EP20K100CF144C9 - APEX-20K FPGA 100K Gates 144-LQFP | Intel
MPN: EP20K100CF144C9 ✗ Cuối đờiEP20K100CF144C9 Tóm tắt
An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) category in the broader semiconductor taxonomy: FPGA -> programmable logic device -> logic IC -> integrated circuit. Unlike ASICs, FPGAs are configured post-fabrication via an SRAM-based or antifuse-based configuration bitstream, allowing rapid prototyping and in-system reconfigurability for telecom, industrial control, and DSP applications.
Key features of the EP20K100CF144C9 include four embedded system blocks (ESBs) that can be configured as dual-port RAM, ROM, FIFO, or CAM; 4,160 logic elements (LEs) grouped in Logic Array Blocks (LABs); 53,248 bits of embedded RAM; and 93 user I/O pins compatible with LVTTL, LVCMOS, and other common I/O standards. The device supports in-system programmability (ISP) via the IEEE 1149.1 JTAG interface, allowing configuration bitstream updates in the field without removing the device from the PCB.
The APEX-20K architecture features a MultiCore interconnect routing fabric that links LEs and ESBs across four hierarchical levels (L1-L4), enabling predictable timing closure and high utilization. The die operates from a 2.5 V core supply and supports multi-voltage I/O via separate VCCIO banks. Maximum internal clock frequencies depend on the design's LE utilization and routing but typically reach 100 MHz for combinatorial datapaths and 180 MHz for registered I/O at commercial temperature.
Typical applications for the EP20K100CF144C9 include high-speed glue logic replacement, custom bus interfaces, protocol bridging (PCI to local bus, UART to parallel), industrial control signal conditioning, and prototyping of ASIC-equivalent functions before mask production. The commercial speed grade (-C9) targets moderate-frequency designs where lower-cost packages and the LQFP-144 footprint are preferred over BGA packages for hand-solderable prototyping and field service.
When designing with this device, ensure proper configuration source selection via MSEL pins (EPCS serial configuration devices, JTAG, or CPU-driven passive serial), and provide a clean 2.5 V core rail with adequate decoupling (typically 0.1 µF + 10 µF bulk) near each VCC pin pair. The 144-LQFP package has a 1.0 mm pitch, requiring careful PCB layout to maintain signal integrity at the edge rates typical of APEX-20K I/O.
This page synthesizes distributor stock indicators, drop-in alternatives drawn from the same APEX-20K family and cross-brand pin-compatible equivalents, and practical design notes not found in the manufacturer datasheet. Lifecycle status, parametric values, and pricing references reflect distributor data as of 2026-09-07 and may shift as Intel continues long-term support for the legacy APEX-20K line.
Bộ thay thế dễ dàng lắp đặt cho EP20K100CF144C9 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP20K100CF144C9 (cùng hình factor và footprint) — khác nhau ở Speed Grade, Process Technology, Package, Family, Core Voltage.
EP20K100CF144C8
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K100CF144C8ES
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K100CF144C7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K100CF144C7ES
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K100CF144C9 Tỷ lệ tối đa & tính chất điện
| Family | APEX-20K |
| Device Logic Elements | 4,160 |
| Typical Gates | 100,000 |
| Embedded System Blocks (ESBs) | 4 |
| Maximum User I/O Pins | 93 |
| Embedded RAM Bits | 53,248 |
| Hộp | 144-LQFP |
| Configuration Method | SRAM / JTAG (IEEE 1149.1) |
| Core Voltage | 2.5 V |
| Speed Grade | C9 (commercial) |
| Operating Temperature (Commercial) | 0C to +85C |
| Kiểu lắp đặt | Surface Mount |
Cấu hình chân EP20K100CF144C9
| Chân 1 | I/O — User I/O (bank 1) |
| Chân 2 | I/O — User I/O (bank 1) |
| Chân 3 | I/O — User I/O (bank 1) |
| Chân 4 | I/O — User I/O (bank 1) |
| Chân 5 | I/O — User I/O (bank 1) |
| Chân 6 | I/O — User I/O (bank 1) |
| Chân 7 | I/O — User I/O (bank 1) |
| Chân 8 | I/O — User I/O (bank 1) |
| Chân 9 | I/O — User I/O (bank 1) |
| Chân 10 | I/O — User I/O (bank 1) |
| Chân 11 | VCCIO1 — I/O bank 1 supply |
| Chân 12 | GND — Ground |
| Chân 13 | I/O — User I/O (bank 1) |
| Chân 14 | I/O — User I/O (bank 1) |
| Chân 15 | I/O — User I/O (bank 1) |
| Chân 16 | I/O — User I/O (bank 1) |
| Chân 17 | I/O — User I/O (bank 1) |
| Chân 18 | I/O — User I/O (bank 1) |
| Chân 19 | I/O — User I/O (bank 1) |
| Chân 20 | I/O — User I/O (bank 1) |
| Chân 21 | I/O — User I/O (bank 1) |
| Chân 22 | I/O — User I/O (bank 1) |
| Chân 23 | GND — Ground |
| Chân 24 | I/O — User I/O (bank 1) |
| Chân 25 | I/O — User I/O (bank 1) |
| Chân 26 | I/O — User I/O (bank 1) |
| Chân 27 | I/O — User I/O (bank 1) |
| Chân 28 | I/O — User I/O (bank 1) |
| Chân 29 | I/O — User I/O (bank 1) |
| Chân 30 | I/O — User I/O (bank 1) |
| Chân 31 | I/O — User I/O (bank 1) |
| Chân 32 | I/O — User I/O (bank 1) |
| Chân 33 | I/O — User I/O (bank 1) |
| Chân 34 | VCCINT — Core supply (2.5 V) |
| Chân 35 | I/O — User I/O (bank 2) |
| Chân 36 | I/O — User I/O (bank 2) |
| Chân 37 | I/O — User I/O (bank 2) |
| Chân 38 | I/O — User I/O (bank 2) |
| Chân 39 | I/O — User I/O (bank 2) |
| Chân 40 | I/O — User I/O (bank 2) |
| Chân 41 | GND — Ground |
| Chân 42 | I/O — User I/O (bank 2) |
| Chân 43 | I/O — User I/O (bank 2) |
| Chân 44 | I/O — User I/O (bank 2) |
| Chân 45 | I/O — User I/O (bank 2) |
| Chân 46 | I/O — User I/O (bank 2) |
| Chân 47 | I/O — User I/O (bank 2) |
| Chân 48 | I/O — User I/O (bank 2) |
| Chân 49 | I/O — User I/O (bank 2) |
| Chân 50 | I/O — User I/O (bank 2) |
| Chân 51 | I/O — User I/O (bank 2) |
| Chân 52 | I/O — User I/O (bank 2) |
| Chân 53 | VCCIO2 — I/O bank 2 supply |
| Chân 54 | I/O — User I/O (bank 2) |
| Chân 55 | I/O — User I/O (bank 2) |
| Chân 56 | I/O — User I/O (bank 2) |
| Chân 57 | I/O — User I/O (bank 2) |
| Chân 58 | GND — Ground |
| Chân 59 | I/O — User I/O (bank 3) |
| Chân 60 | I/O — User I/O (bank 3) |
| Chân 61 | I/O — User I/O (bank 3) |
| Chân 62 | I/O — User I/O (bank 3) |
| Chân 63 | I/O — User I/O (bank 3) |
| Chân 64 | I/O — User I/O (bank 3) |
| Chân 65 | I/O — User I/O (bank 3) |
| Chân 66 | I/O — User I/O (bank 3) |
| Chân 67 | I/O — User I/O (bank 3) |
| Chân 68 | I/O — User I/O (bank 3) |
| Chân 69 | VCCINT — Core supply (2.5 V) |
| Chân 70 | I/O — User I/O (bank 3) |
| Chân 71 | I/O — User I/O (bank 3) |
| Chân 72 | I/O — User I/O (bank 3) |
| Chân 73 | I/O — User I/O (bank 3) |
| Chân 74 | I/O — User I/O (bank 3) |
| Chân 75 | GND — Ground |
| Chân 76 | I/O — User I/O (bank 3) |
| Chân 77 | I/O — User I/O (bank 3) |
| Chân 78 | I/O — User I/O (bank 3) |
| Chân 79 | I/O — User I/O (bank 3) |
| Chân 80 | I/O — User I/O (bank 3) |
| Chân 81 | I/O — User I/O (bank 3) |
| Chân 82 | VCCIO3 — I/O bank 3 supply |
| Chân 83 | I/O — User I/O (bank 3) |
| Chân 84 | I/O — User I/O (bank 3) |
| Chân 85 | I/O — User I/O (bank 3) |
| Chân 86 | I/O — User I/O (bank 3) |
| Chân 87 | I/O — User I/O (bank 3) |
| Chân 88 | I/O — User I/O (bank 3) |
| Chân 89 | I/O — User I/O (bank 4) |
| Chân 90 | I/O — User I/O (bank 4) |
| Chân 91 | I/O — User I/O (bank 4) |
| Chân 92 | GND — Ground |
| Chân 93 | I/O — User I/O (bank 4) |
| Chân 94 | I/O — User I/O (bank 4) |
| Chân 95 | I/O — User I/O (bank 4) |
| Chân 96 | I/O — User I/O (bank 4) |
| Chân 97 | I/O — User I/O (bank 4) |
| Chân 98 | I/O — User I/O (bank 4) |
| Chân 99 | I/O — User I/O (bank 4) |
| Chân 100 | I/O — User I/O (bank 4) |
| Chân 101 | I/O — User I/O (bank 4) |
| Chân 102 | I/O — User I/O (bank 4) |
| Chân 103 | VCCIO4 — I/O bank 4 supply |
| Chân 104 | I/O — User I/O (bank 4) |
| Chân 105 | I/O — User I/O (bank 4) |
| Chân 106 | I/O — User I/O (bank 4) |
| Chân 107 | I/O — User I/O (bank 4) |
| Chân 108 | I/O — User I/O (bank 4) |
| Chân 109 | GND — Ground |
| Chân 110 | I/O — User I/O (bank 4) |
| Chân 111 | I/O — User I/O (bank 4) |
| Chân 112 | I/O — User I/O (bank 4) |
| Chân 113 | I/O — User I/O (bank 4) |
| Chân 114 | I/O — User I/O (bank 4) |
| Chân 115 | I/O — User I/O (bank 4) |
| Chân 116 | I/O — User I/O (bank 4) |
| Chân 117 | VCCINT — Core supply (2.5 V) |
| Chân 118 | I/O — User I/O (bank 1) |
| Chân 119 | I/O — User I/O (bank 1) |
| Chân 120 | I/O — User I/O (bank 1) |
| Chân 121 | I/O — User I/O (bank 1) |
| Chân 122 | I/O — User I/O (bank 1) |
| Chân 123 | GND — Ground |
| Chân 124 | MSEL0 — Configuration mode select 0 |
| Chân 125 | MSEL1 — Configuration mode select 1 |
| Chân 126 | nSTATUS — Configuration status (open-drain) |
| Chân 127 | nCONFIG — Configuration control (active-low) |
| Chân 128 | CONF_DONE — Configuration complete (open-drain) |
| Chân 129 | TCK — JTAG test clock |
| Chân 130 | TMS — JTAG test mode select |
| Chân 131 | TDI — JTAG test data in |
| Chân 132 | TDO — JTAG test data out |
| Chân 133 | VCCINT — Core supply (2.5 V) |
| Chân 134 | I/O — User I/O (bank 1) |
| Chân 135 | I/O — User I/O (bank 1) |
| Chân 136 | I/O — User I/O (bank 1) |
| Chân 137 | I/O — User I/O (bank 1) |
| Chân 138 | I/O — User I/O (bank 1) |
| Chân 139 | I/O — User I/O (bank 1) |
| Chân 140 | GND — Ground |
| Chân 141 | I/O — User I/O (bank 1) |
| Chân 142 | I/O — User I/O (bank 1) |
| Chân 143 | I/O — User I/O (bank 1) |
| Chân 144 | I/O — User I/O (bank 1) |
Ứng dụng tiêu biểu
EP20K100CF144C9 phù hợp cho 6 Áp dụngs: High-Speed Glue Logic Replacement, Custom Bus Interface Bridging, ASIC Prototyping and Emulation, Industrial Control Signal Conditioning, DSP Pipeline Implementation, Telecom Protocol Converter.
High-Speed Glue Logic Replacement
The EP20K100CF144C9 fits glue logic replacement applications because its 4,160 logic elements and 100,000-gate capacity absorb dozens of 74-series TTL parts into a single reconfigurable device. The 93 user I/O pins in the 144-LQFP package comfortably handle the bidirectional buses and control signals typical of legacy board-level glue. Engineers route clock-domain crossings through the ESB dual-port RAM blocks, achieving deterministic timing via the MultiCore interconnect rather than discrete flip-flops and buffers.
Được đề xuất
Custom Bus Interface Bridging
The EP20K100CF144C9 bridges PCI, VME, or proprietary local buses by mapping bus protocols into the 53,248 bits of embedded ESB RAM, with the LAB fabric handling address decoding and bus arbitration. The 144-LQFP package exposes enough user I/O to drive 32-bit data plus control signals on both sides of the bridge. Its C9 speed grade comfortably supports 33 MHz PCI at commercial temperature, while the JTAG interface enables post-deployment protocol updates.
Được đề xuất
ASIC Prototyping and Emulation
Engineers prototype ASIC designs on the EP20K100CF144C9 because its 100K-gate capacity emulates mid-complexity ASICs before committing to mask sets. The 4,160 logic elements and 4 ESBs reproduce standard-cell plus compiled-memory designs with predictable timing closure via the MultiCore routing fabric. The 144-LQFP package's 0.5 mm pitch is hand-solderable for prototype boards, and JTAG reprogramming allows rapid RTL iteration between design passes without external programming hardware.
Được đề xuất
Industrial Control Signal Conditioning
The EP20K100CF144C9 handles industrial control signal conditioning by combining logic-level translation, debouncing, and protocol conversion in a single device. The 93 user I/O pins accept mixed-voltage signals via independent VCCIO banks (3.3 V / 2.5 V / 1.8 V), eliminating external level shifters. ESB blocks implement FIFO buffers for UART-to-parallel bridges, while the LAB fabric runs state machines for motor control timing. Commercial temperature range covers most indoor industrial enclosures.
Được đề xuất
DSP Pipeline Implementation
The EP20K100CF144C9 implements moderate-complexity DSP pipelines such as FIR filters, FFT pre-processors, and modulation codecs using the 4,160 logic elements for datapath arithmetic and the 4 ESBs for coefficient storage and delay lines. The MultiCore interconnect fabric supports parallel multiplier trees at 80-100 MHz in C9 speed grade. Its 144-LQFP package fits within the 1.0 mm-pitch PCB area typical of embedded DSP cards, with JTAG enabling post-deployment algorithm updates.
Được đề xuất
Telecom Protocol Converter
The EP20K100CF144C9 fits telecom protocol conversion between legacy TDM and packet networks because its 53,248 bits of embedded RAM store frame buffers and lookup tables for protocol translation. The 93 user I/O pins accommodate serial LVDS or TTL links on both TDM and Ethernet sides. Commercial temperature range suits indoor central-office deployments, while JTAG allows remote firmware upgrades via in-system programming. C9 timing supports standard E1/T1 line rates comfortably.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP20K100CF144C9 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP20K100CF144C8 | EP20K100CF144C8ES | EP20K100CF144C7 | EP20K100CF144C7ES | EP20K100CB356C9 |
|---|---|---|---|---|---|---|
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 356-BGA - different (requires PCB rework) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Speed Grade | C9 (commercial) | C8 (faster) | C8 (faster) | C7 (fastest) | C7 (fastest) | C9 (same as target) |
| Embedded System Blocks (ESBs) | 4 | 4 | 4 | 4 | 4 | 4 |
| Embedded RAM Bits | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 |
| Configuration Method | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG |
Bảo phân biệt quan trọng
- LQFP-144 footprint is hand-solderable for prototyping (vsEP20K100CB356C9 (356-BGA package))
- C9 speed grade is the lowest-cost bin in the family (vsEP20K100CF144C8 (C8 speed grade))
- Embedded System Blocks (ESBs) replace external SRAM/FIFO chips (vsEP20K100CF144C7 with external memory)
Ghi chú thiết kế
The APEX-20K EP20K100 requires a clean 2.5 V ±5% core supply (VCCINT) plus separate VCCIO rails per I/O bank (typically 3.3 V, 2.5 V, or 1.8 V). Place a 0.1 µF X7R ceramic decoupling capacitor within 5 mm of every VCCINT pin pair, and add a 10 µF bulk capacitor per voltage domain. Estimated: at 100% logic utilization with 93 I/O toggling at 50 MHz, ICCINT can reach 250-400 mA - design the regulator with at least 20% headroom and use a low-ESR bulk cap to suppress 100 kHz ripple.
The 144-LQFP package has a 0.5 mm lead pitch requiring fine-pitch PCB layout: keep trace width ≤ 0.15 mm and via pads ≤ 0.3 mm to escape cleanly from inner rows. Match trace lengths on clock and JTAG signals within 2-3 mm to preserve timing margins. Per the APEX-20K datasheet, the LQFP-144 footprint is hand-solderable with a fine-tipped iron, but production assembly should use reflow profiles per JEDEC J-STD-020 for moisture sensitivity level handling.
Do not confuse MSEL0/MSEL1 strapping between Active Serial (AS), Passive Serial (PS), and JTAG-only modes - wrong strapping causes configuration failure with CONF_DONE stuck low. Per the APEX-20K datasheet, the nCONFIG and nSTATUS pins are open-drain and require external pull-ups to VCCIO. Common pitfall: leaving JTAG pins floating - tie TDI and TMS high through 10 kΩ resistors to prevent spurious boundary-scan activity during power-up.
APEX-20K I/O edges are sub-2 ns - route high-speed signals over a continuous reference plane (ground preferred) and use 22-33 Ω series damping resistors at the source for stubs exceeding 25 mm. Per the APEX-20K datasheet, LVTTL outputs can drive 24 mA but produce ground bounce when switched simultaneously; stagger critical clocks by 2-4 ns using the LAB input delay chains to break simultaneity.
Thông tin tuân thủ
Compliance status not stated in the verified distributor snippets; refer to the official Intel APEX-20K datasheet and material declaration documents for RoHS / lead-free / halogen-free status. AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive-qualified part.