Intel

EPF10K30ETI144-2N - FLEX 10KE FPGA 30K Gates 144-TQFP | Intel

Name: EPF10K30ETI144-2N - FLEX 10KE FPGA 30K Gates 144-TQFP | Intel
Brand: Intel
SKU: EPF10K30ETI144-2N

MPN: EPF10K30ETI144-2N ⚠ Lần mua cuối

2.5 V Vdss 144-pin TQFP (LQFP-144) Package 200 MHz Speed 24,576 bits Memory

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MOQ: 1 |

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EPF10K30ETI144-2N Tóm tắt

The Intel (formerly Altera) EPF10K30ETI144-2N is a member of the FLEX 10KE family of Embedded Programmable Logic Devices (PLDs), delivering 30,000 typical gates, 1,728 logic elements, and 24,576 bits of embedded SRAM in a 144-pin TQFP package. The device is fabricated on a 0.22 µm CMOS process, operates from a 2.5 V core supply (VCCINT) with MultiVolt I/O support, and is rated for industrial temperature operation (-40 °C to +85 °C). The "-2" speed grade and "N" lead-free suffix denote a moderate-performance, Pb-free industrial-temperature member of the FLEX 10KE family.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. Architecturally, an FPGA sits between fixed-function ASICs and general-purpose processors in the design hierarchy: ASIC > FPGA > CPLD > PLD > programmable logic. FPGAs like the FLEX 10KE family extend traditional gate-array logic with on-chip embedded memory blocks, enabling System-on-a-Programmable-Chip (SOPC) integration of megafunctions such as microcontrollers, FIFOs, DSP filters, and custom peripherals.

Key features of the EPF10K30ETI144-2N include 102 user I/O pins, 216 Logic Array Blocks (LABs) in the structured Logic Element array, a MultiVolt I/O interface supporting 2.5 V/3.3 V/5.0 V mixed-voltage operation, PCI-compliant I/O buffers with selectable pull-up clamping diodes, slew-rate control, and open-drain output options configured on a pin-by-pin basis via Altera logic options. The embedded array blocks (EABs) provide synchronous dual-port RAM, ROM, and multiplier implementations without external memory.

The FLEX 10KE architecture combines a fine-grained Logic Element fabric with coarse-grained Embedded Array Blocks, a flexible interconnect (FastTrack), and a continuous I/O ring supporting a variety of single-ended and differential I/O standards. This hybrid fabric allows designers to implement glue logic, state machines, and memory-intensive megafunctions on a single chip while preserving deterministic timing for the FPGA fabric. The 0.22 µm process provides mature, low-power operation with extensive third-party tool support from the legacy Altera MAX+PLUS II and Quartus flows.

Typical applications include industrial control and factory automation, telecommunications line-card glue logic, PCI interface bridging, prototype ASIC replacement, and low-volume embedded systems requiring on-chip memory and flexible I/O voltage. The 144-TQFP footprint supports a hand-solderable, low-cost PCB assembly process that is well suited to industrial and legacy designs.

When designing with this device, ensure the Quartus or MAX+PLUS II toolchain version is matched to the FLEX 10KE device support, because newer Quartus releases have removed legacy FLEX device support. For new designs, consider migrating to the MAX II or Cyclone families, since FLEX 10KE is a mature, last-time-buy product line.

This page synthesizes distributor pricing, drop-in alternatives from the Site MPN catalog, and design considerations not collected in a single place in the manufacturer datasheet.

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Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF10K30ETI144-2N (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, Process Technology, Configuration Method, RoHS Status.

EPF10K30ETC144-2

Intel

Operating Temperature: 0C to +70C (Commercial)

Package: 144-LQFP (TQFP, 20x20 mm)

Process Technology: CMOS, SRAM-based