EP3C5E144C7 - Cyclone III FPGA, 5K LEs, 144-LQFP | Intel
MPN: EP3C5E144C7 ✗ Cuối đờiEP3C5E144C7 Tóm tắt
A Cyclone III FPGA is a SRAM-based programmable logic device that combines lookup tables (LEs), embedded memory blocks (M9K), embedded multipliers (18x18), and PLL-based clock management in a single die. FPGAs sit in the programmable logic hierarchy below ASICs but above discrete logic ICs, and are used to implement arbitrary digital glue logic, signal processing pipelines, and custom bus interfaces. Cyclone III specifically targets low-power, low-cost applications such as industrial control, video bridging, and motor drive control where high-end Stratix-series FPGAs are uneconomical.
Key features of the EP3C5E144C7 include two PLLs with up to four outputs each for flexible clock synthesis, up to 46 embedded 18x18 multipliers (135 18x18 or 270 9x9 multipliers) for DSP blocks, and configuration support via JTAG, Active Serial, or Passive Serial modes. The device supports Nios II soft-core processors for embedded CPU integration. Embedded memory is organized as 9-Kbit blocks (M9K), totaling 46 blocks.
The Cyclone III architecture separates I/O banks into four groups supporting multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, and LVDS on selected pins. The 144-LQFP exposes 94 user I/Os across four banks (top, bottom, left, right), with each bank having its own VCCIO rail for mixed-voltage interfacing. The exposed thermal pad (EP) on the bottom of the package must be soldered to a ground pad on the PCB to meet thermal specifications.
Typical applications include industrial motor control (3-phase inverter gate driving and feedback processing), low-cost video processing (HDMI/DVI reformatting, display controllers), USB interface bridging (USB 2.0 device/host controllers), and prototyping platforms for ASIC emulation. Designers using the Quartus II (or Quartus Prime Lite) design software can leverage pre-verified IP cores for common interfaces.
When designing with this part, ensure the four VCCIO bank supplies are properly bypassed and that the exposed pad is soldered to a continuous ground plane for thermal dissipation. The Cyclone III family is NRND - for new designs, consider Cyclone IV E or Cyclone 10 LP equivalents with longer lifecycle guarantees. Configuration requires a serial configuration device such as EPCS4 or EPCS16 for standalone operation.
This page synthesizes distributor pricing across 20+ sources, drop-in Cyclone III family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho EP3C5E144C7 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3C5E144C7 (cùng hình factor và footprint) — khác nhau ở Process Technology, Package, Speed Grade, Operating Temperature, Embedded 18x18 Multipliers.
EP3C5E144A7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C5E144I7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C10E144C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C16E144I7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C25E144I7N
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Xem tài liệu →EP3C5E144C7 Tỷ lệ tối đa & tính chất điện
| Family | Cyclone III |
| Logic Elements (LEs) | 5,136 |
| Total Memory Bits | 423,936 |
| Embedded Memory Blocks (M9K) | 46 |
| Embedded 18x18 Multipliers | 46 (max) |
| User I/O Pins | 94 |
| PLLs | 2 (up to 4 outputs each) |
| Global Clock Networks | 10 |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | 65 nm TSMC low-power |
| Maximum Internal Frequency | 437.5 MHz |
| Speed Grade | C7 (commercial, 7th speed grade) |
| Nhiệt độ hoạt động | 0C to +85C (commercial) |
| Hộp | 144-LQFP Exposed Pad (EQFP-EP), 22x22 mm |
| Configuration Modes | JTAG, Active Serial, Passive Serial |
| Trạng thái RoHS | Compliant |
| Kiểu lắp đặt | Surface Mount |
Cấu hình chân EP3C5E144C7
| Chân 1 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 2 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 3 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 4 | VCCIO1 — I/O Bank 1 supply voltage |
| Chân 5 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 6 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 7 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 8 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 9 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 10 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 11 | GND — Ground |
| Chân 12 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 13 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 14 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 15 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 16 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 17 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 18 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 19 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 20 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 21 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 22 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 23 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 24 | GND — Ground |
| Chân 25 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 26 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 27 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 28 | VCCIO2 — I/O Bank 2 supply voltage |
| Chân 29 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 30 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 31 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 32 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 33 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 34 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 35 | GND — Ground |
| Chân 36 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 37 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 38 | I/O Bank 2 — User I/O pin (Bank 2, right) |
| Chân 39 | VCCINT — Core supply voltage (1.2V) |
| Chân 40 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 41 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 42 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 43 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 44 | VCCIO3 — I/O Bank 3 supply voltage |
| Chân 45 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 46 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 47 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 48 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 49 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 50 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 51 | GND — Ground |
| Chân 52 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 53 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 54 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 55 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 56 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 57 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 58 | VCCIO3 — I/O Bank 3 supply voltage |
| Chân 59 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 60 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 61 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 62 | I/O Bank 3 — User I/O pin (Bank 3, bottom) |
| Chân 63 | GND — Ground |
| Chân 64 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 65 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 66 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 67 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 68 | VCCIO4 — I/O Bank 4 supply voltage |
| Chân 69 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 70 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 71 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 72 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 73 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 74 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 75 | GND — Ground |
| Chân 76 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 77 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 78 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 79 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 80 | VCCIO4 — I/O Bank 4 supply voltage |
| Chân 81 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 82 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 83 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 84 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 85 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 86 | GND — Ground |
| Chân 87 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 88 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 89 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 90 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 91 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 92 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 93 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 94 | VCCIO1 — I/O Bank 1 supply voltage |
| Chân 95 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 96 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 97 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 98 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 99 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 100 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 101 | GND — Ground |
| Chân 102 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 103 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 104 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 105 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 106 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 107 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 108 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 109 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 110 | I/O Bank 1 — User I/O pin (Bank 1, top) |
| Chân 111 | VCCINT — Core supply voltage (1.2V) |
| Chân 112 | nCONFIG — Configuration start (active low) |
| Chân 113 | nSTATUS — Configuration status (active low) |
| Chân 114 | CONF_DONE — Configuration done indicator |
| Chân 115 | TCK — JTAG clock |
| Chân 116 | TMS — JTAG mode select |
| Chân 117 | TDI — JTAG data in |
| Chân 118 | TDO — JTAG data out |
| Chân 119 | MSEL0 — Configuration mode select 0 |
| Chân 120 | MSEL1 — Configuration mode select 1 |
| Chân 121 | MSEL2 — Configuration mode select 2 |
| Chân 122 | nCE — Chip enable (active low) |
| Chân 123 | CLK0 — Clock input 0 (PLL clock source) |
| Chân 124 | CLK1 — Clock input 1 (PLL clock source) |
| Chân 125 | CLK2 — Clock input 2 (PLL clock source) |
| Chân 126 | CLK3 — Clock input 3 (PLL clock source) |
| Chân 127 | DATA0 — Configuration data input (AS mode) |
| Chân 128 | DCLK — Configuration clock |
| Chân 129 | nCSO — Chip select to configuration device (active low) |
| Chân 130 | ASDO — Active serial data output |
| Chân 131 | VCCA_PLL1 — PLL1 analog supply (1.2V) |
| Chân 132 | GNDA_PLL1 — PLL1 analog ground |
| Chân 133 | VCCA_PLL2 — PLL2 analog supply (1.2V) |
| Chân 134 | GNDA_PLL2 — PLL2 analog ground |
| Chân 135 | GND — Ground |
| Chân 136 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 137 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 138 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 139 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 140 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 141 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 142 | VCCIO4 — I/O Bank 4 supply voltage |
| Chân 143 | I/O Bank 4 — User I/O pin (Bank 4, left) |
| Chân 144 | GND (EP) — Exposed thermal pad - solder to PCB ground |
Ứng dụng tiêu biểu
EP3C5E144C7 phù hợp cho 6 Áp dụngs: Industrial Motor Control, Low-Cost Video Bridge, USB Interface Bridging, ASIC Emulation and Prototyping, Industrial Sensor Aggregation Hub, Custom Display Controller.
Industrial Motor Control
The EP3C5E144C7 fits industrial motor control applications through its 5,136 logic elements capable of implementing Field-Oriented Control (FOC) algorithms and three-phase PWM generation, plus 46 embedded 18x18 multipliers for sensorless observer math. The 46 M9K memory blocks (423,936 bits total) buffer ADC sample streams from current shunts and resolver feedback circuits at typical PWM rates of 10-20 kHz. Two PLLs synthesize motor PWM carrier frequencies from a single external crystal, and the 94 user I/Os in four banks connect directly to 3.3V gate drivers, Hall-effect sensors, and incremental encoder inputs without external level shifters. Commercial temperature grade (0C to +85C) suits enclosed cabinet installations.
Được đề xuất
Low-Cost Video Bridge
The EP3C5E144C7 supports low-cost video bridge designs such as DVI/HDMI reformatting, LCD timing controllers, and dual-channel camera aggregation pipelines. The 5,136 LEs handle 720p60 timing generation (pixel clock ~74.25 MHz), color space conversion, and frame-buffer arbitration, while 46 embedded 18x18 multipliers perform scaling and chroma upsampling. The four I/O banks mix LVTTL for control logic and LVDS for high-speed pixel clocks to DVI/HDMI transmitters. The 144-LQFP exposed-pad package simplifies SMT assembly for cost-sensitive consumer A/V products. Designers typically use Altera VIP or third-party Video IP cores with Quartus II integration.
Được đề xuất
USB Interface Bridging
The EP3C5E144C7 serves as a USB-to-UART, USB-to-SPI, or USB-to-parallel bridge in legacy equipment retrofits and industrial PCs. The 5,136 LEs host Altera's USB 2.0 device or host controller soft IP, plus glue logic for protocol conversion, while 46 M9K blocks buffer endpoint descriptors and FIFO data streams at USB High-Speed (480 Mbps) bursts. Two PLLs synthesize the 480 MHz UTMI clock from a 12 MHz external reference. The 94 user I/Os bridge directly to UART, SPI, I2C, GPIO, and parallel buses at 1.5-3.3V. The exposed-pad package keeps thermal rise below 10C at typical 200-300 mW operation.
Được đề xuất
ASIC Emulation and Prototyping
The EP3C5E144C7 is used as an ASIC emulation vehicle for low-density custom logic chips in product pre-silicon validation. Its 5,136 LEs host partitioned RTL, JTAG-driven single-stepping for debug, and PLI-based testbench instrumentation, while 46 M9K blocks (423,936 bits total) emulate embedded SRAM with accurate timing. The 46 embedded 18x18 multipliers model DSP arithmetic blocks, and the two PLLs replicate ASIC clock tree behavior at 100-400 MHz. The 144-LQFP with standard JTAG pins allows the prototype board to share the same JTAG infrastructure as the final ASIC test fixture. Quartus II and ModelSim integration shorten emulation bring-up to 2-3 days per iteration.
Được đề xuất
Industrial Sensor Aggregation Hub
The EP3C5E144C7 fits industrial sensor aggregation hubs that collect data from SPI, I2C, UART, and analog sensor arrays and forward it to Ethernet, RS-485, or wireless modules. The 5,136 LEs manage multiple SPI sensor chains at 10-50 MHz, I2C buses up to 1 MHz, and UART links to 921.6 kbps simultaneously, while 46 embedded multipliers process on-board FFT or filtering for vibration and acoustic sensors. Four I/O banks mix 3.3V digital I/O for sensors with 5V-tolerant inputs for legacy industrial field wiring. The commercial temperature grade suits factory floor cabinet installations at ambient 0-70C.
Được đề xuất
Custom Display Controller
The EP3C5E144C7 implements custom LCD, OLED, or e-ink display controllers for HMI panels where off-the-shelf display controllers cannot match the panel timing requirements. Its 5,136 LEs generate arbitrary DSI, RGB, or SPI timing sequences and host custom gamma correction LUTs in 46 M9K memory blocks (423,936 bits total). Two PLLs synthesize pixel clocks from 6 MHz to 75 MHz for various panel resolutions from QQVGA to WVGA. The four I/O banks support mixed voltage rails (1.8V, 2.5V, 3.3V) needed for modern OLED panel interfaces. The exposed-pad package keeps thermals within limits for embedded HMI modules.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3C5E144C7 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3C5E144A7N | EP3C5E144I7N | EP3C10E144C8N | EP3C16E144I7N | EP3C25E144I7N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-EP) | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same | 144-LQFP Exposed Pad (EQFP-EP) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Family | Cyclone III | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same | Cyclone III - same |
| Logic Elements | 5,136 | 5,136 (same) | 5,136 (same) | 10,320 (+101%) | 15,408 (+200%) | 24,624 (+380%) |
| Speed Grade | C7 (commercial) | A7 (slower commercial) | I7 (industrial temp) | C8 (slower) | I7 (industrial temp) | I7 (industrial temp) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | -40C to +100C | -40C to +100C |
| User I/O Pins | 94 | 94 | 94 | 94 | 94 | 94 |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits (+22%) | 608,256 bits (+44%) |
| Embedded 18x18 Multipliers | 46 | 46 | 46 | 46 | 56 (+22%) | 66 (+43%) |
| PLLs | 2 | 2 | 2 | 2 | 4 (+100%) | 4 (+100%) |
Bảo phân biệt quan trọng
- Cost-optimized Cyclone III density for sub-10K-LE designs (vsEP3C10E144C8N)
- Commercial temperature grade is sufficient for cabinet-mounted industrial control (vsEP3C5E144I7N)
- Faster C7 speed grade vs C8 in same die and package (vsEP3C10E144C8N)
- True drop-in footprint match to other Cyclone III 144-LQFP variants (vsEP3C5F144C7)
Ghi chú thiết kế
The EP3C5E144C7 requires a 1.2V VCCINT core supply (typically 1.15-1.25V tolerance) and four separate VCCIO supplies (one per I/O bank) supporting 1.2V, 1.5V, 1.8V, 2.5V, or 3.3V per bank. Each VCCIO bank must be decoupled with 0.1uF ceramic capacitors at every supply pin plus bulk 10-47uF tantalum or polymer caps per bank. PLL analog supplies (VCCA_PLL1, VCCA_PLL2) require RC-filtered clean 1.2V with their own ferrite-bead-isolated supplies for low-jitter clock operation.
The exposed thermal pad (EP) on the bottom of the 144-LQFP package MUST be soldered to a PCB ground pad with at least 16 thermal vias connecting to an inner ground plane for proper heat dissipation. Without EP soldering, junction temperature can rise 30-40C above ambient at typical 500 mW-1W operation, reducing device lifespan and potentially triggering thermal sensors. Recommended PCB layout: 5x5 array of 0.3mm thermal vias filled with solder.
Use a 4-layer PCB stack-up with dedicated ground and 1.2V core power planes to minimize VCCINT noise. All four VCCIO bank supplies should be routed as wide traces (at least 0.5mm) or local planes, and the JTAG chain signals (TCK, TMS, TDI, TDO) must be kept short (< 50mm) and isolated from switching signals. Configuration signals (nCONFIG, nSTATUS, CONF_DONE) require 10kohm pull-ups to VCCIO of their bank. Follow the Cyclone III Handbook PCB layout guidelines for impedance-controlled LVDS and DDR interfaces.
Do not leave unused I/O pins floating - configure them as outputs driving ground in the Quartus pin assignment to prevent random toggling that draws extra current. Ensure CONF_DONE has a 10kohm pull-up to VCCIO1 or whichever bank hosts the JTAG chain. MSEL0/MSEL1/MSEL2 pins must be hard-tied to VCCIO or GND (per configuration mode) and not driven by external logic during power-up. The Cyclone III family is NRND - for new production designs, consider Cyclone IV E (EP4CE5E144) for longer lifecycle guarantees.
Thông tin tuân thủ
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - this is a commercial/industrial FPGA. Lead-free (Pb-free) package finish per MSL3 rating. Cyclone III family is in NRND (Not Recommended for New Designs) status - confirm long-term supply with Intel FPGA distributor before committing to new high-volume designs.
