Intel

EP1SGX25FF1020C5ES - Stratix GX FPGA 25.66K LE FC-FBGA1020 | Intel

Name: EP1SGX25FF1020C5ES - Stratix GX FPGA 25.66K LE FC-FBGA1020 | Intel
Brand: Intel
SKU: EP1SGX25FF1020C5ES

MPN: EP1SGX25FF1020C5ES ✗ Cuối đời

1.5 V nominal (1.425 V to 1.575 V) Vdss FC-FBGA-1020 (33 × 33 mm, 1.0 mm pitch, lead-free) Package C5 (Enhanced) Speed

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MOQ: 1 |

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EP1SGX25FF1020C5ES Tóm tắt

The Intel (formerly Altera) EP1SGX25FF1020C5ES is a high-performance Stratix GX family FPGA built on 130 nm CMOS technology, integrating 25,660 logic elements, 2,566 Configurable Logic Blocks, and high-speed serial transceivers in a 1,020-pin flip-chip fine-line BGA package. The device operates from a nominal 1.5 V core supply (tolerance 1.425 V to 1.575 V), supports up to 20 transceiver channels delivering 500 Mbps to 3.1875 Gbps full-duplex per channel for an aggregate 127.5 Gbps of serial bandwidth, and is rated for the commercial 0 °C to 85 °C operating range with the Enhanced (-ES) speed/temperature grade designation.

A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that lets designers implement arbitrary digital logic via a hardware description language. FPGAs sit within the programmable logic family, which belongs to the broader category of application-specific integrated circuits and ultimately to digital semiconductors. Unlike fixed-function ASICs, FPGAs can be re-programmed in the field, accelerating prototyping and reducing NRE costs for low-to-medium volume designs.

Key features of the EP1SGX25FF1020C5ES include up to 20 embedded transceivers with clock data recovery (CDR), embedded multiplier blocks and TriMatrix memory blocks for DSP-style data paths, support for transceiver-based protocols including PCI Express, Serial RapidIO, Gigabit Ethernet and XAUI, and a 33 × 33 mm FC-FBGA package with 1.0 mm ball pitch. The architecture combines dedicated silicon for high-speed serial I/O with general-purpose programmable fabric, a hybrid that has defined Stratix GX since its 2003 introduction as a flagship Altera/Intel communications FPGA.

Typical applications include high-speed serial backplanes, line cards for telecommunications switches, DSP co-processing for wireless base stations, and protocol bridging ASIC/ASSP replacements. The 1020-pin package and 25.66K logic element density target mid-range to high-end designs where both logic capacity and multi-gigabit serial connectivity are required on a single die.

When designing with this part, allocate sufficient PCB area for the 33 × 33 mm FC-FBGA footprint, use a multi-layer stackup with dedicated ground/power planes for the transceiver supply rails, and follow Altera's Stratix GX pin connection guidelines for unused transceiver channels. Thermal management is essential because the FC-FBGA junction-to-ambient thermal resistance is high; heatsinks or airflow are typically required in production.

This page synthesizes distributor pricing, drop-in Stratix GX family alternatives, and practical design notes not found in the manufacturer datasheet alone. Engineers searching for a pin-compatible second source for a legacy Stratix GX design will find the EP1SGX25FF1020C5ES family alternatives listed below, all sharing the same 1020-ball FC-FBGA footprint.

Bộ thay thế dễ dàng lắp đặt cho EP1SGX25FF1020C5ES — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1SGX25FF1020C5ES (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Speed Grade, Package Type, Package, Logic Elements.

EP1SGX25DF1020C5

Intel

Operating Temperature: 0 C to 85 C (Commercial)

Speed Grade: C5

Package Type: 1020-BBGA (FC-FBGA), 33 x 33 mm, 1 mm pitch