Intel

EPF10K50ETC144-3 - FLEX 10KE 50K Gates 144-TQFP FPGA | Intel

MPN: EPF10K50ETC144-3 ✗ Cuối đời

2.5 V Vdss 102 Package 166.67 MHz Speed 40,960 bits Memory

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EPF10K50ETC144-3 Tóm tắt

The Intel (formerly Altera) EPF10K50ETC144-3 is a member of the FLEX 10KE family of embedded programmable logic devices (PLDs), providing System-on-a-Programmable-Chip (SOPC) integration with 50,000 typical gates, 2,880 logic cells, 40,960 bits of embedded memory, and 360 LABs/CLBs in a 144-pin TQFP (also referenced as TQFP-144) surface-mount package.

A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O cells are defined by a user-supplied bitstream after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) - alongside CPLDs, PALs, and GALs - and represent the highest-density, highest-performance tier used for glue logic, custom DSP, ASIC prototyping, and full system integration. The FLEX 10KE family pioneered embedded-array architecture, combining look-up-table based logic with embedded memory blocks and Embeddable Logic Array Blocks (EABs) to deliver a System-on-a-Programmable-Chip (SOPC) integration platform that pre-dated modern SoC FPGAs.

Key features include 102 user I/O pins (274 maximum in the family), 0.22 µm CMOS process technology, 166.67 MHz maximum internal frequency, 0.6 ns propagation delay, 2.5 V core supply, and SameFrame pin compatibility across the FLEX 10KE family for design migration. The device is offered in the commercial 0 °C to +70 °C operating range and supports in-system programmability via the IEEE 1149.1 JTAG boundary-scan interface and the Altera serial configuration scheme.

The EPF10K50ETC144-3 is built on a 0.22 µm four-metal-layer CMOS process, with 3.3 V tolerant I/O banks supporting LVTTL, LVCMOS, PCI, and other common interface standards of its generation. Its SRAM-based configuration memory allows unlimited reconfiguration but requires a configuration PROM or microcontroller to load the bitstream at power-up. The -3 speed grade corresponds to a faster device-bin than the -4 grade, enabling higher Fmax for clocked logic paths.

Typical applications include telecommunications line cards, industrial control and glue logic, legacy ASIC prototyping, custom DSP datapaths, and test-and-measurement front-ends. Designers value the FLEX 10KE family for deterministic pin-to-pin timing and abundant memory for small to medium-density designs where modern FPGA tools would be overkill. The 144-pin TQFP package also makes the part hand-solderable for prototyping.

When designing with this part, note that the SRAM configuration cells must be loaded from a serial or parallel PROM on every power-up; plan a configuration clock source and ensure all unused I/O pins are configured as inputs with weak pull-ups to avoid floating-input quiescent current. The SameFrame pin migration path is supported only with the 484-pin FineLine BGA package, so TQFP-144 designs are not directly migratable to higher I/O-count packages without board rework.

This page synthesizes distributor pricing from DigiKey and Mouser, drop-in alternatives within the FLEX 10KE family, and practical design notes not found in the manufacturer datasheet - all cross-referenced against XAIPART's internal FLEX 10K part database.

Bộ thay thế dễ dàng lắp đặt cho EPF10K50ETC144-3 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF10K50ETC144-3 (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Process Technology, Embedded Array Blocks (EABs), Series.

EPF10K30ETC144-2

Intel

Package: 144-LQFP (TQFP, 20x20 mm)

Operating Temperature: 0C to +70C (Commercial)

Process Technology: CMOS, SRAM-based