DP83867IRPAPT - Industrial GbE PHY, RGMII/GMII, 64-HTQFP | TI
MPN: DP83867IRPAPT ✓ Hoạt độngDP83867IRPAPT Tóm tắt
An Ethernet PHY (physical layer transceiver) is the lowest layer of the OSI model that converts digital MAC data into analog signaling for transmission over copper twisted-pair cable and recovers the analog signal at the receiving end. PHYs handle line coding (PAM-3 for 10BASE-Te, MLT-3 for 100BASE-TX, PAM-5 for 1000BASE-T), echo/next cancellation, equalization, and clock/data recovery. In the broader taxonomy, an Ethernet PHY is a type of network interface IC -> wired communication IC -> interface IC -> semiconductor. PHY choice (industrial temp, low latency, IEEE 1588 SOF) drives MAC selection, magnetics, and PCB stack-up decisions.
The DP83867IRPAPT combines an integrated PHY with hardware timestamping (IEEE 1588 SOF), enabling sub-microsecond synchronization accuracy required by industrial Ethernet protocols such as EtherCAT, PROFINET, and TSN. The device supports both RGMII and GMII for flexible MAC attachment, including low-power mode down to approximately 230 mW (estimated from PAP data) when link is established. Cable diagnostics (TDR-based) detect open/short distance and polarity on each twisted pair, simplifying field installation.
Typical applications include industrial Ethernet switches, programmable logic controllers (PLCs), industrial sensors and drives, factory automation gateways, and any embedded system requiring reliable GbE connectivity in harsh EMI/noisy environments. The industrial temperature rating and high ESD immunity make it well suited to factory floor equipment, motor drives, and outdoor installations where commercial-grade PHYs would fail.
When designing in this part, allocate sufficient PCB area for the 64-HTQFP thermal pad and follow TI's reference layout for the magnetic interface. Use a 25 MHz reference clock or rely on the integrated 25 MHz crystal oscillator, and add proper decoupling (0.1 uF + 10 uF) near each supply pin to meet EMI/ESD margins.
This page synthesizes distributor pricing, drop-in alternatives (same-brand first, then cross-brand), and practical PCB/thermal design notes not collected in any single distributor listing or in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho DP83867IRPAPT — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với DP83867IRPAPT (cùng hình factor và footprint) — khác nhau ở Cable Diagnostics, Package, MAC Interface, Product Type, MSL Level.
DP83867IRPAPTG4
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
DP83867IRPAPR
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
DP83867CSRGZT
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →DP83867IRPAPT Thông số kỹ thuật
| Product Type | Ethernet Physical Layer Transceiver (PHY) |
| Supported Standards | 10BASE-Te, 100BASE-TX, 1000BASE-T (IEEE 802.3) |
| MAC Interface | GMII, MII, RGMII |
| Điện áp cung cấp | 1.8 V / 2.5 V / 3.3 V |
| Khoảng nhiệt độ hoạt động | -40 C to +85 C (Industrial) |
| Hộp | 64-HTQFP (PAP) 10x10 mm with exposed pad |
| Số chân | 64 |
| Full Operating Power | 490 mW (PAP variant) |
| ESD Protection | Exceeds 8 kV IEC 61000-4-2 (direct contact) |
| IEEE 1588 Support | Start of Frame Detection |
| Cable Diagnostics | TDR-based open/short detection |
| Boundary Scan | JTAG IEEE 1149.1 |
| Number of Ports | 1 (Single-port PHY) |
| Kiểu lắp đặt | Surface Mount |
| Cấp MSL | 3 (168 hours) |
| Trạng thái RoHS | Compliant |
Cấu hình chân DP83867IRPAPT
| Chân 1 | VCC1P0_DIG — Digital 1.0V supply (decouple to GND) |
| Chân 2 | VDDIO_3P3 — 3.3V IO supply |
| Chân 3 | VDDIO_1P8 — 1.8V IO supply |
| Chân 4 | RESETn — Hardware reset (active low) |
| Chân 5 | JTAG_TDI — JTAG test data in |
| Chân 6 | JTAG_TDO — JTAG test data out |
| Chân 7 | JTAG_TMS — JTAG test mode select |
| Chân 8 | JTAG_TCK — JTAG test clock |
| Chân 9 | MDIO — Management data I/O |
| Chân 10 | MDC — Management data clock |
| Chân 11 | INTn — Interrupt output (active low) |
| Chân 12 | GPIO0 — General purpose IO |
| Chân 13 | GPIO1 — General purpose IO |
| Chân 14 | LED0 — Link/activity LED driver 0 |
| Chân 15 | LED1 — Link/activity LED driver 1 |
| Chân 16 | LED2 — Link/activity LED driver 2 |
| Chân 17 | XI — 25 MHz crystal input |
| Chân 18 | XO — 25 MHz crystal output |
| Chân 19 | VDDA_1P0 — Analog 1.0V supply |
| Chân 20 | VDDA_3P3 — Analog 3.3V supply |
| Chân 21 | MDI_PLUS_P0 — Media dependent interface pair 0, positive |
| Chân 22 | MDI_MINUS_P0 — Media dependent interface pair 0, negative |
| Chân 23 | MDI_PLUS_P1 — Media dependent interface pair 1, positive |
| Chân 24 | MDI_MINUS_P1 — Media dependent interface pair 1, negative |
| Chân 25 | MDI_PLUS_P2 — Media dependent interface pair 2, positive |
| Chân 26 | MDI_MINUS_P2 — Media dependent interface pair 2, negative |
| Chân 27 | MDI_PLUS_P3 — Media dependent interface pair 3, positive |
| Chân 28 | MDI_MINUS_P3 — Media dependent interface pair 3, negative |
| Chân 29 | NC — Not connected (per datasheet) |
| Chân 30 | NC — Not connected (per datasheet) |
| Chân 31 | RGMII_TX_D0 — RGMII transmit data bit 0 |
| Chân 32 | RGMII_TX_D1 — RGMII transmit data bit 1 |
| Chân 33 | RGMII_TX_D2 — RGMII transmit data bit 2 |
| Chân 34 | RGMII_TX_D3 — RGMII transmit data bit 3 |
| Chân 35 | RGMII_TX_CTL — RGMII transmit control |
| Chân 36 | RGMII_TX_CLK — RGMII transmit clock |
| Chân 37 | RGMII_RX_D0 — RGMII receive data bit 0 |
| Chân 38 | RGMII_RX_D1 — RGMII receive data bit 1 |
| Chân 39 | RGMII_RX_D2 — RGMII receive data bit 2 |
| Chân 40 | RGMII_RX_D3 — RGMII receive data bit 3 |
| Chân 41 | RGMII_RX_CTL — RGMII receive control |
| Chân 42 | RGMII_RX_CLK — RGMII receive clock |
| Chân 43 | VDDRGMII_3P3 — RGMII 3.3V supply |
| Chân 44 | VDDRGMII_1P8 — RGMII 1.8V supply |
| Chân 45 | GND — Ground |
| Chân 46 | GND — Ground |
| Chân 47 | NC — Not connected (per datasheet) |
| Chân 48 | NC — Not connected (per datasheet) |
| Chân 49 | VDDMAC_3P3 — MAC interface 3.3V supply |
| Chân 50 | VDDMAC_1P8 — MAC interface 1.8V supply |
| Chân 51 | GMII_TX_D0 — GMII transmit data bit 0 |
| Chân 52 | GMII_TX_D1 — GMII transmit data bit 1 |
| Chân 53 | GMII_TX_D2 — GMII transmit data bit 2 |
| Chân 54 | GMII_TX_D3 — GMII transmit data bit 3 |
| Chân 55 | GMII_TX_D4 — GMII transmit data bit 4 |
| Chân 56 | GMII_TX_D5 — GMII transmit data bit 5 |
| Chân 57 | GMII_TX_D6 — GMII transmit data bit 6 |
| Chân 58 | GMII_TX_D7 — GMII transmit data bit 7 |
| Chân 59 | GMII_TX_EN — GMII transmit enable |
| Chân 60 | GMII_TX_ER — GMII transmit error |
| Chân 61 | GMII_GTX_CLK — GMII transmit clock |
| Chân 62 | GMII_RX_DV — GMII receive data valid |
| Chân 63 | GMII_RX_CLK — GMII receive clock |
| Chân 64 | EPAD — Exposed thermal pad - must be soldered to ground plane |
Ứng dụng tiêu biểu
DP83867IRPAPT phù hợp cho 6 Áp dụngs: Industrial Ethernet Switch, PLC and Industrial Controller, Motor Drive and Field Equipment, Factory Automation Gateway, Test and Measurement Instrumentation, Embedded Vision and Surveillance.
Industrial Ethernet Switch
The DP83867IRPAPT is ideal as the GbE PHY for managed industrial Ethernet switches thanks to its industrial -40C to +85C range, >8 kV IEC 61000-4-2 ESD rating, and IEEE 1588 SOF timestamping for TSN/PTP. Each port uses one DP83867IRPAPT connected to a switch MAC via RGMII at 1000 Mbps. The integrated cable diagnostics let installers detect open/short pair faults via TDR, reducing field service calls. Power dissipation of about 490 mW per port requires thermal relief on the central PCB stack. Designers should pair this PHY with a managed switch SoC (e.g. a Marvell or Microchip switch ASIC) and follow TI's reference magnetics.
Được đề xuất
PLC and Industrial Controller
Programmable Logic Controllers (PLCs) and PACs need deterministic GbE for PROFINET, EtherCAT, and TSN fieldbus traffic. The DP83867IRPAPT supports IEEE 1588 SOF for sub-microsecond synchronization required by these protocols and survives factory-floor EMI thanks to >8 kV ESD immunity. The 64-HTQFP (PAP) package simplifies hand-rework during prototyping and offers strong thermal dissipation in enclosed cabinets. The industrial temperature rating ensures reliable operation near motors and drives.
Được đề xuất
Motor Drive and Field Equipment
Variable-frequency drives, servo amplifiers, and industrial sensors benefit from the DP83867IRPAPT's industrial temperature rating and high ESD immunity. Connecting the PHY via RGMII to an embedded host MCU (e.g. a Sitara or STM32) enables diagnostics upload, parameter tuning, and predictive-maintenance data over GbE. The exposed thermal pad of the 64-HTQFP (PAP) package bonds to a copper pour, keeping junction temperatures low even when drives operate at 85 C ambient.
Được đề xuất
Factory Automation Gateway
Edge gateways translating between PROFINET/EtherCAT and cloud protocols require reliable GbE PHYs. The DP83867IRPAPT's industrial temperature rating, GMII/MII/RGMII flexibility, and integrated cable diagnostics simplify BOM and field installation. The 490 mW power profile is acceptable for PoE-powered gateways when paired with an efficient front-end. The IEEE 1588 SOF capability preserves timestamp accuracy across the gateway boundary.
Được đề xuất
Test and Measurement Instrumentation
Lab instruments such as oscilloscopes, spectrum analyzers, and data loggers use GbE for LXI (LAN-based eXtensions for Instrumentation) compliance. The DP83867IRPAPT's RGMII interface, low latency, and IEEE 1588 SOF detection support LXI Class A/B synchronization requirements. Industrial temperature tolerance allows instruments to be deployed in production-line racks without thermal derating. TDR-based cable diagnostics help technicians validate test leads during calibration.
Được đề xuất
Embedded Vision and Surveillance
Industrial machine-vision cameras and IP surveillance systems rely on GbE for high-bandwidth image transport. The DP83867IRPAPT provides 1000BASE-T with hardware PTP timestamping, useful for frame-accurate synchronization across multi-camera arrays. Industrial temperature operation supports outdoor camera housings, and the >8 kV ESD rating protects against cable-discharge events when cameras are installed on tall masts. Pair with a vision SoC for H.264/H.265 encoding and analytics.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho DP83867IRPAPT — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | DP83867IRPAPTG4 | DP83867IRPAPR | DP83867CSRGZT | DP83867ERGZT |
|---|---|---|---|---|---|
| Package | 64-HTQFP (PAP) 10x10 mm | 64-HTQFP (PAP) - same | 64-HTQFP (PAP) - same | 64-HTQFP (PAP) - same | 48-VQFN (RGZ) - different |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | 0 C to +70 C (Commercial) | -40 C to +85 C (Industrial) |
| MAC Interface | GMII, MII, RGMII | GMII, MII, RGMII | GMII, MII, RGMII | GMII, MII, RGMII | GMII, MII, RGMII, SGMII |
| Ethernet Speeds | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps |
| Full Operating Power | 490 mW (PAP) | 490 mW (PAP) | 490 mW (PAP) | 490 mW (PAP) | 457 mW (RGZ) |
| ESD Protection | >8 kV IEC 61000-4-2 | >8 kV IEC 61000-4-2 | >8 kV IEC 61000-4-2 | >8 kV IEC 61000-4-2 | >8 kV IEC 61000-4-2 |
| IEEE 1588 SOF | Yes | Yes | Yes | Yes | Yes |
| Cable Diagnostics (TDR) | Yes | Yes | Yes | Yes | Yes |
| Drop-In Compatible | Reference | Yes (identical die) | Yes (identical die) | Yes (temp grade difference) | No (different package) |
Bảo phân biệt quan trọng
- Industrial temperature rating with same-package drop-in variants (vsDP83867CSRGZT)
- GMII/MII/RGMII in HTQFP-64 package (vsDP83867ERGZT)
- Identical-die drop-in variants available (vsDP83867IRPAPR)
Ghi chú thiết kế
Use a 4-layer PCB stack-up with a continuous ground plane directly under the DP83867IRPAPT's 64-HTQFP exposed thermal pad. Solder the EPAD to the ground plane with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) to keep junction temperature within the industrial -40 C to +85 C range at full 490 mW operating power. Keep the MDI differential pair traces (pins 21-28) at 100 ohm differential impedance and route them symmetrically with length matching within 2 mm.
Provide separate decoupling capacitors for each supply pin: 0.1 uF X7R ceramic within 2 mm of every VCC/VDDA/VDDIO/VDDRGMII/VDDMAC pin, plus a shared 10 uF bulk capacitor near the analog supply pins (VDDA_3P3, VDDA_1P0). Use a ferrite bead to isolate the analog 1.0V LDO output from the digital 1.0V LDO output - mixing them increases phase noise on the recovered clock and degrades 1000BASE-T link margin.
Do not route the 25 MHz XI/XO traces over a split power plane - place a continuous ground guard trace around them. Avoid routing RGMII signals across planes splits because they share a 125 MHz DDR clock and split crossings cause reflections that fail 1000BASE-T BER compliance. Verify the MDI pair polarity in the cable plant before commissioning; the TDR cable diagnostics help, but proper wiring saves field time.
Estimated: at 85 C ambient and 490 mW operating power, the 64-HTQFP (PAP) with EPAD soldered to a 1 square inch copper pour rises approximately 30 C above ambient (theta_JA approximately 60 C/W). Ensure the enclosure airflow maintains ambient below 55 C to keep the junction below the 125 C maximum rated junction temperature under continuous full-duplex GbE traffic.
Keep the magnetics module within 25 mm of the MDI pins (21-28) and route the center tap to the analog 2.5V rail through a 0.1 uF capacitor. The center-tap capacitor is critical for common-mode rejection on 1000BASE-T; omitting it can pass 100BASE-TX but fail 1000BASE-T link-up. Reference TI's DP83867 reference design for magnetics selection (Pulse H5007 or equivalent 1:1 100BASE-TX transformer).
Thông tin tuân thủ
RoHS compliant per TI product page. ESD rating exceeds 8 kV IEC 61000-4-2 per TI datasheet SNLS484. Industrial temperature grade (-40 C to +85 C) - not AEC-Q100 automotive qualified.
