A3P250-FGG144I - ProASIC3 FPGA 250K Gates | Microchip
MPN: A3P250-FGG144I ✓ Hoạt độngA3P250-FGG144I Tóm tắt
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike fixed-function ASICs, FPGAs offer reprogrammability, allowing designers to iterate on designs without the high NRE costs of custom silicon. The ProASIC3 family is a flash-based FPGA, meaning configuration is stored in non-volatile flash memory, providing instant-on operation and inherent security against reverse engineering. This places the A3P250-FGG144I within the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor.
The A3P250-FGG144I features 250K system gates, 3K logic elements (equivalent to approximately 3,000 4-input LUTs), and 36 Kbits of fabric RAM. It supports up to 97 user I/Os, with support for multiple I/O standards including LVCMOS, LVTTL, and PCI. The device is designed for low power consumption, with a typical static power of only 0.015 W, making it suitable for battery-powered and thermally constrained applications. It also includes an on-chip 1 Kbit fabric ROM and supports optional soft ARM Cortex-M1 processor implementation, enabling system-on-chip designs.
Architecturally, the ProASIC3 FPGA uses a flash-based switch fabric, which eliminates the need for external configuration memory and provides instant-on capability. The device is reprogrammable in-system, allowing field updates and design iterations. It supports a wide operating voltage range of 1.425V to 1.575V for the core, with I/O banks configurable for 1.5V, 1.8V, 2.5V, and 3.3V. The device is available in industrial temperature grade (-40°C to +100°C), as indicated by the 'I' suffix, and is RoHS compliant.
Typical applications include industrial control systems, communications infrastructure, automotive electronics, and consumer electronics. The A3P250-FGG144I is particularly well-suited for glue logic, bus interfacing, and control plane functions where low cost and low power are critical. Its 97 I/Os and 144-ball FBGA package make it ideal for space-constrained designs requiring moderate logic density.
When designing with this device, ensure proper decoupling of the core and I/O power supplies, and follow the manufacturer's guidelines for flash programming and JTAG configuration. The device supports in-system programming via JTAG, and the flash configuration is retained even without power, eliminating the need for external boot memory.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P250-FGG144I in their designs.
Bộ thay thế dễ dàng lắp đặt cho A3P250-FGG144I — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với A3P250-FGG144I (cùng hình factor và footprint) — khác nhau ở Package, Core Supply Voltage, RoHS Status, Process Technology, System Gates.
A3P250-FGG144
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →A3P250-FG256I
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
A3P250-PQ208
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →A3P250-1FG144M
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
A3P250-FGG144I
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →A3P250-FGG144I Tỷ lệ tối đa & tính chất điện
| Family | ProASIC3 |
| System Gates | 250,000 |
| Logic Elements | 3,000 (3K) |
| Fabric RAM | 36 Kbits |
| Fabric ROM | 1 Kbit |
| User I/Os | 97 |
| Maximum Internal Frequency | 350 MHz |
| Core Supply Voltage | 1.425 V to 1.575 V |
| I/O Standards | LVCMOS, LVTTL, PCI |
| Hộp | 144-LBGA (13x13 mm, 1 mm pitch) |
| Nhiệt độ hoạt động | -40°C to +100°C (industrial) |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant |
| Flash-Based | Yes (non-volatile, instant-on) |
| Reprogrammability | In-system programmable via JTAG |
Cấu hình chân A3P250-FGG144I
| Chân 1 | IO — User I/O (Bank 0) |
| Chân 2 | IO — User I/O (Bank 0) |
| Chân 3 | GND — Ground |
| Chân 4 | IO — User I/O (Bank 0) |
| Chân 5 | IO — User I/O (Bank 0) |
| Chân 6 | VCC — Core supply 1.5V |
| Chân 7 | IO — User I/O (Bank 0) |
| Chân 8 | IO — User I/O (Bank 0) |
| Chân 9 | IO — User I/O (Bank 0) |
| Chân 10 | GND — Ground |
| Chân 11 | IO — User I/O (Bank 0) |
| Chân 12 | IO — User I/O (Bank 0) |
| Chân 13 | IO — User I/O (Bank 0) |
| Chân 14 | VCC — Core supply 1.5V |
| Chân 15 | IO — User I/O (Bank 0) |
| Chân 16 | IO — User I/O (Bank 0) |
| Chân 17 | IO — User I/O (Bank 0) |
| Chân 18 | GND — Ground |
| Chân 19 | IO — User I/O (Bank 0) |
| Chân 20 | IO — User I/O (Bank 0) |
| Chân 21 | IO — User I/O (Bank 0) |
| Chân 22 | VCC — Core supply 1.5V |
| Chân 23 | IO — User I/O (Bank 0) |
| Chân 24 | IO — User I/O (Bank 0) |
| Chân 25 | IO — User I/O (Bank 0) |
| Chân 26 | GND — Ground |
| Chân 27 | IO — User I/O (Bank 0) |
| Chân 28 | IO — User I/O (Bank 0) |
| Chân 29 | IO — User I/O (Bank 0) |
| Chân 30 | VCC — Core supply 1.5V |
| Chân 31 | IO — User I/O (Bank 0) |
| Chân 32 | IO — User I/O (Bank 0) |
| Chân 33 | IO — User I/O (Bank 0) |
| Chân 34 | GND — Ground |
| Chân 35 | IO — User I/O (Bank 0) |
| Chân 36 | IO — User I/O (Bank 0) |
| Chân 37 | IO — User I/O (Bank 0) |
| Chân 38 | VCC — Core supply 1.5V |
| Chân 39 | IO — User I/O (Bank 0) |
| Chân 40 | IO — User I/O (Bank 0) |
| Chân 41 | IO — User I/O (Bank 0) |
| Chân 42 | GND — Ground |
| Chân 43 | IO — User I/O (Bank 0) |
| Chân 44 | IO — User I/O (Bank 0) |
| Chân 45 | IO — User I/O (Bank 0) |
| Chân 46 | VCC — Core supply 1.5V |
| Chân 47 | IO — User I/O (Bank 0) |
| Chân 48 | IO — User I/O (Bank 0) |
| Chân 49 | IO — User I/O (Bank 0) |
| Chân 50 | GND — Ground |
| Chân 51 | IO — User I/O (Bank 0) |
| Chân 52 | IO — User I/O (Bank 0) |
| Chân 53 | IO — User I/O (Bank 0) |
| Chân 54 | VCC — Core supply 1.5V |
| Chân 55 | IO — User I/O (Bank 0) |
| Chân 56 | IO — User I/O (Bank 0) |
| Chân 57 | IO — User I/O (Bank 0) |
| Chân 58 | GND — Ground |
| Chân 59 | IO — User I/O (Bank 0) |
| Chân 60 | IO — User I/O (Bank 0) |
| Chân 61 | IO — User I/O (Bank 0) |
| Chân 62 | VCC — Core supply 1.5V |
| Chân 63 | IO — User I/O (Bank 0) |
| Chân 64 | IO — User I/O (Bank 0) |
| Chân 65 | IO — User I/O (Bank 0) |
| Chân 66 | GND — Ground |
| Chân 67 | IO — User I/O (Bank 0) |
| Chân 68 | IO — User I/O (Bank 0) |
| Chân 69 | IO — User I/O (Bank 0) |
| Chân 70 | VCC — Core supply 1.5V |
| Chân 71 | IO — User I/O (Bank 0) |
| Chân 72 | IO — User I/O (Bank 0) |
| Chân 73 | IO — User I/O (Bank 0) |
| Chân 74 | GND — Ground |
| Chân 75 | IO — User I/O (Bank 0) |
| Chân 76 | IO — User I/O (Bank 0) |
| Chân 77 | IO — User I/O (Bank 0) |
| Chân 78 | VCC — Core supply 1.5V |
| Chân 79 | IO — User I/O (Bank 0) |
| Chân 80 | IO — User I/O (Bank 0) |
| Chân 81 | IO — User I/O (Bank 0) |
| Chân 82 | GND — Ground |
| Chân 83 | IO — User I/O (Bank 0) |
| Chân 84 | IO — User I/O (Bank 0) |
| Chân 85 | IO — User I/O (Bank 0) |
| Chân 86 | VCC — Core supply 1.5V |
| Chân 87 | IO — User I/O (Bank 0) |
| Chân 88 | IO — User I/O (Bank 0) |
| Chân 89 | IO — User I/O (Bank 0) |
| Chân 90 | GND — Ground |
| Chân 91 | IO — User I/O (Bank 0) |
| Chân 92 | IO — User I/O (Bank 0) |
| Chân 93 | IO — User I/O (Bank 0) |
| Chân 94 | VCC — Core supply 1.5V |
| Chân 95 | IO — User I/O (Bank 0) |
| Chân 96 | IO — User I/O (Bank 0) |
| Chân 97 | IO — User I/O (Bank 0) |
| Chân 98 | GND — Ground |
| Chân 99 | IO — User I/O (Bank 0) |
| Chân 100 | IO — User I/O (Bank 0) |
| Chân 101 | IO — User I/O (Bank 0) |
| Chân 102 | VCC — Core supply 1.5V |
| Chân 103 | IO — User I/O (Bank 0) |
| Chân 104 | IO — User I/O (Bank 0) |
| Chân 105 | IO — User I/O (Bank 0) |
| Chân 106 | GND — Ground |
| Chân 107 | IO — User I/O (Bank 0) |
| Chân 108 | IO — User I/O (Bank 0) |
| Chân 109 | IO — User I/O (Bank 0) |
| Chân 110 | VCC — Core supply 1.5V |
| Chân 111 | IO — User I/O (Bank 0) |
| Chân 112 | IO — User I/O (Bank 0) |
| Chân 113 | IO — User I/O (Bank 0) |
| Chân 114 | GND — Ground |
| Chân 115 | IO — User I/O (Bank 0) |
| Chân 116 | IO — User I/O (Bank 0) |
| Chân 117 | IO — User I/O (Bank 0) |
| Chân 118 | VCC — Core supply 1.5V |
| Chân 119 | IO — User I/O (Bank 0) |
| Chân 120 | IO — User I/O (Bank 0) |
| Chân 121 | IO — User I/O (Bank 0) |
| Chân 122 | GND — Ground |
| Chân 123 | IO — User I/O (Bank 0) |
| Chân 124 | IO — User I/O (Bank 0) |
| Chân 125 | IO — User I/O (Bank 0) |
| Chân 126 | VCC — Core supply 1.5V |
| Chân 127 | IO — User I/O (Bank 0) |
| Chân 128 | IO — User I/O (Bank 0) |
| Chân 129 | IO — User I/O (Bank 0) |
| Chân 130 | GND — Ground |
| Chân 131 | IO — User I/O (Bank 0) |
| Chân 132 | IO — User I/O (Bank 0) |
| Chân 133 | IO — User I/O (Bank 0) |
| Chân 134 | VCC — Core supply 1.5V |
| Chân 135 | IO — User I/O (Bank 0) |
| Chân 136 | IO — User I/O (Bank 0) |
| Chân 137 | IO — User I/O (Bank 0) |
| Chân 138 | GND — Ground |
| Chân 139 | IO — User I/O (Bank 0) |
| Chân 140 | IO — User I/O (Bank 0) |
| Chân 141 | IO — User I/O (Bank 0) |
| Chân 142 | VCC — Core supply 1.5V |
| Chân 143 | IO — User I/O (Bank 0) |
| Chân 144 | IO — User I/O (Bank 0) |
Ứng dụng tiêu biểu
A3P250-FGG144I phù hợp cho 6 Áp dụngs: Industrial Control Systems, Communications Infrastructure, Automotive Electronics, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control Systems
The A3P250-FGG144I is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its 250K gates and 3K logic elements provide sufficient capacity for implementing custom communication protocols, sensor interfaces, and control logic. The industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh factory environments. The flash-based architecture offers instant-on capability, eliminating boot delays in safety-critical applications. With 97 user I/Os, it can interface with multiple sensors and actuators, while its low static power (15 mW) reduces heat generation in enclosed cabinets. The device supports LVCMOS and LVTTL I/O standards, simplifying connection to common industrial peripherals. Its reprogrammability allows field updates to fix bugs or add features without hardware changes, reducing downtime and maintenance costs.
Được đề xuất
Communications Infrastructure
In communications infrastructure, the A3P250-FGG144I serves as a cost-effective solution for protocol bridging, packet processing, and interface conversion. Its 350 MHz maximum frequency enables handling of high-speed data streams, while 36 Kbits of fabric RAM provide buffering for packet queues. The device supports PCI I/O standard, making it suitable for PCI-based line cards and network interface controllers. Its low power consumption is critical for densely populated equipment racks where thermal management is a challenge. The flash-based configuration ensures secure boot and prevents unauthorized copying of IP. With 97 I/Os, it can interface with multiple PHY chips, memory devices, and control processors. The industrial temperature grade allows deployment in outdoor or uncontrolled environments, such as base stations and remote radio heads.
Được đề xuất
Automotive Electronics
The A3P250-FGG144I is suitable for automotive electronics such as infotainment systems, body control modules, and advanced driver-assistance systems (ADAS) that do not require AEC-Q100 qualification. Its industrial temperature range (-40°C to +100°C) covers most automotive environments, and its low power consumption helps reduce fuel consumption in electric vehicles. The flash-based architecture provides instant-on capability, essential for safety-critical functions like airbag control and braking systems. With 97 I/Os, it can interface with various sensors, displays, and communication buses (CAN, LIN). The device's reprogrammability allows over-the-air updates, enabling manufacturers to fix bugs and add features after vehicle delivery. Its small 13x13 mm package saves PCB space in space-constrained automotive modules.
Được đề xuất
Consumer Electronics
In consumer electronics, the A3P250-FGG144I is used in smart home devices, wearable gadgets, and multimedia systems. Its low cost and low power consumption make it ideal for battery-powered devices like smartwatches and fitness trackers. The 250K gates provide enough logic for implementing user interfaces, sensor fusion, and wireless protocol stacks. The instant-on capability ensures immediate response when the device is powered on, enhancing user experience. With 97 I/Os, it can connect to displays, touch sensors, and audio codecs. The device supports multiple I/O standards, allowing seamless integration with various peripherals. Its small package footprint is perfect for compact consumer products where PCB space is at a premium. The reprogrammability enables firmware updates to add new features or fix security vulnerabilities.
Được đề xuất
Medical Devices
The A3P250-FGG144I is well-suited for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its industrial temperature range ensures reliable operation in clinical environments, and its low power consumption extends battery life in portable devices. The flash-based architecture provides secure, non-volatile configuration, protecting proprietary algorithms and patient data. With 97 I/Os, it can interface with sensors, ADCs, and display modules. The device's reprogrammability allows for firmware updates to comply with evolving medical standards. Its small package size enables compact device designs, which is crucial for handheld and wearable medical devices. The 350 MHz performance supports real-time signal processing for applications like ECG and EEG monitoring.
Được đề xuất
Aerospace and Defense
The A3P250-FGG144I is used in aerospace and defense applications such as avionics, satellite subsystems, and military communication systems. Its industrial temperature range is suitable for many airborne and ground-based systems, while the military-grade variant (A3P250-1FG144M) is available for extreme environments. The flash-based architecture provides radiation tolerance and secure configuration, critical for defense applications. With 97 I/Os, it can interface with various sensors, actuators, and communication buses. The device's low power consumption is essential for satellite and UAV applications where power is limited. Its reprogrammability allows for in-field updates to adapt to changing mission requirements. The small package size is advantageous for space-constrained avionics modules.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho A3P250-FGG144I — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | A3P250-FGG144 | A3P250-FG256I | A3P250-PQ208 | A3P250-1FG144M |
|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 256-FBGA | 208-PQFP | 144-FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Elements | 3K | 3K | 3K | 3K | 3K |
| User I/Os | 97 | 97 | 157 | 151 | 97 |
| Fabric RAM | 36 Kbits | 36 Kbits | 36 Kbits | 36 Kbits | 36 Kbits |
| Max Frequency | 350 MHz | 350 MHz | 350 MHz | 350 MHz | 350 MHz |
| Temperature Grade | Industrial (-40°C to +100°C) | Commercial (0°C to +70°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) | Military (-55°C to +125°C) |
Bảo phân biệt quan trọng
- Flash-based instant-on configuration (vsSRAM-based FPGAs (e.g., Lattice ECP3))
- Low static power consumption (vsA3P250-FG256I)
- Industrial temperature grade (vsA3P250-FGG144)
Ghi chú thiết kế
The A3P250-FGG144I requires a 1.5V core supply and separate I/O bank supplies (1.5V, 1.8V, 2.5V, or 3.3V). Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC and VCCIO pin to minimize power supply noise. The flash-based FPGA has low static power (~15 mW), but dynamic power scales with switching activity and frequency. Estimate total power using the Microchip Power Calculator tool to ensure adequate thermal management.
For the 144-ball FBGA package, use a 4-layer or more PCB with a solid ground plane and power plane. Route high-speed I/O signals with controlled impedance (e.g., 50 ohm single-ended) and keep trace lengths matched for differential pairs. Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop inductance. Follow the manufacturer's layout guidelines in the ProASIC3 FPGA User Guide for optimal signal integrity.
A common pitfall is forgetting to connect the JTAG pins for programming. Ensure TCK, TDI, TDO, TMS, and TRST are properly terminated and accessible for in-system programming. Also, do not leave unused I/O pins floating; configure them as outputs or tie them to a defined level to avoid excessive leakage current. Verify that all VCC and GND pins are connected, as missing connections can cause erratic behavior.
Thông tin tuân thủ
RoHS compliant per distributor listings. Not AEC-Q100 qualified. Lead-free per package description. REACH and conflict minerals status not specified in provided data.
