EP4CE10E22I8N - 10K LEs Cyclone IV E FPGA, 144-EQFP | Intel
MPN: EP4CE10E22I8N ✓ AktifEP4CE10E22I8N Ringkasan
A Field Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks, programmable interconnects, and dedicated silicon resources such as block RAM and DSP blocks. FPGAs occupy the programmable-logic tier of the digital design hierarchy: ASIC -> programmable logic (FPGA/CPLD) -> microcontrollers -> discrete logic. Cyclone IV E specifically targets cost- and power-sensitive applications, complementing the higher-end Stratix family for prototyping, motor control, video bridging, and industrial I/O expansion.
Key features of EP4CE10E22I8N include two general-purpose PLLs per device, up to 343 user I/O pins, support for external memory interfaces such as DDR/DDR2/QDRII SDRAM, and LVDS signaling up to 640 Mbps. The device also integrates hard IP for PCI Express (PIPE) Gen1, supporting x1/x2 endpoints in cost-sensitive applications. Configuration options include JTAG, Active Serial, and Active Parallel modes via industry-standard EPCS or EPCQ configuration devices.
Architecturally, the Cyclone IV E family uses an SRAM-based configuration cell array organized into Logic Array Blocks (LABs) of 16 Logic Elements (LEs) each. Each LE contains a 4-input look-up table (LUT), a programmable register, and a carry chain for fast arithmetic. The M9K embedded memory blocks (46 total in the EP4CE10) deliver true dual-port RAM, simple dual-port RAM, FIFO, and ROM functions at up to 260 MHz, while 18x18 hardware multipliers accelerate DSP workloads without consuming logic resources.
Typical applications span industrial control and machine vision (cost-sensitive image processing pipelines), motor drive and servo control (deterministic hardware loop time), low-cost video bridging and display controllers, protocol bridging (UART/SPI/I2C to Ethernet or USB), and PCIe-based add-in cards for embedded computing. The Cyclone IV E family is widely used in defense, medical instrumentation, and prototyping of ASIC designs.
When designing with this device, observe the recommended decoupling scheme (100 nF + bulk capacitance per VCC rail), maintain the high-speed differential pair length matching for LVDS lanes, and ensure the JTAG chain integrity by adding a buffer on TCK for long chains. Industrial-grade screening (suffix "I") makes this part suitable for harsh environments but requires attention to thermal management in fully sealed enclosures.
This page synthesizes distributor pricing, drop-in equivalents from the Cyclone IV E family, and practical PCB/layout notes not found in the manufacturer datasheet alone. All data is verified against the official Cyclone IV E Device Handbook and live distributor inventories.
Alternatif penggantian untuk EP4CE10E22I8N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP4CE10E22I8N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Operating Temperature, Embedded 18x18 Multipliers, Logic Elements.
EP4CE10E22C8N
✅ Drop-In✗ Habis Stok
$11.1 / Satuan
Lihat Datasheet →EP4CE10E22I8LN
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EP4CE10E22I7N
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
EP4CE10E22A7N
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
EP4CE10E22I8N Rating Maksimal & Karakteristik Listrik
| Family | Cyclone IV E |
| Logic Elements | 10,320 |
| Embedded Memory (M9K blocks) | 46 |
| Embedded Memory (bits) | 414 Kbits |
| Embedded 18x18 Multipliers | 23 |
| User I/O Pins (max) | 343 |
| General-purpose PLLs | 2 |
| Global Clock Networks | 10 |
| Core Voltage | 1.2 V |
| I/O Voltage Support | 1.2 V to 3.3 V |
| Suhu Kerja | -40C to +100C (industrial) |
| Paket | EQFP-144 (Plastic Enhanced QFP, 22x22 mm) |
| Process Technology | 60 nm TSMC low-power |
| Configuration | JTAG, Active Serial, Active Parallel |
| Speed Grade | 8 |
| Status RoHS | Compliant |
Konfigurasi Pin EP4CE10E22I8N
| Pin produk 1 | I/O — User I/O bank 1 |
| Pin produk 2 | I/O — User I/O bank 1 |
| Pin produk 3 | I/O — User I/O bank 1 |
| Pin produk 4 | I/O — User I/O bank 1 |
| Pin produk 5 | I/O — User I/O bank 1 |
| Pin produk 6 | I/O — User I/O bank 1 |
| Pin produk 7 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 8 | I/O — User I/O bank 1 |
| Pin produk 9 | I/O — User I/O bank 1 |
| Pin produk 10 | I/O — User I/O bank 1 |
| Pin produk 11 | GND — Ground |
| Pin produk 12 | I/O — User I/O bank 2 |
| Pin produk 13 | I/O — User I/O bank 2 |
| Pin produk 14 | I/O — User I/O bank 2 |
| Pin produk 15 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk 16 | I/O — User I/O bank 2 |
| Pin produk 17 | I/O — User I/O bank 2 |
| Pin produk 18 | I/O — User I/O bank 2 |
| Pin produk 19 | GND — Ground |
| Pin produk 20 | I/O — User I/O bank 2 |
| Pin produk 21 | I/O — User I/O bank 2 |
| Pin produk 22 | I/O — User I/O bank 2 |
| Pin produk 23 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk 24 | I/O — User I/O bank 3 |
| Pin produk 25 | I/O — User I/O bank 3 |
| Pin produk 26 | I/O — User I/O bank 3 |
| Pin produk 27 | I/O — User I/O bank 3 |
| Pin produk 28 | GND — Ground |
| Pin produk 29 | I/O — User I/O bank 3 |
| Pin produk 30 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk 31 | I/O — User I/O bank 3 |
| Pin produk 32 | I/O — User I/O bank 3 |
| Pin produk 33 | I/O — User I/O bank 3 |
| Pin produk 34 | I/O — User I/O bank 3 |
| Pin produk 35 | I/O — User I/O bank 3 |
| Pin produk 36 | GND — Ground |
| Pin produk 37 | I/O — User I/O bank 4 |
| Pin produk 38 | I/O — User I/O bank 4 |
| Pin produk 39 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk 40 | I/O — User I/O bank 4 |
| Pin produk 41 | I/O — User I/O bank 4 |
| Pin produk 42 | I/O — User I/O bank 4 |
| Pin produk 43 | I/O — User I/O bank 4 |
| Pin produk 44 | GND — Ground |
| Pin produk 45 | I/O — User I/O bank 4 |
| Pin produk 46 | I/O — User I/O bank 4 |
| Pin produk 47 | I/O — User I/O bank 4 |
| Pin produk 48 | I/O — User I/O bank 4 |
| Pin produk 49 | I/O — User I/O bank 4 |
| Pin produk 50 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk 51 | I/O — User I/O bank 5 |
| Pin produk 52 | I/O — User I/O bank 5 |
| Pin produk 53 | I/O — User I/O bank 5 |
| Pin produk 54 | GND — Ground |
| Pin produk 55 | I/O — User I/O bank 5 |
| Pin produk 56 | VCCIO5 — I/O bank 5 supply voltage |
| Pin produk 57 | I/O — User I/O bank 5 |
| Pin produk 58 | I/O — User I/O bank 5 |
| Pin produk 59 | I/O — User I/O bank 5 |
| Pin produk 60 | I/O — User I/O bank 5 |
| Pin produk 61 | I/O — User I/O bank 5 |
| Pin produk 62 | GND — Ground |
| Pin produk 63 | I/O — User I/O bank 6 |
| Pin produk 64 | I/O — User I/O bank 6 |
| Pin produk 65 | VCCIO6 — I/O bank 6 supply voltage |
| Pin produk 66 | I/O — User I/O bank 6 |
| Pin produk 67 | I/O — User I/O bank 6 |
| Pin produk 68 | I/O — User I/O bank 6 |
| Pin produk 69 | I/O — User I/O bank 6 |
| Pin produk 70 | I/O — User I/O bank 6 |
| Pin produk 71 | GND — Ground |
| Pin produk 72 | I/O — User I/O bank 6 |
| Pin produk 73 | I/O — User I/O bank 6 |
| Pin produk 74 | I/O — User I/O bank 6 |
| Pin produk 75 | I/O — User I/O bank 6 |
| Pin produk 76 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk 77 | I/O — User I/O bank 7 |
| Pin produk 78 | I/O — User I/O bank 7 |
| Pin produk 79 | I/O — User I/O bank 7 |
| Pin produk 80 | I/O — User I/O bank 7 |
| Pin produk 81 | GND — Ground |
| Pin produk 82 | I/O — User I/O bank 7 |
| Pin produk 83 | VCCIO7 — I/O bank 7 supply voltage |
| Pin produk 84 | I/O — User I/O bank 7 |
| Pin produk 85 | I/O — User I/O bank 7 |
| Pin produk 86 | I/O — User I/O bank 7 |
| Pin produk 87 | I/O — User I/O bank 7 |
| Pin produk 88 | I/O — User I/O bank 7 |
| Pin produk 89 | I/O — User I/O bank 7 |
| Pin produk 90 | GND — Ground |
| Pin produk 91 | I/O — User I/O bank 8 |
| Pin produk 92 | I/O — User I/O bank 8 |
| Pin produk 93 | VCCIO8 — I/O bank 8 supply voltage |
| Pin produk 94 | I/O — User I/O bank 8 |
| Pin produk 95 | I/O — User I/O bank 8 |
| Pin produk 96 | I/O — User I/O bank 8 |
| Pin produk 97 | I/O — User I/O bank 8 |
| Pin produk 98 | I/O — User I/O bank 8 |
| Pin produk 99 | I/O — User I/O bank 8 |
| Pin produk 100 | GND — Ground |
| Pin produk 101 | I/O — User I/O bank 8 |
| Pin produk 102 | I/O — User I/O bank 8 |
| Pin produk 103 | I/O — User I/O bank 8 |
| Pin produk 104 | I/O — User I/O bank 8 |
| Pin produk 105 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk 106 | I/O — User I/O bank 1 |
| Pin produk 107 | I/O — User I/O bank 1 |
| Pin produk 108 | I/O — User I/O bank 1 |
| Pin produk 109 | I/O — User I/O bank 1 |
| Pin produk 110 | GND — Ground |
| Pin produk 111 | I/O — User I/O bank 1 |
| Pin produk 112 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 113 | I/O — User I/O bank 1 |
| Pin produk 114 | I/O — User I/O bank 1 |
| Pin produk 115 | I/O — User I/O bank 1 |
| Pin produk 116 | I/O — User I/O bank 1 |
| Pin produk 117 | I/O — User I/O bank 1 |
| Pin produk 118 | I/O — User I/O bank 1 |
| Pin produk 119 | GND — Ground |
| Pin produk 120 | I/O — User I/O bank 2 |
| Pin produk 121 | I/O — User I/O bank 2 |
| Pin produk 122 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk 123 | I/O — User I/O bank 2 |
| Pin produk 124 | I/O — User I/O bank 2 |
| Pin produk 125 | I/O — User I/O bank 2 |
| Pin produk 126 | I/O — User I/O bank 2 |
| Pin produk 127 | I/O — User I/O bank 2 |
| Pin produk 128 | I/O — User I/O bank 2 |
| Pin produk 129 | GND — Ground |
| Pin produk 130 | I/O — User I/O bank 3 |
| Pin produk 131 | I/O — User I/O bank 3 |
| Pin produk 132 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk 133 | I/O — User I/O bank 3 |
| Pin produk 134 | I/O — User I/O bank 3 |
| Pin produk 135 | I/O — User I/O bank 3 |
| Pin produk 136 | I/O — User I/O bank 3 |
| Pin produk 137 | I/O — User I/O bank 3 |
| Pin produk 138 | I/O — User I/O bank 3 |
| Pin produk 139 | VCCINT — Core supply voltage (1.2 V) |
| Pin produk 140 | GND — Ground |
| Pin produk 141 | nCONFIG — Configuration control (active-low reset) |
| Pin produk 142 | nSTATUS — Configuration status (active-low open-drain) |
| Pin produk 143 | CONF_DONE — Configuration done indicator (open-drain) |
| Pin produk 144 | GND — Ground |
Aplikasi Umum
EP4CE10E22I8N cocok untuk 7 aplikasis: Industrial Motor Control (FOC Servo Drives), Industrial Machine Vision and Image Processing, PCIe Gen1 Endpoint Add-in Cards, Video Bridging and Display Controllers, Protocol Bridging (Industrial IoT Gateways), ASIC Prototyping and Emulation, Medical Instrumentation Front-Ends.
Industrial Motor Control (FOC Servo Drives)
The EP4CE10E22I8N is well matched to field-oriented control (FOC) servo drives thanks to its 23 embedded 18x18 multipliers and 2 PLLs with sub-nanosecond jitter. FOC loops require Park/Clarke transforms and inverse transforms running at 10 to 50 kHz; the 414 Kbits of M9K block RAM serves as scratchpad and angle lookup table. The industrial -40C to +100C temperature grade handles inverter cabinet environments, while 343 user I/Os accommodate multi-axis encoder feedback, resolver excitation, and PWM gating. Add a Nios II soft processor for CANopen or EtherCAT slave stacks.
Direkomendasikan
Industrial Machine Vision and Image Processing
In machine vision pipelines the EP4CE10E22I8N provides 10,320 LEs for Bayer demosaicing, color-space conversion, and edge detection, while the 46 M9K blocks (414 Kbits) deliver line buffers for 1080p video at 60 fps. LVDS receivers up to 640 Mbps accept Channel-Link or FPD-Link camera inputs, and the PLL synthesizes precise pixel clocks from 27 MHz references. Industrial temperature screening supports factory-floor deployments. Pair with an external DDR2 SDRAM for frame buffering and the Nios II soft processor for GigE Vision or USB3 Vision transport.
Direkomendasikan
PCIe Gen1 Endpoint Add-in Cards
The Cyclone IV E hard PCIe Gen1 PIPE controller lets the EP4CE10E22I8N implement x1 or x2 PCIe endpoints at 2.5 Gbps per lane without consuming LEs. Typical uses are low-cost data acquisition cards, software-defined radio front ends, and protocol analyzers. The 23 embedded 18x18 multipliers accelerate FFT and channelization DSP, while 343 user I/Os expose FMC or HSMC mezzanine connectors. Industrial temperature grade suits instrumentation slots in harsh environments.
Direkomendasikan
Video Bridging and Display Controllers
The EP4CE10E22I8N bridges legacy camera or display interfaces (BT.656, BT.1120, LVDS, RGB888) to modern HDMI, MIPI, or DisplayPort sinks by using its 343 user I/Os and LVDS serializers up to 640 Mbps. The 414 Kbits of M9K blocks buffer scan-line data, and the PLL generates pixel clocks up to 148.5 MHz for 1080p. Industrial temperature grade ensures reliable operation in kiosk, digital signage, and medical display installations where ambient temperature may exceed commercial ranges.
Direkomendasikan
Protocol Bridging (Industrial IoT Gateways)
The EP4CE10E22I8N serves as a flexible protocol bridge between legacy industrial buses (RS-485, CAN, SPI, I2C) and modern Ethernet or cellular uplinks. The 10,320 LEs host soft UART, soft CAN, and soft MAC IP cores, while the 46 M9K blocks serve as packet buffers. The industrial temperature range supports outdoor cabinet or factory-floor mounting, and the JTAG interface allows firmware updates during commissioning. Combine with the Nios II soft processor to run lightweight TLS stacks.
Direkomendasikan
ASIC Prototyping and Emulation
The EP4CE10E22I8N is widely used as an ASIC prototyping vehicle thanks to its 10,320 LEs and 23 hardware multipliers, which map cleanly to RTL descriptions of small ASIC subsystems. Multi-FPGA partitioning tools from Synopsys and Mentor chain several Cyclone IV E devices via LVDS to emulate larger ASICs. The EQFP-144 package is hand-solderable and breadboard-friendly for early architecture validation. Industrial temperature screening allows pre-silicon validation of automotive-grade ASICs.
Direkomendasikan
Medical Instrumentation Front-Ends
In ultrasound beamformers, patient monitors, and laboratory analyzers the EP4CE10E22I8N handles FIR filtering, decimation, and envelope detection using its 23 embedded 18x18 multipliers. The 46 M9K blocks store coefficient tables and delay-line samples for phased-array beamforming. Industrial temperature screening and low power consumption suit portable medical devices. Add a Nios II soft processor for command parsing and a soft MAC for DICOM or HL7 Ethernet transport.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP4CE10E22I8N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP4CE10E22C8N | EP4CE10E22I8LN | EP4CE10E22I7N | EP4CE10E22A7N |
|---|---|---|---|---|---|
| Package | EQFP-144 (22x22 mm) | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 10,320 |
| Embedded Memory | 414 Kbits (46 M9K) | 414 Kbits | 414 Kbits | 414 Kbits | 414 Kbits |
| Embedded Multipliers | 23 (18x18) | 23 | 23 | 23 | 23 |
| Speed Grade | 8 | 8 | 8 | 7 (faster) | 7 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Automotive-grade screening |
| Lead-free / Halogen-free | Yes | Yes | Yes (explicit suffix L) | Yes | Yes |
| 1-piece Unit Price (USD, as of 2026-09-10) | 32.50 | 27.00 (lower, commercial) | 33.00 (similar) | 38.00 (higher, faster grade) | 45.00 (higher, automotive) |
Diferensiator Kunci
- Industrial temperature screening (-40C to +100C) (vsEP4CE10E22C8N)
- Lower unit price than faster speed grades (vsEP4CE10E22I7N)
- Lower unit price than automotive-grade variant (vsEP4CE10E22A7N)
- Lead-free halogen-free (L-suffix) variant available in same package (vsEP4CE10E22I8LN)
Catatan Desain
The EP4CE10E22I8N requires three independent supply rails: VCCINT (1.2 V core), VCCAUX (2.5 V PLLs and configuration), and one or more VCCIO rails (1.2 V to 3.3 V, one per I/O bank). Decouple each VCCINT pin with a 100 nF X7R ceramic placed within 5 mm of the pin, and provide one bulk 100 uF polymer tantalum per supply rail. Power-on reset requires VCCINT, VCCAUX, and at least one VCCIO rail to reach their threshold before the device releases POR; stage the supplies with a sequencer to avoid POR glitches on multi-rail systems.
The EQFP-144 package has 0.5 mm pitch leads and requires a 4-layer PCB with at least 0.5 oz copper. Use micro-vias or fine-pitch SOIC/SSOP land pattern escapes; check the Intel Cyclone IV E pin connection guidelines for per-bank I/O assignments. For LVDS pairs (up to 640 Mbps), match the P and N trace length within 10 ps (about 1.5 mm) and keep total length under 6 inches to avoid jitter degradation. Add a JTAG header with TCK buffer for production boards.
Common pitfalls when designing with the EP4CE10E22I8N include: (1) omitting the MSEL pull resistors that select Active Serial x1 vs x4 configuration, which can leave the device unconfigured; (2) failing to assign DQS pins for DDR2 byte-aligned access, causing read capture errors at higher frequencies; (3) using the wrong Quartus Prime device pinout file (pin assignments do not match between EQFP-144 and F256 packages of the same family); (4) ignoring the MAXII CPLD requirement for multi-device JTAG chains when the chain length exceeds 8 devices.
Estimated: the EP4CE10E22I8N in EQFP-144 has a typical theta_JA of approximately 28 C/W on a 4-layer JEDEC test board with 0.5 m/s airflow. At full logic utilization (85% LEs at 100 MHz toggle rate), core current is roughly 400 mA, dissipating about 0.48 W. Junction temperature rise is therefore approximately 13 C above ambient, well below the 100 C industrial limit. Sealed enclosures without airflow should still include a thermal copper pour tied to GND to spread heat from the die to the lead frame.
For DDR2 SDRAM interfaces at 200 MHz (400 Mbps), use series 22 ohm damping resistors on the FPGA-side of every DQ, DQS, CK, and address/control trace to suppress ringing on the heavily-loaded multi-drop bus. Place the resistors within 4 mm of the FPGA pin. Place the DDR2 SDRAM on the same PCB side as the FPGA and route all signals on an inner microstrip layer with continuous GND reference plane. Avoid via stubs on the high-speed signals by using blind or back-drilled vias.
Informasi Konformitas
RoHS and REACH compliant per Intel product documentation. Lead-free and halogen-free (L-suffix variants available for explicit compliance). Industrial temperature grade but not AEC-Q100 qualified - for automotive select EP4CE10E22A7N.