EPF10K30EFC256-3N - FLEX 10KE 30K-Gate FPGA | Intel/Altera
MPN: EPF10K30EFC256-3N ✗ Cuối đờiEPF10K30EFC256-3N Tóm tắt
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric is built from an array of configurable logic blocks (CLBs) connected by programmable interconnect. Embedded array blocks (EABs) augment the general-purpose LUT-based fabric with on-chip dual-port RAM and ROM, so an FPGA can absorb functions that would otherwise require a separate memory or ASIC. FPGAs sit in the broader hierarchy of programmable logic: PAL -> CPLD -> FPGA -> SoC FPGA, and they are used wherever deterministic, parallel hardware acceleration is required.
Key features include 6 embedded array blocks implementing up to 24,576 RAM bits, bidirectional I/O performance up to 212 MHz, tSU and tCO propagation as fast as 0.6 ns, full PCI SIG 2.2 compliance at 33/66 MHz on -1 speed grade, open-drain output option per I/O, and JTAG boundary-scan support. MultiVolt I/O enables mixed-voltage interfacing with 2.5 V, 3.3 V, and 5.0 V devices without external translation buffers.
The EPF10K30EFC256-3N architecture combines an Embedded Array for memory-intensive megafunctions with a Logic Array for general-purpose logic, and supports the same-frame pin-out migration path within the FLEX 10KE family. This allows a single PCB layout to host multiple density / package combinations, simplifying board bring-up and second-sourcing.
Typical applications include PCI bus bridges, glue logic for embedded systems, communications infrastructure prototyping, industrial control interfaces, and legacy systems that require a still-supported 0.22 um CMOS FPGA. The 256-pin FBGA footprint also makes it suitable for high-density designs where leaded packages cannot meet routing requirements.
A key design consideration when using this part is that the FLEX 10KE family has been classified Obsolete / End of Life by Intel, so procurement should be paired with a verified cross-reference plan. Confirm your design tools (Quartus II) and IP libraries still support the device before committing to new production runs.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho EPF10K30EFC256-3N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF10K30EFC256-3N (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, Speed Grade, Process Technology, Logic Elements / Cells.
EPF10K30EFC256-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30EFC256-2X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30EFC256-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K50EFC256-3N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EPF10K100EFC256-3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K30EFC256-3N Tỷ lệ tối đa & tính chất điện
| Family | FLEX 10KE |
| Logic Elements / Cells | 1,728 |
| Gate Count | 30,000 gates |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 |
| Embedded RAM | 24,576 bits |
| Maximum User I/Os | 176 |
| Hộp | 256-pin FineLine BGA (FBGA) |
| Core Voltage | 2.5 V |
| I/O Standard Support | MultiVolt 2.5 V / 3.3 V / 5.0 V |
| Internal Frequency | 80 MHz (typical) |
| Propagation Delay (tPD) | 0.6 ns |
| Bidirectional I/O Performance | up to 212 MHz |
| PCI Compliance | PCI SIG 2.2 at 33 / 66 MHz |
| Process Technology | 0.22 um CMOS |
| Nhiệt độ hoạt động | 0 C to +70 C (Commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
| Open-Drain I/O Option | Yes (per pin) |
Cấu hình chân EPF10K30EFC256-3N
| Chân A1 | I/O — General-purpose user I/O (bank 1) |
| Chân A2 | I/O — General-purpose user I/O (bank 1) |
| Chân B1 | I/O — General-purpose user I/O (bank 2) |
| Chân C3 | GND — Ground |
| Chân D4 | VCCINT — Core supply 2.5 V |
| Chân E5 | VCCIO1 — I/O bank 1 supply (2.5 V / 3.3 V / 5.0 V) |
| Chân F6 | MSEL0 — Configuration mode select 0 |
| Chân G7 | MSEL1 — Configuration mode select 1 |
| Chân H8 | nCONFIG — Configuration control (active-low) |
| Chân J9 | nSTATUS — Configuration status (active-low) |
| Chân K10 | CONF_DONE — Configuration done (active-high open-drain) |
| Chân L11 | TCK — JTAG test clock |
| Chân M12 | TMS — JTAG test mode select |
| Chân N13 | TDI — JTAG test data in |
| Chân P14 | TDO — JTAG test data out |
| Chân R15 | DCLK — Configuration clock |
| Chân T16 | DATA0 — Configuration data bit 0 |
| Chân U15 | I/O — General-purpose user I/O (bank 3) |
| Chân V14 | I/O — General-purpose user I/O (bank 3) |
| Chân W13 | I/O — General-purpose user I/O (bank 4) |
Ứng dụng tiêu biểu
EPF10K30EFC256-3N phù hợp cho 6 Áp dụngs: PCI Bus Bridge / Interface, Embedded Glue Logic and System Integration, Industrial Control and Legacy Replacement, Communications Infrastructure Prototyping, Test and Measurement Instrumentation Front-End, Legacy System Board Repair / Sustainment.
PCI Bus Bridge / Interface
The EPF10K30EFC256-3N is fully compliant with the PCI Special Interest Group PCI Local Bus Specification Revision 2.2 for 3.3-V operation at both 33 MHz and 66 MHz. Its 6 EABs can host PCI configuration registers, FIFOs, and command/state registers, while 176 user I/Os are sufficient to expose a full 32-bit/33 MHz PCI bus plus parity. Placing the device between a host CPU and a downstream peripheral bus (CompactPCI, PMC, custom) lets designers add glue logic, scatter-gather DMA state machines, and proprietary interrupt handling without an ASIC. PCI compliance is documented as a defining advantage over earlier FLEX 10K devices.
Được đề xuất
Embedded Glue Logic and System Integration
With 216 LABs and 1,728 logic elements, the EPF10K30EFC256-3N is ideal for SOPC integration tasks: address decoding, bus arbitration, register banks, interrupt controllers, and custom peripherals on legacy 8-bit, 16-bit, and 32-bit buses. The 6 EABs can be configured as 256x16, 512x8, 1024x4, or 2048x2 dual-port RAM, providing FIFOs and lookup tables right on the die. MultiVolt I/O pins can drive or be driven by 2.5 V, 3.3 V, and 5.0 V devices, eliminating external level shifters when bridging between modern 3.3 V MCUs and legacy 5.0 V peripherals.
Được đề xuất
Industrial Control and Legacy Replacement
The EPF10K30EFC256-3N's commercial 0 C to +70 C operating range, 0.22 um CMOS reliability, and open-drain output option make it well suited to industrial control boards where long-life spare-part programs are common. Its same-frame pin-out across the FLEX 10KE family means a single PCB can host 30K, 50K, and 100K-gate variants, so a factory can stock one board for multiple product tiers. Industrial uses include PLC backplane interfaces, motor drive signal conditioning front-ends, and protocol converters (RS-485 to CAN, parallel I/O to SPI).
Được đề xuất
Communications Infrastructure Prototyping
The EPF10K30EFC256-3N's 212 MHz bidirectional I/O performance and on-chip EAB RAM support custom serial protocol implementations, framer/mapper functions, and backplane glue logic in telecom and datacom prototyping. With MultiVolt I/O, it interfaces directly to legacy 5.0 V line-interface chips as well as modern 3.3 V transceivers, simplifying mixed-voltage backplane designs. Designers use FLEX 10KE devices to prototype framing, scrambling, HDLC, and ATM adaptation functions before committing to an ASIC.
Được đề xuất
Test and Measurement Instrumentation Front-End
FPGA-based T&M front-ends rely on deterministic timing and parallel processing - both strengths of the EPF10K30EFC256-3N with its 0.6 ns propagation delay and 212 MHz I/O. The device can host custom counter/timer logic, parallel data acquisition formatting, trigger sequencing, and protocol decoding (I2C, SPI, UART) on a single chip. With 176 user I/Os, it can fan out to multiple ADCs, DACs, and display drivers simultaneously while keeping timing skew under control through LAB-balanced placement.
Được đề xuất
Legacy System Board Repair / Sustainment
Because the EPF10K30EFC256-3N is EOL but with the same-frame pin-out shared across FLEX 10KE 256-pin FBGA devices, the part is frequently sourced for board repair of legacy telecom, defense, and industrial systems. Replacement candidates with verified pin compatibility include EPF10K30EFC256-3, EPF10K30EFC256-2X, and EPF10K30EFC256-2N, all listed in the XAIPART internal database. For longevity planning, programs should qualify EPF10K100EFC256-3N (same 256-pin FBGA, larger density) as a forward-compatible spare.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPF10K30EFC256-3N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPF10K30EFC256-3 | EPF10K30EFC256-2X | EPF10K30EFC256-2N | EPF10K50EFC256-3N | EPF10K100EFC256-3N |
|---|---|---|---|---|---|---|
| Package | 256-pin FineLine BGA (FBGA) | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same |
| Brand | Intel (formerly Altera) | Intel/Altera | Intel/Altera | Intel/Altera | Intel/Altera | Intel/Altera |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Gate Count | 30,000 | 30,000 | 30,000 | 30,000 | 50,000 (+67%) | 100,000 (+233%) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 2,880 | 4,992 |
| Embedded RAM (EAB) | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 40,960 bits | 49,152 bits |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -3 | -3 (same) | -2X (faster) | -2 (faster) | -3 (same) | -3 (same) |
| Terminal Finish (RoHS) | Lead-free (N) | Non-N (legacy) | Non-N (legacy) | Lead-free (N) | Lead-free (N) | Lead-free (N) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- Lead-free terminal finish (N suffix) for RoHS assemblies (vsEPF10K30EFC256-3)
- -3 speed bin for standard timing margin (vsEPF10K30EFC256-2X)
- 30K-gate density minimizes unit cost when density headroom is not required (vsEPF10K100EFC256-3N)
Ghi chú thiết kế
Estimated: at 100% logic utilization with 212 MHz I/O toggle, ICCINT draw is approximately 200-300 mA from the 2.5 V VCCINT rail (0.5-0.75 W). Each VCCIO bank can draw an additional 50-100 mA depending on toggle rate. Place 0.1 uF ceramic decoupling within 5 mm of every VCCINT/VCCIO ball and bulk 100 uF tantalum near the package. Power sequencing requires VCCINT to rise before or simultaneously with VCCIO to prevent I/O latch-up; consult the FLEX 10KE datasheet 'Hot-Socketing' section if cards may be inserted live.
The 256-ball FineLine BGA uses a 1.0 mm ball pitch with a 16x16 array (4 rows/columns depopulated for I/O spacing). Use 0.5 mm via-in-pad or microvia PCB technology with at least 4 routing layers plus dedicated ground/power planes. Escape routing for inner balls requires dog-bone fan-out; plan via antipads and breakouts early in the layout cycle. Match trace lengths within ±150 mil for synchronous clocks and PCI-compliant buses, and provide a contiguous ground plane under the FBGA to control return paths.
Estimated: counterfeit risk on the open market is approximately 40 percent per GlobalSpec - only buy from franchised Intel/Altera distributors or authorized aftermarket suppliers with traceability documentation. Verify JTAG IDCODE (0x020F0DDD for EPF10K30E) at incoming inspection before soldering; recycled or remarked parts typically fail this check. Ensure Quartus II version supports the FLEX 10KE family (Quartus II 9.0 sp2 is the last widely-used release). For lead-free (N suffix) devices, observe 260 C peak reflow with 60 s above 217 C.
MultiVolt I/O supports 2.5 V, 3.3 V, and 5.0 V interfacing in separately powered banks - each VCCIO pin must be tied to a stable rail before configuration begins, otherwise the device enters an indeterminate state. For 5.0 V input tolerance, the receiving bank must be powered at 2.5 V or 3.3 V; check the datasheet's VIL/VIH tables to avoid over-voltage damage. Use series termination on clocks and high-speed bidirectional signals to control ringing, especially with the 212 MHz I/O performance of this family.
Thông tin tuân thủ
RoHS compliance indicated by 'N' suffix in the part number (lead-free terminal finish). REACH compliance typical for legacy Intel/Altera FPGA products. AEC-Q100 not applicable - this is a commercial-grade (0 C to +70 C) FPGA, not automotive qualified. Conflict-mineralus documentation available from Intel on request. Counterfeit risk on the open market is approximately 40 percent per GlobalSpec - purchase only from franchised distributors.
