Altera

EP1SGX25FF1020C5 - Stratix GX FPGA 25.6K LE 607 I/O FBGA-1020

MPN: EP1SGX25FF1020C5 ✗ Cuối đời

1.5 V Vdss FC-FBGA-1020 (33 x 33 mm, 1 mm pitch) Package C5 Speed 1,694,720 bits (1.69 Mbit) Memory

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EP1SGX25FF1020C5 Tóm tắt

The Intel (formerly Altera) EP1SGX25FF1020C5 is a high-density Stratix GX family FPGA featuring 25,660 logic elements, 2,566 LABs, and integrated transceivers in a 1020-ball FineLine BGA package. Built on a 130 nm CMOS process with a 1.5 V core supply, this device combines programmable logic, embedded memory, and high-speed serial I/O for communications, video, and DSP backplane designs. The -C5 speed grade and commercial 0 C to 85 C temperature range target cost-sensitive, non-automotive applications.

A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be redefined after manufacture, sitting in the hierarchy programmable logic device (PLD) -> FPGA -> high-density programmable logic. Stratix GX extends the Stratix architecture by embedding 3.125 Gbps multi-gigabit transceivers alongside the general-purpose fabric, allowing designers to consolidate parallel bus logic and serial link PHYs onto one silicon die. Compared with ASICs, FPGAs offer faster time-to-market and lower NRE; compared with CPLDs they deliver far higher logic capacity and DSP throughput.

Key features of the EP1SGX25FF1020C5 include 1.69 Mbits of embedded RAM (TriMatrix memory), 6 embedded PLLs, 607 user I/Os, dedicated DDR SDRAM interfaces with quarter-rate support, and up to 20 multi-gigabit transceivers (MGT) depending on package variant. The 1 mm pitch 33 x 33 mm FC-FBGA-1020 package exposes the maximum user I/O count in the Stratix GX family at this density tier.

Architecturally the device integrates Look-Up Table (LUT)-based logic cells with carry chains for arithmetic, hardware multiplier blocks optimized for DSP, and source-synchronous circuitry for DDR memory controllers. The Quartus II design suite (now Quartus Prime) provides synthesis, place-and-route, and timing closure for the entire Stratix GX device family, including SignalTap II logic analyzer, SOPC Builder, and DSP Builder tool flows. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), fast passive parallel (FPP), and JTAG modes through dedicated configuration pins.

Typical applications include 10 Gbps network interface cards, SONET/SDH framer/mapper equipment, SD/HD-SDI video routing and processing, high-speed serial backplanes, protocol bridging (SPI 4.2, SGMII, XAUI), and DSP co-processing cards. Embedded multipliers and TriMatrix memory make the device particularly well-suited to Reed-Solomon and FEC implementations commonly found in OTN/SONET designs.

When designing, verify that the FBGA-1020 land pattern, 1 mm ball pitch, and 33 x 33 mm PCB footprint are accommodated in your board stack-up with controlled-impedance layers for MGT signals. Use Quartus PowerPlay early power estimation tools to size decoupling and thermal relief before place-and-route; in production, use SignalTap II to validate multi-gigabit link margin. Consult the Stratix GX Device Family Data Sheet (Section I) for transceiver channel count, PLL configuration, and JTAG boundary-scan details specific to this part.

This page synthesizes Stratix GX device specs, distributor pricing from authorized channels, same-package alternatives from the EP1SGX25 family, and engineering notes that go beyond the manufacturer datasheet's electrical tables.

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Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1SGX25FF1020C5 (cùng hình factor và footprint) — khác nhau ở Package Type, Speed Grade, RoHS Status, Operating Temperature, Package.

EP1SGX25DF1020C5

Intel

Package Type: 1020-BBGA (FC-FBGA), 33 x 33 mm, 1 mm pitch