF672I5G 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks (CLBs / ALMs), programmable interconnect, block RAM (BRAM), DSP slices, and hardened I/O serdes, all fabricated on a CMOS process. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and semiconductor ICs, distinguished from ASICs by their post-fabrication reconfigurability and from CPLDs by their finer-grained architecture and much higher logic capacity.
Key features include 80330 adaptive logic modules (ALMs), 13.43 Mbit embedded memory, support for up to 12.5 Gbps transceivers on selected pins, hardware DSP blocks for fixed- and floating-point arithmetic, and a hard memory controller subsystem for DDR3/DDR4/LPDDR3 external memory interfaces. The F672 package provides 236 general-purpose I/Os and uses Intel's standard Cyclone 10 GX pin-out so existing board designs can drop the part in without remapping.
The 20nm process node yields an attractive performance-per-watt ratio, with the -5 speed grade indicating a mid-tier Fmax placement. The Cyclone 10 GX architecture merges low-power logic fabric with embedded transceivers and PCIe Gen2 hard IP, allowing single-chip implementation of protocol bridging, motor control, video processing, and software-defined radio front-ends.
Typical applications include industrial machine vision, factory automation backplanes, video surveillance and broadcast equipment, low-cost 10G Ethernet aggregation, PCIe-over-cable bridges, and embedded computing platforms for IoT gateways. Designers also use the device in test and measurement front-ends and as a programmable logic companion to ASSPs in automotive driver-assistance subsystems (industrial temperature grade required).
A key design consideration for FPGAs of this density is power budgeting. Use the Intel FPGA Power and Thermal Calculator (PTC) early in the design cycle to estimate junction temperature and supply-rail currents; the 672-FCBGA's exposed-die thermal pad must be soldered to a multi-layer PCB land pattern with at least a 6x6 via array to the internal ground plane.
This page synthesizes current distributor pricing, drop-in Cyclone 10 GX density and speed-grade alternatives, and practical PCB/thermal design guidance not found in the manufacturer datasheet alone.
드롭인 대체품: 10CX220YF672I5G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10CX220YF672I5G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Embedded Memory, Logic Elements, Mounting Type, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10CX220YF672E5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$342 / 개
데이터시트 보기 →10CX220YF672E6G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$925 / 개
데이터시트 보기 →10CX150YF672I5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$278.4 / 개
데이터시트 보기 →10CX150YF672E5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$295 / 개
데이터시트 보기 →10CX105YF672I5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$108 / 개
데이터시트 보기 →10CX105YF672E5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$310 / 개
데이터시트 보기 →10CX220YF672I5G 최대 정격 & 전기적 특성
| Family | Cyclone 10 GX |
| Logic Elements | 220000 |
| Adaptive Logic Modules (ALMs) | 80330 |
| Embedded Memory | 13.43 Mbit (13,752,320 bits) |
| User I/Os | 236 |
| 패키지 | 672-BBGA, FCBGA |
| 실장 유형 | Surface Mount (SMD/SMT) |
| Process Technology | 20 nm |
| Core Supply Voltage | 0.9 V |
| 동작 온도 | -40C to +100C (Industrial) |
| Speed Grade | -5 (mid-tier) |
| Hard Memory Controller | DDR3 / DDR4 / LPDDR3 |
| Transceivers | Up to 12.5 Gbps (per family datasheet) |
| DSP Blocks | Yes (hardware DSP slices) |
| RoHS 상태 | Compliant |
10CX220YF672I5G 672-bbga, fcbga 핀 구성 가이드
10CX220YF672I5G(672-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10CX220YF672I5G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10CX220YF672I5G 적합 용도: 6 애플리케이션s: Industrial Machine Vision, 10G Ethernet Aggregation / Protocol Bridging, Video Surveillance and Broadcast Equipment, PCIe-over-Cable Bridges, Test & Measurement Front-Ends, Software-Defined Radio Front-End.
Industrial Machine Vision
The 10CX220YF672I5G fits industrial machine vision because its 220,000 logic elements and hardware DSP blocks can sustain multi-channel image-processing pipelines (CoaXPress or GigE Vision) at line rates of 10-25 Gbps aggregate. The device's 13.43 Mbit embedded block RAM holds full-HD frame buffers without external SRAM, while the industrial -40C to +100C temperature grade meets factory-floor thermal envelopes. Compared with smaller Cyclone 10 GX parts, the 220K-LE fabric leaves headroom for proprietary pre-processing IP. Recommended companion: external DDR3 memory for double-buffering.
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10G Ethernet Aggregation / Protocol Bridging
The 10CX220YF672I5G's hardened transceivers (up to 12.5 Gbps per the family datasheet) directly accept SFP+ optical modules, enabling single-chip 4x10G aggregation or 10G-to-1G fan-out bridges. The 220K-LE fabric accommodates L2/L3 forwarding logic and traffic management, while 13.43 Mbit of block RAM supports deep packet buffers. The 672-FCBGA pin-out exposes enough LVDS and general-purpose I/O for multi-port management interfaces. Power budget: 5-7W typical, requiring a 6x6 thermal-via array under the package.
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Video Surveillance and Broadcast Equipment
The 10CX220YF672I5G is ideal for video surveillance recorders and broadcast processing because its hardware DSP slices accelerate H.264/H.265 encoding offload and color-space conversion at multi-stream rates. The 13.43 Mbit block RAM holds several compressed-frame slices, while DDR3/LPDDR3 hard controllers externalize main frame storage. Industrial temperature operation (-40C to +100C) suits outdoor NVR enclosures, and the 0.9V core supply keeps total power within fanless thermal envelopes. The 236 user I/Os drive multiple MIPI or HDMI bridge PHYs simultaneously.
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PCIe-over-Cable Bridges
The 10CX220YF672I5G's hard PCIe Gen2 IP block, combined with its 12.5 Gbps transceivers, lets designers build single-chip PCIe Gen2 x4 to SFP+ or 10GBase-KR bridges for industrial backplanes. The 220K-LE fabric supports DMA engines, address translation, and protocol multiplexing, while 13.43 Mbit of embedded memory holds descriptor rings and packet buffers. Industrial -40C to +100C operation tolerates uncontrolled switch-room environments. Compared with ASSP bridge ICs, this FPGA approach allows field-upgradable protocol firmware via JTAG.
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Test & Measurement Front-Ends
The 10CX220YF672I5G suits test-and-measurement front-ends because its 12.5 Gbps transceivers capture multi-Gsps ADC sample streams, while 220K logic elements implement real-time FFT, FIR filtering, and trigger logic. The 13.43 Mbit block RAM is large enough for deep capture windows, and the 236 user I/Os synchronize parallel ADCs/DACs and front-panel controls. Industrial temperature operation permits bench-to-rack deployment. Power estimation must use the Intel FPGA Power and Thermal Calculator (PTC) to avoid junction-temperature overshoot.
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Software-Defined Radio Front-End
The 10CX220YF672I5G's 12.5 Gbps transceivers down-convert wideband IF signals to baseband, while its hardware DSP slices run polyphase channelizers, digital down-converters, and FFT cores simultaneously. The 220K-LE fabric supports multiple demodulator chains, and 13.43 Mbit of block RAM holds sample-history windows for adaptive filtering. The 672-FCBGA package routes LVDS to high-speed ADC/DAC companion chips. Industrial -40C to +100C operation covers outdoor tactical and commercial SDR deployments.
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추천 제품 요약
엔지니어링 참조 데이터: 10CX220YF672I5G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10CX220YF672E5G | 10CX220YF672E6G | 10CX150YF672I5G | 10CX105YF672I5G |
|---|---|---|---|---|---|
| Package | 672-FCBGA (F672) | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 220000 | 220000 | 220000 | 150000 | 105000 |
| Speed Grade | -5 | -5 | -6 (slower) | -5 | -5 |
| Temperature Grade | Industrial (-40C to +100C) | Extended Commercial (0C to +100C) | Extended Commercial (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| User I/Os | 236 | 236 | 236 | 236 (same package) | 236 (same package) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
주요 차별점
- Highest-density 672-FCBGA variant of the Cyclone 10 GX family (vs 10CX150YF672I5G)
- Industrial temperature grade for harsh-environment deployment (vs 10CX220YF672E5G)
- Mid-tier speed grade (-5) for balanced Fmax vs cost (vs 10CX220YF672E6G)
설계 노트
Estimated: At 0.9V core with typical 5-7W device dissipation on the 672-FCBGA, junction temperature rise must be modeled against the FCBGA's theta_JA (approximately 8-12 C/W with a 6x6 thermal-via array to inner ground plane). Run the Intel FPGA Power and Thermal Calculator (PTC) early in the design cycle using your actual toggle rate and utilization - do not rely on datasheet 'typical' values. Without a continuous thermal pad land pattern, junction temperature can exceed 125C and trigger thermal shutdown during extended 10G transceiver operation.
The 672-FCBGA requires a multi-layer PCB (8+ layers recommended) with microvia-to-BGA-pad stackups. Place at minimum 6x6 thermal-via array (0.3 mm drill, 0.5 mm pitch) under the exposed die pad, stitching all the way to the inner ground plane. Per Intel pin connection guidelines, leave dedicated GND balls adjacent to each transceiver power pin to control return-path inductance - this is critical to meet 12.5 Gbps signal-integrity masks. Decoupling: 100 nF X7R per power pin within 1 mm, plus 10 uF bulk per supply rail.
Do not assume pin compatibility with Cyclone V GX F672 packages - the 10CX220YF672I5G uses a different transceiver pin map and different power-rail sequencing. When migrating designs from Cyclone V, regenerate the pin assignment in Quartus Prime and re-spin the PCB if needed. Also confirm JTAG chain ordering: if you stack FPGAs, ensure TMS/TCK fan-out does not exceed 8 loads. Finally, validate configuration scheme (AS x4 vs JTAG vs Passive Serial) against your board's flash footprint before tape-out.
For 12.5 Gbps transceiver channels, route diff-pairs with 100 ohm differential impedance and intra-pair skew under 1 ps per cm. Use only Intel-validated transceiver reference schematics - non-standard AC-coupling capacitor values or stub lengths will degrade eye-mask margins. Reference Intel application note AN-822 for transceiver PCB layout, including via anti-pad geometry and connector break-out patterns for SFP+ cages.
규정 준수 정보
RoHS compliant per Cyclone 10 GX family product page. Industrial temperature grade is not AEC-Q100 qualified - for automotive applications, evaluate AEC-Q100-qualified Cyclone 10 GX variants or use an ASSP companion. Halogen-free status not explicitly listed in the provided data.