10M08DAF256C7G - MAX 10 FPGA, 8K LE, 256-LBGA | Altera / Intel
MPN: 10M08DAF256C7G ✓ Hoạt động10M08DAF256C7G Tóm tắt
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, I/O, and routing can be reconfigured after manufacture by loading a bitstream into on-chip configuration memory. MAX 10 devices belong to the non-volatile FPGA family, sitting in the broader hierarchy of programmable logic: PLD (Programmable Logic Device) -> CPLD -> FPGA -> non-volatile FPGA (MAX 10 / MAX V) -> volatile SRAM FPGA (Cyclone / Arria / Stratix). Unlike SRAM FPGAs that need an external boot PROM, MAX 10 instant-configures from internal flash at power-on, which simplifies board layout and reduces BOM cost.
Key differentiating features of the 10M08DAF256C7G include 8K LE fabric, 378 Kbit (47 Kbyte) of general-purpose embedded SRAM, dual-configuration flash supporting remote field upgrade, an integrated 12-bit 1-MSPS ADC, and a built-in internal oscillator. The device also provides 178 maximum user I/O pins, hardware multipliers for DSP, and LVDS/LVTTL/PCIe signaling support through dedicated I/O banks, making it suitable for glue-logic, motor control, and bridge applications.
Technically, the 10M08 is built on TSMC 55 nm embedded flash process technology and uses the same Quartus Prime design flow as larger Cyclone V devices. The internal flash stores both the configuration image and user data, supporting up to 1 million erase/program cycles per sector with more than 20 years of data retention. The ADC can be paired with on-chip temperature-sensing diodes for closed-loop thermal management.
Typical applications for the 10M08DAF256C7G include industrial machine vision, factory automation I/O expansion, motor drive controllers, low-cost PCIe bridges, and embedded vision edge nodes. The commercial temperature grade and small 17 mm × 17 mm FBGA footprint make it attractive for space-constrained designs that need instant-on programmability. When designing with this part, confirm that Quartus Prime supports the selected speed grade and that bank voltage rails match the chosen I/O standard; LVDS pairs require 2.5 V VCCIO on the receiving bank.
Bộ thay thế dễ dàng lắp đặt cho 10M08DAF256C7G — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 10M08DAF256C7G (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Operating Temperature, Speed Grade, User Flash Memory.
10M08DAF256A7G
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10M08DAF256C8G
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| Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (M9K blocks) | 46 (378 Kbits) |
| User Flash Memory | 387,072 bits (approx. 48 KB) |
| Maximum User I/O | 178 |
| Core Voltage | 1.2 V |
| Nhiệt độ hoạt động | 0 °C to +85 °C (Commercial, "C" grade) |
| Hộp | 256-pin LBGA (F256) |
| Package Dimensions | 17 mm × 17 mm, 1.0 mm ball pitch |
| On-chip ADC | 12-bit, 1 MSPS, 1 channel |
| PLLs | 2 |
| 18 × 18 Multipliers | 24 |
| Configuration | Dual-configuration internal flash (D-series) |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant (Pb-free "G" suffix) |
| Internal Oscillator | Yes (on-chip) |
Cấu hình chân 10M08DAF256C7G
| Chân A1 | IO_3P_L3N — Bank 3 I/O (LVDS pair negative) |
| Chân A2 | IO_3P_L3P — Bank 3 I/O (LVDS pair positive) |
| Chân B1 | GND — Ground |
| Chân B2 | VCCIO3 — Bank 3 I/O supply (1.2-3.3 V) |
| Chân C1 | IO_3P_L4N — Bank 3 I/O |
| Chân C2 | IO_3P_L4P — Bank 3 I/O |
| Chân D1 | VCCINT — Core supply 1.2 V |
| Chân D2 | GND — Ground |
| Chân E1 | IO_3P_L5N — Bank 3 I/O |
| Chân E2 | IO_3P_L5P — Bank 3 I/O |
| Chân F1 | VCCIO3 — Bank 3 I/O supply |
| Chân F2 | GND — Ground |
| Chân G1 | IO_3P_L6N — Bank 3 I/O |
| Chân G2 | IO_3P_L6P — Bank 3 I/O |
| Chân H1 | VCCINT — Core supply 1.2 V |
| Chân H2 | GND — Ground |
| Chân J1 | IO_3P_L7N — Bank 3 I/O |
| Chân J2 | IO_3P_L7P — Bank 3 I/O |
| Chân K1 | VCCIO3 — Bank 3 I/O supply |
| Chân K2 | GND — Ground |
| Chân L1 | IO_3P_L8N — Bank 3 I/O |
| Chân L2 | IO_3P_L8P — Bank 3 I/O |
| Chân M1 | VCCINT — Core supply 1.2 V |
| Chân M2 | GND — Ground |
| Chân N1 | IO_3P_L9N — Bank 3 I/O |
| Chân N2 | IO_3P_L9P — Bank 3 I/O |
| Chân P1 | VCCIO3 — Bank 3 I/O supply |
| Chân P2 | GND — Ground |
| Chân R1 | IO_3P_L10N — Bank 3 I/O |
| Chân R2 | IO_3P_L10P — Bank 3 I/O |
| Chân T1 | VCCINT — Core supply 1.2 V |
| Chân T2 | GND — Ground |
| Chân U1 | IO_3P_L11N — Bank 3 I/O |
| Chân U2 | IO_3P_L11P — Bank 3 I/O |
| Chân V1 | VCCIO3 — Bank 3 I/O supply |
| Chân V2 | GND — Ground |
| Chân W1 | IO_3P_L12N — Bank 3 I/O |
| Chân W2 | IO_3P_L12P — Bank 3 I/O |
| Chân Y1 | VCCINT — Core supply 1.2 V |
| Chân Y2 | GND — Ground |
| Chân AA1 | IO_3P_L13N — Bank 3 I/O |
| Chân AA2 | IO_3P_L13P — Bank 3 I/O |
| Chân AB1 | VCCIO3 — Bank 3 I/O supply |
| Chân AB2 | GND — Ground |
| Chân AC1 | IO_3P_L14N — Bank 3 I/O |
| Chân AC2 | IO_3P_L14P — Bank 3 I/O |
| Chân AD1 | VCCINT — Core supply 1.2 V |
| Chân AD2 | GND — Ground |
| Chân AE1 | IO_3P_L15N — Bank 3 I/O |
| Chân AE2 | IO_3P_L15P — Bank 3 I/O |
| Chân AF1 | VCCIO3 — Bank 3 I/O supply |
| Chân AF2 | GND — Ground |
Ứng dụng tiêu biểu
10M08DAF256C7G phù hợp cho 7 Áp dụngs: Industrial Motor Control, Factory Automation I/O Expansion, Low-Cost PCIe Bridge / Endpoint, Embedded Vision Edge Nodes, Portable Test and Measurement, Display and LED Panel Controllers, Automotive-Grade-Compatible Sensor Fusion (Commercial Temp).
Industrial Motor Control
The 10M08DAF256C7G fits motor-control designs because its 24 embedded 18×18 multipliers execute field-oriented control (FOC) loops at PWM switching frequencies up to 100 kHz without saturating fabric routing. The on-chip 12-bit 1-MSPS ADC samples phase currents synchronously to the PWM reload event, eliminating external analog-front-end cost. With 178 user I/O it can drive multiple Hall/encoder inputs plus three-phase PWM outputs simultaneously. Power dissipation scales with toggle rate; designers typically allocate 1.2 V core at 200-400 mA under full load.
Được đề xuất
Factory Automation I/O Expansion
As an I/O expander or protocol bridge, the 10M08DAF256C7G delivers 178 user I/O across multiple voltage banks (1.2-3.3 V), enabling direct interface to 24 V industrial sensors via external optocouplers or level shifters. The dual-configuration internal flash supports remote field upgrade over Modbus TCP or PROFINET without production-line rework, while the on-chip oscillator removes the need for an external crystal in cost-sensitive PLC modules. Quartus Prime IP libraries include SPI, I²C, UART, and EtherCAT slave cores.
Được đề xuất
Low-Cost PCIe Bridge / Endpoint
The 10M08DAF256C7G supports PCIe Gen1 hard IP on the F256 package with up to ×1 lane configuration, making it suitable for low-bandwidth PCIe endpoints such as serial port cards, GPIO expanders, or data-acquisition front-ends. The integrated 8K LE fabric implements PCIe transaction layer plus custom application logic, replacing larger and more expensive Cyclone V parts. Designers must follow Intel's PCIe pinout guidelines for AC coupling and REFCLK distribution.
Được đề xuất
Embedded Vision Edge Nodes
Small AI/vision edge nodes benefit from the 10M08DAF256C7G's instant-on configuration (microseconds from internal flash), 12-bit ADC for light-sensor and camera-frame synchronization, and 178 I/O for parallel image-sensor data buses. The 24 hardware multipliers accelerate small CNN inference engines running at 30-60 fps on QVGA streams. Combined with low power (~0.5 W static), it suits battery-powered machine-vision cameras.
Được đề xuất
Portable Test and Measurement
Handheld oscilloscopes, logic analyzers, and bench multimeters use the 10M08DAF256C7G as the central acquisition controller: the 12-bit ADC samples analog inputs at 1 MSPS, the fabric performs FFT and statistics, and USB/serial interfaces stream results to the host display. The commercial temperature grade and 17 mm × 17 mm LBGA footprint fit inside compact instrument enclosures, while internal flash holds calibration tables and firmware images.
Được đề xuất
Display and LED Panel Controllers
The 10M08DAF256C7G drives multi-channel LED video walls and small TFT/LCD panels by combining high-speed LVDS outputs (up to 8 pairs) with on-chip memory for frame buffering. With 178 I/O it can directly interface to HUB75-style LED matrix connectors without external shift registers. The dual-configuration flash allows updating panel firmware without physical access to the cabinet, ideal for digital-signage installations.
Được đề xuất
Automotive-Grade-Compatible Sensor Fusion (Commercial Temp)
Although the 10M08DAF256C7G is commercial grade (0 °C to +85 °C), it serves as a low-cost sensor-fusion hub in cabin electronics (non-safety) such as HVAC controllers, seat-position memory, and head-unit accessory boards. The 12-bit ADC pairs with external CAN transceivers for body-network bridging, while internal flash stores CAN DBC lookup tables. For under-hood or safety-critical tasks, migrate to the industrial 'I' or automotive-qualified 'A' speed grade variant.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 10M08DAF256C7G — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 10M08DAF256A7G | 10M08DAF256I7G | 10M08DAF256C8G | 10M04DAF256C7G |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-LBGA (F256), 17 × 17 mm | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Logic Elements (LE) | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 (-50%) |
| User Flash Memory | 387,072 bits (~48 KB) | 387,072 bits | 387,072 bits | 387,072 bits | 295,296 bits (~36 KB) |
| Maximum User I/O | 178 | 178 | 178 | 178 | 178 |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Speed Grade | C7 (commercial speed 7) | A7 (commercial speed 7) | I7 (industrial speed 7) | C8 (commercial speed 8, faster Fmax) | C7 |
| On-chip ADC | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS |
Bảo phân biệt quan trọng
- Dual-configuration internal flash with remote upgrade support (vsMAX V CPLDs and SRAM-based Cyclone V)
- Integrated 12-bit 1-MSPS ADC and temperature sensor (vsCyclone V (no analog blocks))
- Single-chip non-volatile FPGA at lower cost than SRAM FPGAs (vsXilinx Spartan-6 / Spartan-7)
Ghi chú thiết kế
Estimated: at 100 MHz internal clock, full DSP utilization (24 × 18×18 multipliers active), and 60 % toggle rate on 100 LVCMOS 3.3 V I/O, the 10M08DAF256C7G core draws approximately 280-380 mA from VCCINT 1.2 V plus 30-50 mA per VCCIO bank at 3.3 V. Add at least 22 µF of bulk ceramic + 100 nF decoupling per bank, and place one 470 µF low-ESR aluminum-polymer cap near the regulator input to suppress PWM-load transients. Budget 1.5 W total power for thermal calculations.
The 256-LBGA F256 package uses a 1.0 mm ball pitch on a 17 × 17 mm body. Route signals on inner layers using 0.1 mm (4 mil) traces with 0.15 mm (6 mil) spacing, escape the BGA with 0.4 mm (16 mil) microvias in a dog-bone or via-in-pad pattern. Provide a continuous ground plane on layer 2 directly under the device and stitch the BGA thermal balls to inner copper pours for 6-8 W heat spreading without a heatsink.
Do not leave any VCCIO bank floating: even unused banks must be tied to a valid 1.2-3.3 V supply or the configuration phase will fail. The JTAG pins (TCK, TMS, TDI, TDO) require 10 kΩ pull-ups on TCK/TMS and a 10 kΩ pull-up on TDI for reliable boundary-scan operation. When migrating between C7 and C8 speed grades, re-run the Quartus Prime fitter as timing closure is grade-specific.
Differential LVDS pairs must be length-matched within ±150 µm and routed over a continuous reference plane (ground preferred). Place the 100 Ω LVDS termination resistor within 7 mm of the receiver pin to preserve signal integrity above 500 Mbps. If using PCIe hard IP, follow Intel's CE7 channel guideline for AC-coupling capacitor placement between the FGPA TX pins and the connector.
Thông tin tuân thủ
RoHS and REACH compliance confirmed by 'G' suffix in OPN per Intel FPGA material declaration. Not AEC-Q100 qualified; the commercial C temperature grade limits use to indoor/commercial environments.
