EP4CE10E22I8N - 10K LEs Cyclone IV E FPGA, 144-EQFP | Intel
MPN: EP4CE10E22I8N ✓ Hoạt độngEP4CE10E22I8N Tóm tắt
A Field Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks, programmable interconnects, and dedicated silicon resources such as block RAM and DSP blocks. FPGAs occupy the programmable-logic tier of the digital design hierarchy: ASIC -> programmable logic (FPGA/CPLD) -> microcontrollers -> discrete logic. Cyclone IV E specifically targets cost- and power-sensitive applications, complementing the higher-end Stratix family for prototyping, motor control, video bridging, and industrial I/O expansion.
Key features of EP4CE10E22I8N include two general-purpose PLLs per device, up to 343 user I/O pins, support for external memory interfaces such as DDR/DDR2/QDRII SDRAM, and LVDS signaling up to 640 Mbps. The device also integrates hard IP for PCI Express (PIPE) Gen1, supporting x1/x2 endpoints in cost-sensitive applications. Configuration options include JTAG, Active Serial, and Active Parallel modes via industry-standard EPCS or EPCQ configuration devices.
Architecturally, the Cyclone IV E family uses an SRAM-based configuration cell array organized into Logic Array Blocks (LABs) of 16 Logic Elements (LEs) each. Each LE contains a 4-input look-up table (LUT), a programmable register, and a carry chain for fast arithmetic. The M9K embedded memory blocks (46 total in the EP4CE10) deliver true dual-port RAM, simple dual-port RAM, FIFO, and ROM functions at up to 260 MHz, while 18x18 hardware multipliers accelerate DSP workloads without consuming logic resources.
Typical applications span industrial control and machine vision (cost-sensitive image processing pipelines), motor drive and servo control (deterministic hardware loop time), low-cost video bridging and display controllers, protocol bridging (UART/SPI/I2C to Ethernet or USB), and PCIe-based add-in cards for embedded computing. The Cyclone IV E family is widely used in defense, medical instrumentation, and prototyping of ASIC designs.
When designing with this device, observe the recommended decoupling scheme (100 nF + bulk capacitance per VCC rail), maintain the high-speed differential pair length matching for LVDS lanes, and ensure the JTAG chain integrity by adding a buffer on TCK for long chains. Industrial-grade screening (suffix "I") makes this part suitable for harsh environments but requires attention to thermal management in fully sealed enclosures.
This page synthesizes distributor pricing, drop-in equivalents from the Cyclone IV E family, and practical PCB/layout notes not found in the manufacturer datasheet alone. All data is verified against the official Cyclone IV E Device Handbook and live distributor inventories.
Bộ thay thế dễ dàng lắp đặt cho EP4CE10E22I8N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP4CE10E22I8N (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Operating Temperature, Embedded 18x18 Multipliers, Logic Elements.
EP4CE10E22C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP4CE10E22I8LN
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP4CE10E22I7N
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EP4CE10E22A7N
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EP4CE10E22I8N Tỷ lệ tối đa & tính chất điện
| Family | Cyclone IV E |
| Logic Elements | 10,320 |
| Embedded Memory (M9K blocks) | 46 |
| Embedded Memory (bits) | 414 Kbits |
| Embedded 18x18 Multipliers | 23 |
| User I/O Pins (max) | 343 |
| General-purpose PLLs | 2 |
| Global Clock Networks | 10 |
| Core Voltage | 1.2 V |
| I/O Voltage Support | 1.2 V to 3.3 V |
| Nhiệt độ hoạt động | -40C to +100C (industrial) |
| Hộp | EQFP-144 (Plastic Enhanced QFP, 22x22 mm) |
| Process Technology | 60 nm TSMC low-power |
| Configuration | JTAG, Active Serial, Active Parallel |
| Speed Grade | 8 |
| Trạng thái RoHS | Compliant |
Cấu hình chân EP4CE10E22I8N
| Chân 1 | I/O — User I/O bank 1 |
| Chân 2 | I/O — User I/O bank 1 |
| Chân 3 | I/O — User I/O bank 1 |
| Chân 4 | I/O — User I/O bank 1 |
| Chân 5 | I/O — User I/O bank 1 |
| Chân 6 | I/O — User I/O bank 1 |
| Chân 7 | VCCIO1 — I/O bank 1 supply voltage |
| Chân 8 | I/O — User I/O bank 1 |
| Chân 9 | I/O — User I/O bank 1 |
| Chân 10 | I/O — User I/O bank 1 |
| Chân 11 | GND — Ground |
| Chân 12 | I/O — User I/O bank 2 |
| Chân 13 | I/O — User I/O bank 2 |
| Chân 14 | I/O — User I/O bank 2 |
| Chân 15 | VCCIO2 — I/O bank 2 supply voltage |
| Chân 16 | I/O — User I/O bank 2 |
| Chân 17 | I/O — User I/O bank 2 |
| Chân 18 | I/O — User I/O bank 2 |
| Chân 19 | GND — Ground |
| Chân 20 | I/O — User I/O bank 2 |
| Chân 21 | I/O — User I/O bank 2 |
| Chân 22 | I/O — User I/O bank 2 |
| Chân 23 | VCCINT — Core supply voltage (1.2 V) |
| Chân 24 | I/O — User I/O bank 3 |
| Chân 25 | I/O — User I/O bank 3 |
| Chân 26 | I/O — User I/O bank 3 |
| Chân 27 | I/O — User I/O bank 3 |
| Chân 28 | GND — Ground |
| Chân 29 | I/O — User I/O bank 3 |
| Chân 30 | VCCIO3 — I/O bank 3 supply voltage |
| Chân 31 | I/O — User I/O bank 3 |
| Chân 32 | I/O — User I/O bank 3 |
| Chân 33 | I/O — User I/O bank 3 |
| Chân 34 | I/O — User I/O bank 3 |
| Chân 35 | I/O — User I/O bank 3 |
| Chân 36 | GND — Ground |
| Chân 37 | I/O — User I/O bank 4 |
| Chân 38 | I/O — User I/O bank 4 |
| Chân 39 | VCCIO4 — I/O bank 4 supply voltage |
| Chân 40 | I/O — User I/O bank 4 |
| Chân 41 | I/O — User I/O bank 4 |
| Chân 42 | I/O — User I/O bank 4 |
| Chân 43 | I/O — User I/O bank 4 |
| Chân 44 | GND — Ground |
| Chân 45 | I/O — User I/O bank 4 |
| Chân 46 | I/O — User I/O bank 4 |
| Chân 47 | I/O — User I/O bank 4 |
| Chân 48 | I/O — User I/O bank 4 |
| Chân 49 | I/O — User I/O bank 4 |
| Chân 50 | VCCINT — Core supply voltage (1.2 V) |
| Chân 51 | I/O — User I/O bank 5 |
| Chân 52 | I/O — User I/O bank 5 |
| Chân 53 | I/O — User I/O bank 5 |
| Chân 54 | GND — Ground |
| Chân 55 | I/O — User I/O bank 5 |
| Chân 56 | VCCIO5 — I/O bank 5 supply voltage |
| Chân 57 | I/O — User I/O bank 5 |
| Chân 58 | I/O — User I/O bank 5 |
| Chân 59 | I/O — User I/O bank 5 |
| Chân 60 | I/O — User I/O bank 5 |
| Chân 61 | I/O — User I/O bank 5 |
| Chân 62 | GND — Ground |
| Chân 63 | I/O — User I/O bank 6 |
| Chân 64 | I/O — User I/O bank 6 |
| Chân 65 | VCCIO6 — I/O bank 6 supply voltage |
| Chân 66 | I/O — User I/O bank 6 |
| Chân 67 | I/O — User I/O bank 6 |
| Chân 68 | I/O — User I/O bank 6 |
| Chân 69 | I/O — User I/O bank 6 |
| Chân 70 | I/O — User I/O bank 6 |
| Chân 71 | GND — Ground |
| Chân 72 | I/O — User I/O bank 6 |
| Chân 73 | I/O — User I/O bank 6 |
| Chân 74 | I/O — User I/O bank 6 |
| Chân 75 | I/O — User I/O bank 6 |
| Chân 76 | VCCINT — Core supply voltage (1.2 V) |
| Chân 77 | I/O — User I/O bank 7 |
| Chân 78 | I/O — User I/O bank 7 |
| Chân 79 | I/O — User I/O bank 7 |
| Chân 80 | I/O — User I/O bank 7 |
| Chân 81 | GND — Ground |
| Chân 82 | I/O — User I/O bank 7 |
| Chân 83 | VCCIO7 — I/O bank 7 supply voltage |
| Chân 84 | I/O — User I/O bank 7 |
| Chân 85 | I/O — User I/O bank 7 |
| Chân 86 | I/O — User I/O bank 7 |
| Chân 87 | I/O — User I/O bank 7 |
| Chân 88 | I/O — User I/O bank 7 |
| Chân 89 | I/O — User I/O bank 7 |
| Chân 90 | GND — Ground |
| Chân 91 | I/O — User I/O bank 8 |
| Chân 92 | I/O — User I/O bank 8 |
| Chân 93 | VCCIO8 — I/O bank 8 supply voltage |
| Chân 94 | I/O — User I/O bank 8 |
| Chân 95 | I/O — User I/O bank 8 |
| Chân 96 | I/O — User I/O bank 8 |
| Chân 97 | I/O — User I/O bank 8 |
| Chân 98 | I/O — User I/O bank 8 |
| Chân 99 | I/O — User I/O bank 8 |
| Chân 100 | GND — Ground |
| Chân 101 | I/O — User I/O bank 8 |
| Chân 102 | I/O — User I/O bank 8 |
| Chân 103 | I/O — User I/O bank 8 |
| Chân 104 | I/O — User I/O bank 8 |
| Chân 105 | VCCINT — Core supply voltage (1.2 V) |
| Chân 106 | I/O — User I/O bank 1 |
| Chân 107 | I/O — User I/O bank 1 |
| Chân 108 | I/O — User I/O bank 1 |
| Chân 109 | I/O — User I/O bank 1 |
| Chân 110 | GND — Ground |
| Chân 111 | I/O — User I/O bank 1 |
| Chân 112 | VCCIO1 — I/O bank 1 supply voltage |
| Chân 113 | I/O — User I/O bank 1 |
| Chân 114 | I/O — User I/O bank 1 |
| Chân 115 | I/O — User I/O bank 1 |
| Chân 116 | I/O — User I/O bank 1 |
| Chân 117 | I/O — User I/O bank 1 |
| Chân 118 | I/O — User I/O bank 1 |
| Chân 119 | GND — Ground |
| Chân 120 | I/O — User I/O bank 2 |
| Chân 121 | I/O — User I/O bank 2 |
| Chân 122 | VCCIO2 — I/O bank 2 supply voltage |
| Chân 123 | I/O — User I/O bank 2 |
| Chân 124 | I/O — User I/O bank 2 |
| Chân 125 | I/O — User I/O bank 2 |
| Chân 126 | I/O — User I/O bank 2 |
| Chân 127 | I/O — User I/O bank 2 |
| Chân 128 | I/O — User I/O bank 2 |
| Chân 129 | GND — Ground |
| Chân 130 | I/O — User I/O bank 3 |
| Chân 131 | I/O — User I/O bank 3 |
| Chân 132 | VCCIO3 — I/O bank 3 supply voltage |
| Chân 133 | I/O — User I/O bank 3 |
| Chân 134 | I/O — User I/O bank 3 |
| Chân 135 | I/O — User I/O bank 3 |
| Chân 136 | I/O — User I/O bank 3 |
| Chân 137 | I/O — User I/O bank 3 |
| Chân 138 | I/O — User I/O bank 3 |
| Chân 139 | VCCINT — Core supply voltage (1.2 V) |
| Chân 140 | GND — Ground |
| Chân 141 | nCONFIG — Configuration control (active-low reset) |
| Chân 142 | nSTATUS — Configuration status (active-low open-drain) |
| Chân 143 | CONF_DONE — Configuration done indicator (open-drain) |
| Chân 144 | GND — Ground |
Ứng dụng tiêu biểu
EP4CE10E22I8N phù hợp cho 7 Áp dụngs: Industrial Motor Control (FOC Servo Drives), Industrial Machine Vision and Image Processing, PCIe Gen1 Endpoint Add-in Cards, Video Bridging and Display Controllers, Protocol Bridging (Industrial IoT Gateways), ASIC Prototyping and Emulation, Medical Instrumentation Front-Ends.
Industrial Motor Control (FOC Servo Drives)
The EP4CE10E22I8N is well matched to field-oriented control (FOC) servo drives thanks to its 23 embedded 18x18 multipliers and 2 PLLs with sub-nanosecond jitter. FOC loops require Park/Clarke transforms and inverse transforms running at 10 to 50 kHz; the 414 Kbits of M9K block RAM serves as scratchpad and angle lookup table. The industrial -40C to +100C temperature grade handles inverter cabinet environments, while 343 user I/Os accommodate multi-axis encoder feedback, resolver excitation, and PWM gating. Add a Nios II soft processor for CANopen or EtherCAT slave stacks.
Được đề xuất
Industrial Machine Vision and Image Processing
In machine vision pipelines the EP4CE10E22I8N provides 10,320 LEs for Bayer demosaicing, color-space conversion, and edge detection, while the 46 M9K blocks (414 Kbits) deliver line buffers for 1080p video at 60 fps. LVDS receivers up to 640 Mbps accept Channel-Link or FPD-Link camera inputs, and the PLL synthesizes precise pixel clocks from 27 MHz references. Industrial temperature screening supports factory-floor deployments. Pair with an external DDR2 SDRAM for frame buffering and the Nios II soft processor for GigE Vision or USB3 Vision transport.
Được đề xuất
PCIe Gen1 Endpoint Add-in Cards
The Cyclone IV E hard PCIe Gen1 PIPE controller lets the EP4CE10E22I8N implement x1 or x2 PCIe endpoints at 2.5 Gbps per lane without consuming LEs. Typical uses are low-cost data acquisition cards, software-defined radio front ends, and protocol analyzers. The 23 embedded 18x18 multipliers accelerate FFT and channelization DSP, while 343 user I/Os expose FMC or HSMC mezzanine connectors. Industrial temperature grade suits instrumentation slots in harsh environments.
Được đề xuất
Video Bridging and Display Controllers
The EP4CE10E22I8N bridges legacy camera or display interfaces (BT.656, BT.1120, LVDS, RGB888) to modern HDMI, MIPI, or DisplayPort sinks by using its 343 user I/Os and LVDS serializers up to 640 Mbps. The 414 Kbits of M9K blocks buffer scan-line data, and the PLL generates pixel clocks up to 148.5 MHz for 1080p. Industrial temperature grade ensures reliable operation in kiosk, digital signage, and medical display installations where ambient temperature may exceed commercial ranges.
Được đề xuất
Protocol Bridging (Industrial IoT Gateways)
The EP4CE10E22I8N serves as a flexible protocol bridge between legacy industrial buses (RS-485, CAN, SPI, I2C) and modern Ethernet or cellular uplinks. The 10,320 LEs host soft UART, soft CAN, and soft MAC IP cores, while the 46 M9K blocks serve as packet buffers. The industrial temperature range supports outdoor cabinet or factory-floor mounting, and the JTAG interface allows firmware updates during commissioning. Combine with the Nios II soft processor to run lightweight TLS stacks.
Được đề xuất
ASIC Prototyping and Emulation
The EP4CE10E22I8N is widely used as an ASIC prototyping vehicle thanks to its 10,320 LEs and 23 hardware multipliers, which map cleanly to RTL descriptions of small ASIC subsystems. Multi-FPGA partitioning tools from Synopsys and Mentor chain several Cyclone IV E devices via LVDS to emulate larger ASICs. The EQFP-144 package is hand-solderable and breadboard-friendly for early architecture validation. Industrial temperature screening allows pre-silicon validation of automotive-grade ASICs.
Được đề xuất
Medical Instrumentation Front-Ends
In ultrasound beamformers, patient monitors, and laboratory analyzers the EP4CE10E22I8N handles FIR filtering, decimation, and envelope detection using its 23 embedded 18x18 multipliers. The 46 M9K blocks store coefficient tables and delay-line samples for phased-array beamforming. Industrial temperature screening and low power consumption suit portable medical devices. Add a Nios II soft processor for command parsing and a soft MAC for DICOM or HL7 Ethernet transport.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP4CE10E22I8N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP4CE10E22C8N | EP4CE10E22I8LN | EP4CE10E22I7N | EP4CE10E22A7N |
|---|---|---|---|---|---|
| Package | EQFP-144 (22x22 mm) | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 10,320 |
| Embedded Memory | 414 Kbits (46 M9K) | 414 Kbits | 414 Kbits | 414 Kbits | 414 Kbits |
| Embedded Multipliers | 23 (18x18) | 23 | 23 | 23 | 23 |
| Speed Grade | 8 | 8 | 8 | 7 (faster) | 7 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Automotive-grade screening |
| Lead-free / Halogen-free | Yes | Yes | Yes (explicit suffix L) | Yes | Yes |
| 1-piece Unit Price (USD, as of 2026-09-10) | 32.50 | 27.00 (lower, commercial) | 33.00 (similar) | 38.00 (higher, faster grade) | 45.00 (higher, automotive) |
Bảo phân biệt quan trọng
- Industrial temperature screening (-40C to +100C) (vsEP4CE10E22C8N)
- Lower unit price than faster speed grades (vsEP4CE10E22I7N)
- Lower unit price than automotive-grade variant (vsEP4CE10E22A7N)
- Lead-free halogen-free (L-suffix) variant available in same package (vsEP4CE10E22I8LN)
Ghi chú thiết kế
The EP4CE10E22I8N requires three independent supply rails: VCCINT (1.2 V core), VCCAUX (2.5 V PLLs and configuration), and one or more VCCIO rails (1.2 V to 3.3 V, one per I/O bank). Decouple each VCCINT pin with a 100 nF X7R ceramic placed within 5 mm of the pin, and provide one bulk 100 uF polymer tantalum per supply rail. Power-on reset requires VCCINT, VCCAUX, and at least one VCCIO rail to reach their threshold before the device releases POR; stage the supplies with a sequencer to avoid POR glitches on multi-rail systems.
The EQFP-144 package has 0.5 mm pitch leads and requires a 4-layer PCB with at least 0.5 oz copper. Use micro-vias or fine-pitch SOIC/SSOP land pattern escapes; check the Intel Cyclone IV E pin connection guidelines for per-bank I/O assignments. For LVDS pairs (up to 640 Mbps), match the P and N trace length within 10 ps (about 1.5 mm) and keep total length under 6 inches to avoid jitter degradation. Add a JTAG header with TCK buffer for production boards.
Common pitfalls when designing with the EP4CE10E22I8N include: (1) omitting the MSEL pull resistors that select Active Serial x1 vs x4 configuration, which can leave the device unconfigured; (2) failing to assign DQS pins for DDR2 byte-aligned access, causing read capture errors at higher frequencies; (3) using the wrong Quartus Prime device pinout file (pin assignments do not match between EQFP-144 and F256 packages of the same family); (4) ignoring the MAXII CPLD requirement for multi-device JTAG chains when the chain length exceeds 8 devices.
Estimated: the EP4CE10E22I8N in EQFP-144 has a typical theta_JA of approximately 28 C/W on a 4-layer JEDEC test board with 0.5 m/s airflow. At full logic utilization (85% LEs at 100 MHz toggle rate), core current is roughly 400 mA, dissipating about 0.48 W. Junction temperature rise is therefore approximately 13 C above ambient, well below the 100 C industrial limit. Sealed enclosures without airflow should still include a thermal copper pour tied to GND to spread heat from the die to the lead frame.
For DDR2 SDRAM interfaces at 200 MHz (400 Mbps), use series 22 ohm damping resistors on the FPGA-side of every DQ, DQS, CK, and address/control trace to suppress ringing on the heavily-loaded multi-drop bus. Place the resistors within 4 mm of the FPGA pin. Place the DDR2 SDRAM on the same PCB side as the FPGA and route all signals on an inner microstrip layer with continuous GND reference plane. Avoid via stubs on the high-speed signals by using blind or back-drilled vias.
Thông tin tuân thủ
RoHS and REACH compliant per Intel product documentation. Lead-free and halogen-free (L-suffix variants available for explicit compliance). Industrial temperature grade but not AEC-Q100 qualified - for automotive select EP4CE10E22A7N.