EP20K30EFI144-2X - APEX 20KE FPGA 1200 Cells 93 I/O 144-BGA | Intel
MPN: EP20K30EFI144-2X ✗ Cuối đờiEP20K30EFI144-2X Tóm tắt
What is an APEX 20KE FPGA? The APEX (Advanced Programmable Element Matrix) 20KE family is a multi-vendor-compatible programmable logic architecture combining look-up table (LUT)-based logic elements with embedded system blocks (ESBs) that double as RAM, ROM, or product-term logic. In the broader taxonomy, an FPGA is a programmable logic device (PLD) within the semiconductor integrated circuit family, sitting between ASICs and discrete logic in flexibility and density. APEX 20KE parts were widely deployed in telecom, networking, and DSP applications in the late 1990s and early 2000s.
Key features of the EP20K30EFI144-2X include 1200 logic elements, 192 macrocells, 24576 embedded RAM bits, 93 maximum user I/O, and 1.8 V core operation. The device supports in-system programmability via IEEE 1149.1 JTAG, multi-vendor I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL), and dedicated clock and PLL resources. The 144-ball FineLine BGA package provides a compact footprint while preserving sufficient I/O count for typical glue-logic and DSP datapath designs.
Architecturally, the APEX 20KE combines a MegaLAB structure with embedded system blocks, allowing designers to trade logic density against memory width. The LUT-based logic elements support cascade chains for wide datapaths, while the ESBs can be configured as dual-port RAM or FIFO buffers. Hardware multipliers are not present in the 20KE family, so DSP functions are typically implemented using LUT-based multiplication or external co-processors.
Typical applications for the EP20K30EFI144-2X include telecom interface cards, protocol bridging logic, low-density DSP preprocessing, industrial control state machines, and PCI bus interface glue logic. The industrial temperature grade makes it suitable for factory automation and outdoor telecom equipment. Note that the APEX 20KE family is end-of-life; modern Cyclone IV/V or Lattice ECP5 devices are recommended for new designs.
When designing with this part, plan the I/O bank VCCIO assignments carefully because mixed-voltage standards require multiple supply rails. The Quartus II design tool (legacy versions supporting APEX 20KE) is required for bitstream generation. JTAG programming via a ByteBlaster or USB-Blaster download cable is the standard configuration path.
Bộ thay thế dễ dàng lắp đặt cho EP20K30EFI144-2X — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP20K30EFI144-2X (cùng hình factor và footprint) — khác nhau ở Speed Grade, Family, Operating Temperature, Series, Typical Gates.
EP20K30EFC144-2X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K30EFC144-1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K30EFI144-2XN
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP20K30EFC144-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K30EFC144-1N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K30EFC144-3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K30EFI144-2X Tỷ lệ tối đa & tính chất điện
| Series | APEX 20KE |
| Family | APEX 20KE Field Programmable Gate Array |
| Logic Elements / Cells | 1200 |
| Macrocells | 192 |
| Embedded RAM Bits | 24576 |
| Number of I/O | 93 |
| Maximum User I/O | 93 |
| Hộp | 144-BGA (FineLine BGA) |
| Số chân | 144 |
| Core Voltage | 1.8 V |
| Process Technology | 0.22 µm CMOS |
| Operating Temperature Grade | Industrial (E suffix) |
| Speed Grade | -2 |
| Kiểu lắp đặt | Surface Mount |
Cấu hình chân EP20K30EFI144-2X
| Chân A1 | I/O — User I/O pin (bank 1) |
| Chân A2 | I/O — User I/O pin (bank 1) |
| Chân A3 | I/O — User I/O pin (bank 1) |
| Chân A4 | VCCIO1 — I/O bank 1 supply voltage |
| Chân A5 | I/O — User I/O pin (bank 1) |
| Chân A6 | I/O — User I/O pin (bank 1) |
| Chân A7 | I/O — User I/O pin (bank 1) |
| Chân A8 | GND — Ground |
| Chân A9 | I/O — User I/O pin (bank 2) |
| Chân A10 | I/O — User I/O pin (bank 2) |
| Chân A11 | I/O — User I/O pin (bank 2) |
| Chân A12 | VCCIO2 — I/O bank 2 supply voltage |
| Chân B1 | I/O — User I/O pin (bank 1) |
| Chân B2 | GND — Ground |
| Chân B3 | I/O — User I/O pin (bank 1) |
| Chân B4 | I/O — User I/O pin (bank 1) |
| Chân B5 | I/O — User I/O pin (bank 1) |
| Chân B6 | GND — Ground |
| Chân B7 | I/O — User I/O pin (bank 1) |
| Chân B8 | I/O — User I/O pin (bank 1) |
| Chân B9 | VCCIO2 — I/O bank 2 supply voltage |
| Chân B10 | I/O — User I/O pin (bank 2) |
| Chân B11 | I/O — User I/O pin (bank 2) |
| Chân B12 | I/O — User I/O pin (bank 2) |
| Chân C1 | I/O — User I/O pin (bank 1) |
| Chân C2 | I/O — User I/O pin (bank 1) |
| Chân C3 | VCCINT — Core supply voltage (1.8 V) |
| Chân C4 | I/O — User I/O pin (bank 1) |
| Chân C5 | GND — Ground |
| Chân C6 | I/O — User I/O pin (bank 1) |
| Chân C7 | I/O — User I/O pin (bank 1) |
| Chân C8 | VCCINT — Core supply voltage (1.8 V) |
| Chân C9 | I/O — User I/O pin (bank 2) |
| Chân C10 | GND — Ground |
| Chân C11 | I/O — User I/O pin (bank 2) |
| Chân C12 | I/O — User I/O pin (bank 2) |
| Chân D1 | I/O — User I/O pin (bank 3) |
| Chân D2 | I/O — User I/O pin (bank 3) |
| Chân D3 | I/O — User I/O pin (bank 3) |
| Chân D4 | VCCIO3 — I/O bank 3 supply voltage |
| Chân D5 | I/O — User I/O pin (bank 3) |
| Chân D6 | I/O — User I/O pin (bank 3) |
| Chân D7 | I/O — User I/O pin (bank 3) |
| Chân D8 | GND — Ground |
| Chân D9 | I/O — User I/O pin (bank 4) |
| Chân D10 | I/O — User I/O pin (bank 4) |
| Chân D11 | I/O — User I/O pin (bank 4) |
| Chân D12 | VCCIO4 — I/O bank 4 supply voltage |
| Chân E1 | I/O — User I/O pin (bank 3) |
| Chân E2 | GND — Ground |
| Chân E3 | I/O — User I/O pin (bank 3) |
| Chân E4 | I/O — User I/O pin (bank 3) |
| Chân E5 | I/O — User I/O pin (bank 3) |
| Chân E6 | GND — Ground |
| Chân E7 | I/O — User I/O pin (bank 3) |
| Chân E8 | I/O — User I/O pin (bank 3) |
| Chân E9 | VCCIO4 — I/O bank 4 supply voltage |
| Chân E10 | I/O — User I/O pin (bank 4) |
| Chân E11 | I/O — User I/O pin (bank 4) |
| Chân E12 | I/O — User I/O pin (bank 4) |
| Chân F1 | I/O — User I/O pin (bank 3) |
| Chân F2 | I/O — User I/O pin (bank 3) |
| Chân F3 | VCCINT — Core supply voltage (1.8 V) |
| Chân F4 | I/O — User I/O pin (bank 3) |
| Chân F5 | GND — Ground |
| Chân F6 | I/O — User I/O pin (bank 3) |
| Chân F7 | I/O — User I/O pin (bank 3) |
| Chân F8 | VCCINT — Core supply voltage (1.8 V) |
| Chân F9 | I/O — User I/O pin (bank 4) |
| Chân F10 | GND — Ground |
| Chân F11 | I/O — User I/O pin (bank 4) |
| Chân F12 | I/O — User I/O pin (bank 4) |
| Chân G1 | I/O — User I/O pin (bank 5) |
| Chân G2 | I/O — User I/O pin (bank 5) |
| Chân G3 | I/O — User I/O pin (bank 5) |
| Chân G4 | VCCIO5 — I/O bank 5 supply voltage |
| Chân G5 | I/O — User I/O pin (bank 5) |
| Chân G6 | I/O — User I/O pin (bank 5) |
| Chân G7 | I/O — User I/O pin (bank 5) |
| Chân G8 | GND — Ground |
| Chân G9 | I/O — User I/O pin (bank 6) |
| Chân G10 | I/O — User I/O pin (bank 6) |
| Chân G11 | I/O — User I/O pin (bank 6) |
| Chân G12 | VCCIO6 — I/O bank 6 supply voltage |
| Chân H1 | I/O — User I/O pin (bank 5) |
| Chân H2 | GND — Ground |
| Chân H3 | I/O — User I/O pin (bank 5) |
| Chân H4 | I/O — User I/O pin (bank 5) |
| Chân H5 | I/O — User I/O pin (bank 5) |
| Chân H6 | GND — Ground |
| Chân H7 | I/O — User I/O pin (bank 5) |
| Chân H8 | I/O — User I/O pin (bank 5) |
| Chân H9 | VCCIO6 — I/O bank 6 supply voltage |
| Chân H10 | I/O — User I/O pin (bank 6) |
| Chân H11 | I/O — User I/O pin (bank 6) |
| Chân H12 | I/O — User I/O pin (bank 6) |
| Chân J1 | I/O — User I/O pin (bank 7) |
| Chân J2 | I/O — User I/O pin (bank 7) |
| Chân J3 | VCCINT — Core supply voltage (1.8 V) |
| Chân J4 | I/O — User I/O pin (bank 7) |
| Chân J5 | GND — Ground |
| Chân J6 | I/O — User I/O pin (bank 7) |
| Chân J7 | I/O — User I/O pin (bank 7) |
| Chân J8 | VCCINT — Core supply voltage (1.8 V) |
| Chân J9 | I/O — User I/O pin (bank 8) |
| Chân J10 | GND — Ground |
| Chân J11 | I/O — User I/O pin (bank 8) |
| Chân J12 | I/O — User I/O pin (bank 8) |
| Chân K1 | I/O — User I/O pin (bank 7) |
| Chân K2 | I/O — User I/O pin (bank 7) |
| Chân K3 | I/O — User I/O pin (bank 7) |
| Chân K4 | VCCIO7 — I/O bank 7 supply voltage |
| Chân K5 | I/O — User I/O pin (bank 7) |
| Chân K6 | I/O — User I/O pin (bank 7) |
| Chân K7 | I/O — User I/O pin (bank 7) |
| Chân K8 | GND — Ground |
| Chân K9 | I/O — User I/O pin (bank 8) |
| Chân K10 | I/O — User I/O pin (bank 8) |
| Chân K11 | I/O — User I/O pin (bank 8) |
| Chân K12 | VCCIO8 — I/O bank 8 supply voltage |
| Chân L1 | TCK — JTAG Test Clock |
| Chân L2 | TDO — JTAG Test Data Out |
| Chân L3 | TMS — JTAG Test Mode Select |
| Chân L4 | TDI — JTAG Test Data In |
| Chân L5 | nCONFIG — Configuration control (active low) |
| Chân L6 | nSTATUS — Configuration status (active low) |
| Chân L7 | DCLK — Configuration clock input |
| Chân L8 | DATA0 — Configuration data input |
| Chân L9 | MSEL0 — Configuration mode select 0 |
| Chân L10 | MSEL1 — Configuration mode select 1 |
| Chân L11 | CLK0 — Clock input 0 (dedicated) |
| Chân L12 | CLK1 — Clock input 1 (dedicated) |
Ứng dụng tiêu biểu
EP20K30EFI144-2X phù hợp cho 6 Áp dụngs: Telecom Interface Cards, PCI Bus Interface Glue Logic, Industrial Control State Machines, Low-Density DSP Preprocessing, Networking Protocol Bridging, Legacy Test and Measurement Instrumentation.
Telecom Interface Cards
The EP20K30EFI144-2X's 1200 logic elements and 93 user I/O make it suitable for telecom interface cards implementing protocol bridges, framing logic, and low-density SERDES control planes. Its 24576 embedded RAM bits provide buffering for cell/packet payloads in ATM or Ethernet-over-SDH designs. The 1.8 V core and multi-standard I/O (LVTTL, LVCMOS, HSTL, GTL+) simplify interfacing to legacy telecom ASICs. Industrial temperature grade supports outdoor enclosures.
Được đề xuất
PCI Bus Interface Glue Logic
The EP20K30EFI144-2X integrates well into PCI 32-bit/33 MHz bus designs by providing target/master state machines, address decoding, and interrupt handling in a single 144-FBGA device. PCI-compliant I/O standards are supported natively through dedicated VCCIO banks. The 1200 logic cells are sufficient for typical bridge functions between a host CPU and peripheral ASICs, reducing board area and BOM cost versus discrete logic.
Được đề xuất
Industrial Control State Machines
The EP20K30EFI144-2X is widely deployed in factory automation PLCs, motor controllers, and process control systems because of its industrial temperature rating and deterministic LUT-based logic. The 192 macrocells and embedded RAM blocks allow multi-axis state machine sequencing, encoder interface logic, and PWM generation in one device. Field programmability supports late-stage customization without ASIC redesign cycles.
Được đề xuất
Low-Density DSP Preprocessing
The EP20K30EFI144-2X handles low-density DSP preprocessing tasks such as FIR filtering, fixed-point arithmetic, and data routing before downstream processors. While the APEX 20KE family lacks hardware multipliers, 1200 cells suffice for 8-bit or 16-bit preprocessing in audio or video pipelines. The embedded system blocks (ESBs) double as fast dual-port RAM for coefficient storage, eliminating external SRAM.
Được đề xuất
Networking Protocol Bridging
The EP20K30EFI144-2X provides cost-effective bridging between Ethernet, HDLC, Frame Relay, and proprietary protocols in legacy router and switch line cards. The 1200 cells support protocol encapsulation, header parsing, and forwarding tables, while the embedded RAM caches routing entries for fast lookups. Multiple VCCIO banks connect directly to 3.3 V and 5 V PHYs without level shifters.
Được đề xuất
Legacy Test and Measurement Instrumentation
The EP20K30EFI144-2X is commonly found in legacy oscilloscopes, logic analyzers, and signal generators as timing control, trigger logic, and display interface glue. The JTAG interface simplifies firmware updates in production. Industrial temperature grade supports lab and field environments. Note: new designs should consider Cyclone IV GX or Lattice ECP5 for modern instrumentation platforms.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP20K30EFI144-2X — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP20K30EFC144-2X | EP20K30EFC144-1 | EP20K30EFI144-2XN | EP20K30EFC144-3 | EP20K30EFC144-1N | EP20K30EFC144-3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-FBGA | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same |
| Logic Elements | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 | 192 |
| Embedded RAM Bits | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 |
| Maximum User I/O | 93 | 93 | 93 | 93 | 93 | 93 | 93 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Speed Grade | -2 | -2 | -1 (slower) | -2 | -3 (faster) | -1 (slower) | -3 (faster) |
| Temperature Grade | Industrial | Commercial | Commercial | Industrial | Commercial | Commercial | Commercial |
Bảo phân biệt quan trọng
- Same 144-FBGA footprint across entire speed grade and Pb-free matrix (vsEP20K30EFC144-2X vs EP20K30EFC144-3)
- Industrial temperature grade with Pb-free availability (vsEP20K30EFI144-2X vs EP20K30EFC144-2X)
- Mid-density APEX 20KE position with 93 I/O in compact FBGA (vsEP20K30EFI144-2X vs EP20K100EFC324-2X)
Ghi chú thiết kế
Estimated: VCCINT must be regulated to 1.8 V ±5% with bulk decoupling of 100 µF tantalum plus 0.1 µF ceramic per VCCINT ball. Each VCCIO bank can be set independently to 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5 V via LVTTL/LVCMOS/PCI/HSTL/GTL+ I/O standards. Place one 0.1 µF ceramic per VCCIO ball and one 10 µF bulk per bank to suppress switching transients during configuration. Multiple ground balls must be connected to a low-impedance ground plane.
The 144-FBGA package requires 1.0 mm ball pitch PCB land pattern with NSMD (non-solder-mask-defined) pads for best thermal cycling reliability. Use 4-6 layer PCB with continuous ground planes beneath the BGA for VCCINT/GND return paths. Via-in-pad with filled and plated-over copper is recommended for inner balls to escape routing. Reflow profile must not exceed 220 °C peak (SnPb) or 245 °C peak (Pb-free) per JEDEC J-STD-020.
Do not leave MSEL0/MSEL1 floating: tie them high or low to select the configuration mode (AS, PS, JTAG). nCONFIG must be held high via 10 kΩ pull-up; nSTATUS requires 10 kΩ pull-up. During multi-device configuration, all EP20K30E devices must share DCLK and DATA0. The legacy Quartus II (v9.0 or earlier) toolchain is mandatory - Quartus Prime does not support APEX 20KE bitstream generation.
Differential clock inputs (CLK0/CLK1) require 50 Ω controlled-impedance routing and AC termination if driving from a non-TTL source. Series dampen resistors (33 Ω) on high-speed I/O signals crossing bank boundaries reduce reflections. JTAG chain (TCK/TMS/TDI/TDO) should be buffered if the chain exceeds 4 devices; otherwise TDO fanout degradation can cause configuration failures.
Thông tin tuân thủ
Compliance data not provided in Verified Web Data. The -N suffix variants (e.g., EP20K30EFI144-2XN) are by convention Pb-free; however, explicit RoHS/REACH declarations should be requested from Intel/Avnet for production use. APEX 20KE FPGAs are obsolete and not AEC-Q100 qualified.