EPF10K30ATC144-3 - FLEX 10KA FPGA, 30K Gates, 144-TQFP | Intel
MPN: EPF10K30ATC144-3 ✗ Cuối đờiEPF10K30ATC144-3 Tóm tắt
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and I/O cells that can be customized by the designer to implement arbitrary digital circuits. The FLEX 10KA family specifically pioneered embedded memory blocks within the FPGA fabric, combining lookup-table (LUT)-based logic with on-chip dual-port RAM, enabling system-on-chip integration without external memory components for many designs.
Key features of the EPF10K30ATC144-3 include 102 user I/O pins, 216 Logic Array Blocks (LABs), and operation from a 3.3V core supply. The device supports CMOS I/O standards and provides a maximum internal frequency of 80 MHz with a propagation delay of approximately 0.6 ns per logic element. The embedded array blocks (EABs) implement true dual-port RAM, ROM, or arithmetic functions, distinguishing FLEX 10KA from earlier FLEX 10K devices.
The device's SRAM-based configuration memory allows unlimited reconfiguration in-circuit. Its architecture is organized as rows and columns of LABs interconnected by a continuous, high-performance routing network. The 144-pin TQFP package with 0.5 mm pitch is suitable for surface-mount assembly in prototyping and low-to-medium volume production.
Typical applications include digital signal processing front-ends, telecommunications glue logic, industrial control interfaces, and embedded controller glue logic. The device is commonly used in legacy designs, retrofit boards, and as a flexible logic substitute for discrete SSI/MSI logic clusters.
When designing with this FPGA, ensure your configuration scheme (e.g., EPC configuration device or JTAG) is compatible with the FLEX 10KA bitstream format. Quartu II or MAX+PLUS II design tools are required; modern Intel Quartus software versions may not natively support FLEX 10KA, so legacy toolchain verification is recommended.
This page synthesizes distributor pricing, FLEX 10KA drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho EPF10K30ATC144-3 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF10K30ATC144-3 (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Process Technology, Family, Speed Grade.
EPF10K30ATC144-3N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EPF10K30ATC144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ATC144-1N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ATI144-3
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EPF10K30ATC144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ATC144-1N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ATC144-3 Tỷ lệ tối đa & tính chất điện
| Series | FLEX 10KA |
| Family | FLEX 10KA (Embedded Programmable Logic Device) |
| Typical Gate Count | 30,000 gates |
| Logic Elements | 1,728 cells |
| Embedded Memory (RAM bits) | 12,288 bits |
| Logic Array Blocks (LABs) | 216 |
| User I/O Pins | 102 |
| Hộp | 144-LQFP / TQFP-144 |
| Kiểu lắp đặt | Surface Mount |
| Process Technology | CMOS |
| Core Supply Voltage | 3.3 V |
| Internal Frequency (max) | 80 MHz |
| Propagation Delay | 0.6 ns (typical) |
| Nhiệt độ hoạt động | 0 C to 70 C (Commercial) |
| Speed Grade | -3 |
| Configuration | SRAM-based, in-circuit reconfigurable |
Cấu hình chân EPF10K30ATC144-3
| Chân 1 | I/O — User I/O (Bank 1) |
| Chân 2 | I/O — User I/O (Bank 1) |
| Chân 3 | I/O — User I/O (Bank 1) |
| Chân 4 | I/O — User I/O (Bank 1) |
| Chân 5 | I/O — User I/O (Bank 1) |
| Chân 6 | I/O — User I/O (Bank 1) |
| Chân 7 | I/O — User I/O (Bank 1) |
| Chân 8 | I/O — User I/O (Bank 1) |
| Chân 9 | VCCIO1 — I/O Bank 1 supply voltage |
| Chân 10 | I/O — User I/O (Bank 1) |
| Chân 11 | I/O — User I/O (Bank 1) |
| Chân 12 | GND — Ground |
| Chân 13 | I/O — User I/O (Bank 1) |
| Chân 14 | I/O — User I/O (Bank 1) |
| Chân 15 | I/O — User I/O (Bank 1) |
| Chân 16 | I/O — User I/O (Bank 1) |
| Chân 17 | I/O — User I/O (Bank 1) |
| Chân 18 | I/O — User I/O (Bank 1) |
| Chân 19 | I/O — User I/O (Bank 1) |
| Chân 20 | I/O — User I/O (Bank 1) |
| Chân 21 | I/O — User I/O (Bank 1) |
| Chân 22 | VCCINT — Core supply voltage (3.3V) |
| Chân 23 | I/O — User I/O (Bank 1) |
| Chân 24 | I/O — User I/O (Bank 1) |
| Chân 25 | I/O — User I/O (Bank 1) |
| Chân 26 | I/O — User I/O (Bank 1) |
| Chân 27 | I/O — User I/O (Bank 1) |
| Chân 28 | I/O — User I/O (Bank 1) |
| Chân 29 | I/O — User I/O (Bank 1) |
| Chân 30 | I/O — User I/O (Bank 1) |
| Chân 31 | I/O — User I/O (Bank 1) |
| Chân 32 | I/O — User I/O (Bank 1) |
| Chân 33 | VCCIO1 — I/O Bank 1 supply voltage |
| Chân 34 | GND — Ground |
| Chân 35 | I/O — User I/O (Bank 1) |
| Chân 36 | I/O — User I/O (Bank 1) |
| Chân 37 | I/O — User I/O (Bank 2) |
| Chân 38 | I/O — User I/O (Bank 2) |
| Chân 39 | I/O — User I/O (Bank 2) |
| Chân 40 | I/O — User I/O (Bank 2) |
| Chân 41 | I/O — User I/O (Bank 2) |
| Chân 42 | I/O — User I/O (Bank 2) |
| Chân 43 | I/O — User I/O (Bank 2) |
| Chân 44 | I/O — User I/O (Bank 2) |
| Chân 45 | VCCIO2 — I/O Bank 2 supply voltage |
| Chân 46 | I/O — User I/O (Bank 2) |
| Chân 47 | I/O — User I/O (Bank 2) |
| Chân 48 | GND — Ground |
| Chân 49 | I/O — User I/O (Bank 2) |
| Chân 50 | I/O — User I/O (Bank 2) |
| Chân 51 | I/O — User I/O (Bank 2) |
| Chân 52 | I/O — User I/O (Bank 2) |
| Chân 53 | I/O — User I/O (Bank 2) |
| Chân 54 | I/O — User I/O (Bank 2) |
| Chân 55 | CLK0 — Global clock input 0 |
| Chân 56 | I/O — User I/O (Bank 2) |
| Chân 57 | I/O — User I/O (Bank 2) |
| Chân 58 | I/O — User I/O (Bank 2) |
| Chân 59 | VCCINT — Core supply voltage (3.3V) |
| Chân 60 | I/O — User I/O (Bank 2) |
| Chân 61 | I/O — User I/O (Bank 2) |
| Chân 62 | I/O — User I/O (Bank 2) |
| Chân 63 | I/O — User I/O (Bank 2) |
| Chân 64 | I/O — User I/O (Bank 2) |
| Chân 65 | I/O — User I/O (Bank 2) |
| Chân 66 | I/O — User I/O (Bank 2) |
| Chân 67 | I/O — User I/O (Bank 2) |
| Chân 68 | I/O — User I/O (Bank 2) |
| Chân 69 | VCCIO2 — I/O Bank 2 supply voltage |
| Chân 70 | GND — Ground |
| Chân 71 | I/O — User I/O (Bank 2) |
| Chân 72 | I/O — User I/O (Bank 2) |
| Chân 73 | I/O — User I/O (Bank 3) |
| Chân 74 | I/O — User I/O (Bank 3) |
| Chân 75 | I/O — User I/O (Bank 3) |
| Chân 76 | I/O — User I/O (Bank 3) |
| Chân 77 | I/O — User I/O (Bank 3) |
| Chân 78 | I/O — User I/O (Bank 3) |
| Chân 79 | I/O — User I/O (Bank 3) |
| Chân 80 | I/O — User I/O (Bank 3) |
| Chân 81 | VCCIO3 — I/O Bank 3 supply voltage |
| Chân 82 | I/O — User I/O (Bank 3) |
| Chân 83 | I/O — User I/O (Bank 3) |
| Chân 84 | GND — Ground |
| Chân 85 | TDI — JTAG Test Data In |
| Chân 86 | TRST — JTAG Test Reset |
| Chân 87 | TCK — JTAG Test Clock |
| Chân 88 | TMS — JTAG Test Mode Select |
| Chân 89 | I/O — User I/O (Bank 3) |
| Chân 90 | I/O — User I/O (Bank 3) |
| Chân 91 | I/O — User I/O (Bank 3) |
| Chân 92 | I/O — User I/O (Bank 3) |
| Chân 93 | nCONFIG — Configuration start (active-low) |
| Chân 94 | nSTATUS — Configuration status (active-low) |
| Chân 95 | CONF_DONE — Configuration complete |
| Chân 96 | DCLK — Configuration clock |
| Chân 97 | DATA0 — Configuration data input 0 |
| Chân 98 | VCCINT — Core supply voltage (3.3V) |
| Chân 99 | I/O — User I/O (Bank 3) |
| Chân 100 | I/O — User I/O (Bank 3) |
| Chân 101 | I/O — User I/O (Bank 3) |
| Chân 102 | I/O — User I/O (Bank 3) |
| Chân 103 | I/O — User I/O (Bank 3) |
| Chân 104 | I/O — User I/O (Bank 3) |
| Chân 105 | I/O — User I/O (Bank 3) |
| Chân 106 | I/O — User I/O (Bank 3) |
| Chân 107 | I/O — User I/O (Bank 3) |
| Chân 108 | VCCIO3 — I/O Bank 3 supply voltage |
| Chân 109 | I/O — User I/O (Bank 4) |
| Chân 110 | I/O — User I/O (Bank 4) |
| Chân 111 | I/O — User I/O (Bank 4) |
| Chân 112 | GND — Ground |
| Chân 113 | I/O — User I/O (Bank 4) |
| Chân 114 | I/O — User I/O (Bank 4) |
| Chân 115 | I/O — User I/O (Bank 4) |
| Chân 116 | I/O — User I/O (Bank 4) |
| Chân 117 | I/O — User I/O (Bank 4) |
| Chân 118 | I/O — User I/O (Bank 4) |
| Chân 119 | I/O — User I/O (Bank 4) |
| Chân 120 | I/O — User I/O (Bank 4) |
| Chân 121 | VCCIO4 — I/O Bank 4 supply voltage |
| Chân 122 | I/O — User I/O (Bank 4) |
| Chân 123 | I/O — User I/O (Bank 4) |
| Chân 124 | GND — Ground |
| Chân 125 | I/O — User I/O (Bank 4) |
| Chân 126 | I/O — User I/O (Bank 4) |
| Chân 127 | I/O — User I/O (Bank 4) |
| Chân 128 | I/O — User I/O (Bank 4) |
| Chân 129 | I/O — User I/O (Bank 4) |
| Chân 130 | I/O — User I/O (Bank 4) |
| Chân 131 | I/O — User I/O (Bank 4) |
| Chân 132 | I/O — User I/O (Bank 4) |
| Chân 133 | I/O — User I/O (Bank 4) |
| Chân 134 | I/O — User I/O (Bank 4) |
| Chân 135 | I/O — User I/O (Bank 4) |
| Chân 136 | VCCINT — Core supply voltage (3.3V) |
| Chân 137 | I/O — User I/O (Bank 4) |
| Chân 138 | I/O — User I/O (Bank 4) |
| Chân 139 | I/O — User I/O (Bank 4) |
| Chân 140 | I/O — User I/O (Bank 4) |
| Chân 141 | I/O — User I/O (Bank 4) |
| Chân 142 | I/O — User I/O (Bank 4) |
| Chân 143 | I/O — User I/O (Bank 4) |
| Chân 144 | VCCIO4 — I/O Bank 4 supply voltage |
Ứng dụng tiêu biểu
EPF10K30ATC144-3 phù hợp cho 6 Áp dụngs: Industrial Control Glue Logic, Telecommunications Backplane Interface, Embedded DSP Front-End, Test & Measurement Instrumentation, Medical Device Interface Logic, Legacy Retrofit & Form-Fit Replacement.
Industrial Control Glue Logic
The EPF10K30ATC144-3's 1,728 logic cells and 102 user I/Os make it a flexible substitute for dozens of SSI/MSI logic chips on legacy industrial control boards. With 12,288 bits of on-chip EAB-based RAM, designers can integrate custom state machines, encoder/decoder logic, and motor-control timing blocks without external memory. The 3.3V core supply is compatible with legacy 3.3V industrial backplanes, and the 80 MHz internal frequency easily handles real-time I/O scan rates up to 5 MHz.
Được đề xuất
Telecommunications Backplane Interface
Legacy telecom systems use the EPF10K30ATC144-3 as a protocol-conversion bridge between proprietary backplane buses and standard interfaces. The 102 I/Os are sufficient for parallel bus bridging up to 16-bit data plus control, while the embedded RAM blocks implement elastic FIFOs and CRC/HDLC engines. Its 0.6 ns propagation delay supports 100+ MHz backplane signaling on the same TQFP-144 footprint, and the JTAG boundary-scan chain simplifies in-system field testing and remote diagnostics.
Được đề xuất
Embedded DSP Front-End
The EPF10K30ATC144-3 implements the front-end DSP pipeline (filtering, decimation, FFT pre-processing) ahead of a host microcontroller or DSP chip. Its 12,288 embedded RAM bits provide data buffering for moving-window filters, while the 1,728 logic cells implement multiplier-accumulator (MAC) arrays and address generators. The 80 MHz internal frequency yields 40 MIPS of DSP throughput - sufficient for audio-bandwidth processing at 16-bit precision. The TQFP-144 footprint mates directly to standard prototyping boards.
Được đề xuất
Test & Measurement Instrumentation
Bench-top instrument designs leverage the EPF10K30ATC144-3 for arbitrary waveform generation, pattern recognition, and stimulus/response capture. The 102 user I/Os support direct drive of up to 50 MHz logic analyzer probes without external drivers, while the 12,288-bit embedded RAM stores 64x192-bit waveform samples per channel. The 0.6 ns propagation delay enables 200 MHz event timing resolution when used in conjunction with external comparators, and the JTAG chain provides field firmware updates.
Được đề xuất
Medical Device Interface Logic
The EPF10K30ATC144-3 is used in legacy medical imaging and patient monitoring equipment as a flexible interface controller between analog front-ends and embedded processors. Its 102 I/Os handle multiple 12-bit ADC/DAC channels plus timing strobes, while the embedded EABs implement data FIFOs for image line buffering. The 3.3V core supply simplifies mixed-signal PCB layout, and the 80 MHz operating frequency supports real-time video-bandwidth processing for ultrasound or endoscopy front-ends.
Được đề xuất
Legacy Retrofit & Form-Fit Replacement
When obsolescence strikes, the EPF10K30ATC144-3 is the FLEX 10KA drop-in part that preserves the original PCB layout, JTAG chain, and MAX+PLUS II / Quartus II bitstream. Engineering teams retrofit production boards with the same TQFP-144 footprint, identical pinout, and SRAM-based configuration that boots from the existing EPC configuration device. No HDL re-synthesis or PCB rework is required - the new bitstream is regenerated from the same VHDL/Verilog source as the original.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPF10K30ATC144-3 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPF10K30ATC144-3N | EPF10K30ATC144-2N | EPF10K30ATC144-1N | EPF10K30ATI144-3 |
|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Cells | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Speed Grade | -3 (0.6 ns prop delay) | -3 (same) | -2 (faster) | -1 (fastest) | -3 (same speed, industrial temp) |
| Temperature Grade | Commercial (0 C to 70 C) | Commercial (0 C to 70 C) | Commercial (0 C to 70 C) | Commercial (0 C to 70 C) | Industrial (-40 C to +85 C) |
| RoHS / Pb-free | Non-RoHS (leaded) | RoHS (Pb-free) | RoHS (Pb-free) | RoHS (Pb-free) | Non-RoHS (leaded) |
| User I/O | 102 | 102 | 102 | 102 | 102 |
| Embedded RAM | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits |
Bảo phân biệt quan trọng
- TQFP-144 footprint with 102 user I/Os - maximum I/O density in the FLEX 10KA family (vsEPF10K30AQC208-3)
- Speed grade -3 (standard timing) - cost-optimized for legacy retrofit (vsEPF10K30ATC144-2N)
- Embedded Array Block (EAB) dual-port RAM - first FLEX family with on-chip memory (vsEPF10K10ATC144-3N)
Ghi chú thiết kế
The EPF10K30ATC144-3 is SRAM-based and loses configuration on power-down. A non-volatile configuration device (EPC8QC100, EPC2LC20) must be present on the board to load the bitstream at POR. Missing or unprogrammed configuration memory is the most common first-power-up failure mode for legacy FLEX 10KA designs - verify the EPC device is socketed and accessible for JTAG in-system programming during board bring-up.
The FLEX 10KA core requires a stable 3.3V VCCINT with no more than 60 mV peak-to-peak ripple during configuration. Decouple VCCINT with at least one 0.1 uF ceramic capacitor per VCCINT pin and one bulk 33 uF tantalum/ceramic per device. Each VCCIO bank must be independently decoupled. Power-supply ramp time should be monotonic between 1 ms and 100 ms; out-of-spec ramp times cause CONF_DONE to latch low.
Route JTAG signals (TCK, TMS, TDI, TDO, TRST) as a 4-wire daisy-chain with 10K pull-ups to VCCIO unless the host programmer provides drive. Keep JTAG traces under 150 mm or insert a JTAG buffer for longer chains. The CLK0-CLK3 global clock pins should receive matched-length traces to minimize clock skew across LAB rows - critical for designs using two or more global clocks at >50 MHz.
Thông tin tuân thủ
EPF10K30ATC144-3 (no N suffix) is non-RoHS, leaded (SnPb). EPF10K30ATC144-3N is the RoHS / Pb-free drop-in variant. Per FLEX 10KA family documentation, no AEC-Q100 qualification. REACH compliance per original Altera/Intel material declaration.
