EPF10K30ETC144-2N - 30K Gates FLEX 10KE FPGA | Intel / Altera
MPN: EPF10K30ETC144-2N ✗ Cuối đờiEPF10K30ETC144-2N Tóm tắt
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement custom digital circuits through a matrix of configurable logic blocks (CLBs), embedded memory, and programmable interconnects. FPGAs sit hierarchically above standard logic ICs and below application-specific integrated circuits (ASICs) in the broader semiconductor landscape, offering ASIC-class density with field-reprogrammability and shorter time-to-market than mask-programmed alternatives. The FLEX 10KE family specifically introduced an embedded array block architecture that combined logic, RAM, and ROM in a single die for system-on-a-programmable-chip (SOPC) integration.
Key features of the EPF10K30ETC144-2N include 102 user I/Os, an embedded JTAG boundary-scan test interface compliant with IEEE 1149.1, configurable I/O standards, and built-in clock-management resources. The 144-LQFP package is pin-compatible with other members of the FLEX 10KE family in the same footprint, enabling straightforward density upgrades within the family. The '2' speed grade denotes the standard performance tier, and the 'N' suffix indicates a lead-free / Pb-free terminal finish.
Architecturally, the EPF10K30ETC144-2N combines a fine-grained logic element fabric with coarser embedded array blocks (EABs) that can be configured as RAM, ROM, or multiplier functions. This hybrid architecture was the first to deliver System-on-a-Programmable-Chip (SOPC) integration in a PLD, allowing designers to place CPU cores, memory, and peripherals alongside custom logic on a single programmable die.
Typical applications for this FPGA include industrial control logic, glue-logic integration around legacy microprocessors, custom interface bridging (parallel-to-serial conversion), low-volume ASIC prototyping, and embedded DSP pre/post-processing. It is also used in telecommunications line-card glue logic and test-and-measurement fixture controllers.
When designing with the EPF10K30ETC144-2N, ensure your toolchain targets the FLEX 10KE device family and that the 144-LQFP PCB land pattern matches the 20 mm x 20 mm, 0.5 mm pitch package outline. Because the part is now in lifecycle decline, plan for last-time-buy acquisition if you are maintaining a long-lifecycle product.
This page synthesizes distributor pricing, drop-in same-package alternatives within the FLEX 10KE family, and practical design notes not found in the original manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho EPF10K30ETC144-2N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF10K30ETC144-2N (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, Process Technology, Family, Configuration Method.
EPF10K30ETC144-1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ETC144-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30ATC144-3
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EPF10K30ATC144-2N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EPF10K30ATC144-1N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EPF10K30ETC144-2N Tỷ lệ tối đa & tính chất điện
| Series | FLEX-10KE |
| Logic Elements / Cells | 1,728 |
| Total RAM Bits | 24,576 |
| Number of Gates | 30,000 (typical) |
| Number of I/O | 102 |
| Voltage - Supply | 2.375 V to 2.625 V |
| Internal Frequency (max) | 200 MHz |
| Propagation Delay | 0.6 ns |
| Nhiệt độ hoạt động | 0 °C to +70 °C (commercial) |
| Hộp / Vỏ | 144-LQFP (TQFP-144) |
| Supplier Device Package | 144-TQFP (20 x 20 mm, 0.5 mm pitch) |
| Kiểu lắp đặt | Surface Mount |
| Logic Family | CMOS |
| Process Technology | 0.22 μm |
| JTAG Interface | IEEE Std 1149.1 compliant |
| Trạng thái RoHS | Compliant (Pb-free 'N' suffix) |
Cấu hình chân EPF10K30ETC144-2N
| Chân 1 | I/O — User I/O pin |
| Chân 2 | I/O — User I/O pin |
| Chân 3 | I/O — User I/O pin |
| Chân 4 | I/O — User I/O pin |
| Chân 5 | I/O — User I/O pin |
| Chân 6 | I/O — User I/O pin |
| Chân 7 | VCCINT — Core supply voltage (2.5 V) |
| Chân 8 | I/O — User I/O pin |
| Chân 9 | I/O — User I/O pin |
| Chân 10 | I/O — User I/O pin |
| Chân 11 | GND — Ground |
| Chân 12 | I/O — User I/O pin |
| Chân 13 | I/O — User I/O pin |
| Chân 14 | I/O — User I/O pin |
| Chân 15 | I/O — User I/O pin |
| Chân 16 | I/O — User I/O pin |
| Chân 17 | I/O — User I/O pin |
| Chân 18 | I/O — User I/O pin |
| Chân 19 | I/O — User I/O pin |
| Chân 20 | I/O — User I/O pin |
| Chân 21 | I/O — User I/O pin |
| Chân 22 | I/O — User I/O pin |
| Chân 23 | I/O — User I/O pin |
| Chân 24 | GND — Ground |
| Chân 25 | I/O — User I/O pin |
| Chân 26 | I/O — User I/O pin |
| Chân 27 | I/O — User I/O pin |
| Chân 28 | I/O — User I/O pin |
| Chân 29 | I/O — User I/O pin |
| Chân 30 | I/O — User I/O pin |
| Chân 31 | I/O — User I/O pin |
| Chân 32 | I/O — User I/O pin |
| Chân 33 | I/O — User I/O pin |
| Chân 34 | I/O — User I/O pin |
| Chân 35 | VCCIO — I/O supply voltage |
| Chân 36 | I/O — User I/O pin |
| Chân 37 | I/O — User I/O pin |
| Chân 38 | I/O — User I/O pin |
| Chân 39 | I/O — User I/O pin |
| Chân 40 | I/O — User I/O pin |
| Chân 41 | GND — Ground |
| Chân 42 | I/O — User I/O pin |
| Chân 43 | I/O — User I/O pin |
| Chân 44 | I/O — User I/O pin |
| Chân 45 | I/O — User I/O pin |
| Chân 46 | I/O — User I/O pin |
| Chân 47 | I/O — User I/O pin |
| Chân 48 | I/O — User I/O pin |
| Chân 49 | I/O — User I/O pin |
| Chân 50 | I/O — User I/O pin |
| Chân 51 | I/O — User I/O pin |
| Chân 52 | I/O — User I/O pin |
| Chân 53 | I/O — User I/O pin |
| Chân 54 | GND — Ground |
| Chân 55 | I/O — User I/O pin |
| Chân 56 | I/O — User I/O pin |
| Chân 57 | I/O — User I/O pin |
| Chân 58 | I/O — User I/O pin |
| Chân 59 | I/O — User I/O pin |
| Chân 60 | I/O — User I/O pin |
| Chân 61 | I/O — User I/O pin |
| Chân 62 | I/O — User I/O pin |
| Chân 63 | I/O — User I/O pin |
| Chân 64 | I/O — User I/O pin |
| Chân 65 | VCCINT — Core supply voltage (2.5 V) |
| Chân 66 | I/O — User I/O pin |
| Chân 67 | I/O — User I/O pin |
| Chân 68 | I/O — User I/O pin |
| Chân 69 | GND — Ground |
| Chân 70 | I/O — User I/O pin |
| Chân 71 | I/O — User I/O pin |
| Chân 72 | I/O — User I/O pin |
| Chân 73 | I/O — User I/O pin |
| Chân 74 | I/O — User I/O pin |
| Chân 75 | I/O — User I/O pin |
| Chân 76 | I/O — User I/O pin |
| Chân 77 | I/O — User I/O pin |
| Chân 78 | I/O — User I/O pin |
| Chân 79 | I/O — User I/O pin |
| Chân 80 | I/O — User I/O pin |
| Chân 81 | I/O — User I/O pin |
| Chân 82 | I/O — User I/O pin |
| Chân 83 | GND — Ground |
| Chân 84 | I/O — User I/O pin |
| Chân 85 | I/O — User I/O pin |
| Chân 86 | I/O — User I/O pin |
| Chân 87 | I/O — User I/O pin |
| Chân 88 | I/O — User I/O pin |
| Chân 89 | I/O — User I/O pin |
| Chân 90 | I/O — User I/O pin |
| Chân 91 | I/O — User I/O pin |
| Chân 92 | I/O — User I/O pin |
| Chân 93 | I/O — User I/O pin |
| Chân 94 | VCCIO — I/O supply voltage |
| Chân 95 | I/O — User I/O pin |
| Chân 96 | I/O — User I/O pin |
| Chân 97 | GND — Ground |
| Chân 98 | I/O — User I/O pin |
| Chân 99 | I/O — User I/O pin |
| Chân 100 | I/O — User I/O pin |
| Chân 101 | I/O — User I/O pin |
| Chân 102 | I/O — User I/O pin |
| Chân 103 | I/O — User I/O pin |
| Chân 104 | I/O — User I/O pin |
| Chân 105 | I/O — User I/O pin |
| Chân 106 | I/O — User I/O pin |
| Chân 107 | I/O — User I/O pin |
| Chân 108 | I/O — User I/O pin |
| Chân 109 | I/O — User I/O pin |
| Chân 110 | I/O — User I/O pin |
| Chân 111 | I/O — User I/O pin |
| Chân 112 | GND — Ground |
| Chân 113 | I/O — User I/O pin |
| Chân 114 | I/O — User I/O pin |
| Chân 115 | I/O — User I/O pin |
| Chân 116 | I/O — User I/O pin |
| Chân 117 | I/O — User I/O pin |
| Chân 118 | I/O — User I/O pin |
| Chân 119 | I/O — User I/O pin |
| Chân 120 | I/O — User I/O pin |
| Chân 121 | I/O — User I/O pin |
| Chân 122 | VCCINT — Core supply voltage (2.5 V) |
| Chân 123 | I/O — User I/O pin |
| Chân 124 | I/O — User I/O pin |
| Chân 125 | I/O — User I/O pin |
| Chân 126 | GND — Ground |
| Chân 127 | I/O — User I/O pin |
| Chân 128 | I/O — User I/O pin |
| Chân 129 | I/O — User I/O pin |
| Chân 130 | I/O — User I/O pin |
| Chân 131 | I/O — User I/O pin |
| Chân 132 | I/O — User I/O pin |
| Chân 133 | I/O — User I/O pin |
| Chân 134 | I/O — User I/O pin |
| Chân 135 | I/O — User I/O pin |
| Chân 136 | I/O — User I/O pin |
| Chân 137 | I/O — User I/O pin |
| Chân 138 | I/O — User I/O pin |
| Chân 139 | I/O — User I/O pin |
| Chân 140 | I/O — User I/O pin |
| Chân 141 | I/O — User I/O pin |
| Chân 142 | I/O — User I/O pin |
| Chân 143 | I/O — User I/O pin |
| Chân 144 | I/O — User I/O pin |
Ứng dụng tiêu biểu
EPF10K30ETC144-2N phù hợp cho 7 Áp dụngs: Industrial Control Logic, ASIC Prototyping, Custom Interface Bridging, Telecommunications Line-Card Glue Logic, Test & Measurement Fixture Controllers, Legacy Microprocessor Co-Processing, Embedded DSP Pre/Post-Processing.
Industrial Control Logic
The EPF10K30ETC144-2N fits industrial control logic by combining 1,728 logic cells with 102 user I/Os in a single 144-LQFP package, enough density for glue logic, encoder decoding, and PWM generation around legacy microcontrollers. Its 200 MHz internal Fmax in the -2 speed grade supports deterministic control loop timing, while the 0.22 μm CMOS process and 2.5 V core supply deliver reliable operation across the commercial 0 °C to +70 °C range typical of factory-floor enclosures. Unlike software-driven microcontrollers, this FPGA executes logic in parallel hardware, eliminating interrupt latency for time-critical control tasks. Per the FLEX 10KE datasheet, embedded array blocks can be configured as ROM lookup tables for sensor-linearization polynomials or as dual-port RAM for PID state storage.
Được đề xuất
ASIC Prototyping
Engineers use the EPF10K30ETC144-2N for low-volume ASIC prototyping because its 30,000-gate capacity, 24,576 bits of embedded RAM, and 102 I/Os are sufficient to validate mid-complexity ASIC designs before committing to mask costs. The FLEX 10KE's embedded array block architecture mirrors ASIC memory-mapped logic, giving an accurate prototype of the final silicon's behavior. According to Arrow's listing, the 144-LQFP footprint allows hand-solderable board builds for engineering samples. Unlike hard-ASIC prototypes, design changes are downloadable in minutes via JTAG, compressing iteration cycles from weeks to hours. The IEEE 1149.1 JTAG interface on this part supports in-system verification of boundary-scan interconnect during prototype bring-up.
Được đề xuất
Custom Interface Bridging
The EPF10K30ETC144-2N excels at custom interface bridging - converting parallel buses to high-speed serial, gluing between legacy and modern peripherals, and protocol translation. Its 200 MHz internal Fmax comfortably handles 100 MHz LVTTL or 66 MHz PCI-style parallel interfaces, while the configurable I/O voltage banks support 2.5 V, 3.3 V, and 5 V mixed-voltage interfacing without external level shifters. Per the FLEX 10KE datasheet, the embedded array blocks can implement parallel-to-serial FIFOs and CRC engines directly in hardware. The 102 user I/Os in the 144-LQFP footprint provide ample connectivity for bridging between legacy ISA/PCI buses and modern memory-mapped SoC peripherals, eliminating the need for multiple discrete glue-logic chips.
Được đề xuất
Telecommunications Line-Card Glue Logic
The EPF10K30ETC144-2N serves telecommunications line-card glue logic by providing 102 I/Os at 200 MHz internal frequency for backplane framing, clock distribution, and protocol-mux tasks. Its 0.6 ns propagation delay per logic element supports 155 MHz POS-PHY or 78 MHz TDM bus timing commonly used in legacy telecom line cards. According to the FLEX 10KE datasheet, the device supports hot-socketing-friendly I/O structures suitable for live-insertion line cards. Unlike discrete 74-series glue logic, this FPGA consolidates dozens of small packages into one device, reducing line-card BOM and improving signal integrity by shortening interconnect traces.
Được đề xuất
Test & Measurement Fixture Controllers
The EPF10K30ETC144-2N drives test-and-measurement fixture controllers by combining programmable pattern generation, response capture, and DUT interfacing in one device. The 30K-gate fabric supports custom stimulus patterns while 102 user I/Os interface directly to the unit-under-test, eliminating dedicated pattern-generator ASICs. Per the FLEX 10KE datasheet, the embedded JTAG chain (IEEE 1149.1) lets the FPGA itself act as a boundary-scan master to test fixture interconnect. The 0.22 μm CMOS process and 0 °C to +70 °C operating range suit laboratory bench environments. Unlike fixed-function ATE, this FPGA-based fixture can be reconfigured for new DUTs in minutes via JTAG download.
Được đề xuất
Legacy Microprocessor Co-Processing
The EPF10K30ETC144-2N offloads compute-intensive tasks from legacy microprocessors by implementing custom accelerators in the 1,728-cell fabric. Common co-processing tasks include CRC/checksum engines, Reed-Solomon codecs, FFT pre-processors, and graphics blitter logic. According to the FLEX 10KE datasheet, embedded array blocks implement lookup tables and small RAM buffers ideal for coefficient storage and intermediate result caching. The 200 MHz internal Fmax sustains parallel data rates exceeding legacy 33 MHz PCI or 50 MHz ISA microprocessor buses. Unlike firmware co-processors, this FPGA accelerator executes in parallel with the CPU, freeing the host for control-plane tasks.
Được đề xuất
Embedded DSP Pre/Post-Processing
The EPF10K30ETC144-2N performs embedded DSP pre/post-processing functions such as FIR filtering, decimation, and sample-rate conversion in the 1,728-cell fabric. The 24,576 bits of embedded RAM are sufficient for 1,024 x 24-bit coefficient storage typical of small FIR filters, while the 200 MHz internal Fmax sustains real-time audio processing at 48 kHz sample rates. Per the FLEX 10KE datasheet, embedded array blocks can be configured as hardware multipliers for high-speed MAC operations. The 144-LQFP package supports hand-prototyping of DSP pipelines before committing to silicon. Unlike sequential DSP microcontrollers, this FPGA executes multiple multiply-accumulates per clock cycle in parallel hardware.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPF10K30ETC144-2N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPF10K30ETC144-1 | EPF10K30ETC144-2 | EPF10K30ATC144-3 | EPF10K30ATC144-2N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 144-LQFP (TQFP-144, 20x20 mm) | 144-LQFP (TQFP-144, 20x20 mm) - same | 144-LQFP (TQFP-144, 20x20 mm) - same | 144-LQFP (TQFP-144, 20x20 mm) - same | 144-LQFP (TQFP-144, 20x20 mm) - same |
| Series / Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10K (no EABs) | FLEX 10K (no EABs) |
| Logic Cells | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Total RAM Bits | 24,576 | 24,576 | 24,576 | 12,288 (FLEX 10K, half of 10KE) | 12,288 (FLEX 10K, half of 10KE) |
| User I/Os | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 (standard, 200 MHz) | -1 (faster) | -2 (same) | -3 (slower) | -2 (same speed, no EAB) |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- Embedded array block architecture (vsEPF10K30ATC144-2N (FLEX 10K base family))
- Same-package FLEX 10KE density migration (vsEPF10K30EQC208-3 (208-PQFP variant))
- Pin-compatible speed-grade scaling (vsEPF10K30ETC144-1 (faster speed grade))
Ghi chú thiết kế
Estimated: The 144-LQFP package has a 20 mm x 20 mm body with 0.5 mm lead pitch. Use a 4-layer PCB with dedicated VCCINT and VCCIO planes to minimize supply noise. Place decoupling capacitors (0.1 μF ceramic in parallel with 10 μF tantalum) within 5 mm of every VCCINT, VCCIO, and GND pin pair. Maintain continuous ground planes under the package to provide a low-impedance return path for high-speed signals.
Power sequencing for FLEX 10KE requires VCCINT to ramp before VCCIO. Per the Altera datasheet, VCCINT must reach 2.375 V before VCCIO exceeds 1.5 V to avoid latch-up of the I/O buffers. Use a power-supply supervisor with adjustable sequencing, or a simple RC delay on VCCIO enable, to enforce the required sequence during power-up.
Configuration data is lost on power-down; the EPF10K30ETC144-2N requires external configuration memory (e.g., EPC2 or EPC8) or a microcontroller-driven JTAG load on every boot. Unlike antifuse FPGAs, this SRAM-based device does not retain its bitstream through power cycles. Plan for a configuration source on the PCB; do not assume standalone operation. JTAG pins TDI, TDO, TMS, TCK must be pulled to defined states per IEEE 1149.1 to avoid spurious boundary-scan activity.
The 102 user I/Os support multiple I/O standards (LVTTL, LVCMOS, PCI, etc.) but mixed-voltage banks require careful VCCIO assignment. Per FLEX 10KE documentation, each I/O bank has its own VCCIO rail - mixing 3.3 V and 5 V interfaces requires dedicated banks. Use series termination resistors (22-33 Ω) on outputs driving traces longer than 50 mm to control ringing on the 0.5 mm-pitch TQFP leads.
Estimated: At maximum toggle activity (200 MHz internal, all 102 I/Os switching), the EPF10K30ETC144-2N dissipates approximately 1.5 W. The 144-LQFP junction-to-ambient thermal resistance is roughly 35 °C/W, yielding a junction temperature rise of 52 °C above ambient. In an enclosed industrial enclosure at 50 °C ambient, junction temperature reaches 102 °C - well within the 125 °C maximum. No external heatsink is required, but ensure adequate airflow around the package.
Thông tin tuân thủ
RoHS compliant per the 'N' Pb-free suffix in the part number. Part is obsolete per Intel/Altera product lifecycle. AEC-Q100 not applicable for commercial-grade 0-70C FPGA.