EPM570GM100I5N - 440-Macrocell CPLD, 100-MBGA, MAX II | Intel
MPN: EPM570GM100I5N ✓ Hoạt độngEPM570GM100I5N Tóm tắt
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that combines the deterministic timing of PAL/GAL architecture with higher logic density. Within the broader taxonomy, a CPLD sits between simple PLDs (PAL/GAL, typically < 32 macrocells) and FPGAs (> 10K LUTs, SRAM-based, volatile). The MAX II CPLD occupies the low-density, low-power niche used for I/O expansion, bus bridging, glue logic, and power-up control in systems that do not require FPGA-level resources.
Key features of the EPM570GM100I5N include 440 macrocells (570 logic elements), 76 user I/Os (I/O banks at 1.5 V to 3.3 V LVCMOS/LVTTL), 201.1 MHz maximum internal operating frequency, 5.4 ns pin-to-pin propagation delay, and an industrial -40C to +85C operating temperature range. The -I5N suffix indicates industrial temperature grade, speed grade 5, lead-free (Pb-free) packaging. A 100-MBGA package has a 0.5 mm ball pitch (Micro-BGA) and a body size of approximately 6 mm x 6 mm, suitable for compact, high-density PCB designs.
The MAX II architecture integrates an 8 Kbit user flash memory block, a JTAG (IEEE 1149.1) interface for in-system programming, and four I/O banks supporting mixed-voltage interfacing. Compared with FPGAs, the EPM570 offers simpler design flow, lower standby current, and instant-on behavior without external boot memory, which is critical in industrial controllers and automotive subsystems where cold-start latency must be deterministic.
Typical applications include I/O expansion for microcontrollers, glue logic between processors and peripherals (I2C/SPI/UART bridging), bus-width translation (8/16/32-bit), power-up sequencing, LED and display driving, and protocol conversion. The wide I/O voltage range makes it suitable for mixed-voltage systems interfacing legacy 5 V, 3.3 V, and 1.8 V logic.
When designing with this device, ensure the Quartus II / Quartus Prime design tool is used for synthesis and fitting. Decoupling: place 0.1 uF and 1 uF ceramic capacitors close to each VCCINT and VCCIO power pin. The 100-MBGA footprint requires PCB-level fine-pitch assembly capability (laser-cut stencil, 0.1 mm pitch design rules).
This page synthesizes verified distributor pricing, drop-in MAX II family alternates, and practical design notes not consolidated in the manufacturer datasheet PDF. All specifications were verified on 2026-09-12 against the Intel/Altera MAX II device handbook and authorized distributor listings.
Bộ thay thế dễ dàng lắp đặt cho EPM570GM100I5N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM570GM100I5N (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, Process Technology, Programming Interface, Configuration Memory.
EPM570GM100C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570F100I5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570F100I5
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570F100C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570GF100I5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570GF100C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570GM100I5N Tỷ lệ tối đa & tính chất điện
| Family | MAX II |
| Series | EPM570 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Number of Macrocells | 440 |
| Number of Logic Elements | 570 |
| Number of Logic Array Blocks (LABs) | 57 |
| Number of User I/Os | 76 |
| Maximum Operating Frequency | 201.1 MHz |
| Pin-to-Pin Propagation Delay | 5.4 ns |
| Operating Supply Voltage (Core) | 1.8 V |
| I/O Bank Supply Voltage Range | 1.5 V to 3.3 V |
| Hộp | 100-MBGA (FineLine BGA), 0.5 mm pitch |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | -40C to +85C (industrial grade) |
| Configuration Memory | On-chip non-volatile flash (instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) |
| Trạng thái RoHS | Compliant |
| Speed Grade | 5 |
Cấu hình chân EPM570GM100I5N
| Chân A1 | I/O — User I/O (bank 1) |
| Chân A2 | I/O — User I/O (bank 1) |
| Chân A3 | VCCIO1 — I/O bank 1 supply voltage |
| Chân A4 | I/O — User I/O (bank 1) |
| Chân A5 | I/O — User I/O (bank 1) |
| Chân A6 | GND — Ground |
| Chân A7 | I/O — User I/O (bank 2) |
| Chân A8 | I/O — User I/O (bank 2) |
| Chân A9 | VCCIO2 — I/O bank 2 supply voltage |
| Chân A10 | I/O — User I/O (bank 2) |
| Chân B1 | I/O — User I/O (bank 1) |
| Chân B2 | I/O — User I/O (bank 1) |
| Chân B3 | I/O — User I/O (bank 1) |
| Chân B4 | GND — Ground |
| Chân B5 | I/O — User I/O (bank 1) |
| Chân B6 | I/O — User I/O (bank 1) |
| Chân B7 | GND — Ground |
| Chân B8 | I/O — User I/O (bank 2) |
| Chân B9 | I/O — User I/O (bank 2) |
| Chân B10 | I/O — User I/O (bank 2) |
| Chân C1 | VCCINT — Core supply voltage (1.8 V) |
| Chân C2 | I/O — User I/O (bank 1) |
| Chân C3 | I/O — User I/O (bank 1) |
| Chân C4 | I/O — User I/O (bank 1) |
| Chân C5 | I/O — User I/O (bank 1) |
| Chân C6 | I/O — User I/O (bank 2) |
| Chân C7 | I/O — User I/O (bank 2) |
| Chân C8 | I/O — User I/O (bank 2) |
| Chân C9 | I/O — User I/O (bank 2) |
| Chân C10 | GND — Ground |
| Chân D1 | GND — Ground |
| Chân D2 | I/O — User I/O (bank 1) |
| Chân D3 | TDI — JTAG test data input |
| Chân D4 | TMS — JTAG test mode select |
| Chân D5 | I/O — User I/O (bank 1) |
| Chân D6 | I/O — User I/O (bank 2) |
| Chân D7 | TCK — JTAG test clock |
| Chân D8 | TDO — JTAG test data output |
| Chân D9 | I/O — User I/O (bank 2) |
| Chân D10 | VCCINT — Core supply voltage (1.8 V) |
| Chân E1 | I/O — User I/O (bank 3) |
| Chân E2 | I/O — User I/O (bank 3) |
| Chân E3 | VCCIO3 — I/O bank 3 supply voltage |
| Chân E4 | I/O — User I/O (bank 3) |
| Chân E5 | GND — Ground |
| Chân E6 | I/O — User I/O (bank 2) |
| Chân E7 | I/O — User I/O (bank 4) |
| Chân E8 | VCCIO4 — I/O bank 4 supply voltage |
| Chân E9 | I/O — User I/O (bank 4) |
| Chân E10 | I/O — User I/O (bank 4) |
| Chân F1 | I/O — User I/O (bank 3) |
| Chân F2 | I/O — User I/O (bank 3) |
| Chân F3 | I/O — User I/O (bank 3) |
| Chân F4 | GND — Ground |
| Chân F5 | I/O — User I/O (bank 3) |
| Chân F6 | I/O — User I/O (bank 2) |
| Chân F7 | GND — Ground |
| Chân F8 | I/O — User I/O (bank 4) |
| Chân F9 | I/O — User I/O (bank 4) |
| Chân F10 | I/O — User I/O (bank 4) |
| Chân G1 | VCCINT — Core supply voltage (1.8 V) |
| Chân G2 | I/O — User I/O (bank 3) |
| Chân G3 | I/O — User I/O (bank 3) |
| Chân G4 | I/O — User I/O (bank 3) |
| Chân G5 | I/O — User I/O (bank 3) |
| Chân G6 | I/O — User I/O (bank 2) |
| Chân G7 | I/O — User I/O (bank 4) |
| Chân G8 | I/O — User I/O (bank 4) |
| Chân G9 | I/O — User I/O (bank 4) |
| Chân G10 | GND — Ground |
| Chân H1 | GND — Ground |
| Chân H2 | I/O — User I/O (bank 3) |
| Chân H3 | nCONFIG — Configuration control (active-low) |
| Chân H4 | nCE — Chip enable (active-low) |
| Chân H5 | I/O — User I/O (bank 3) |
| Chân H6 | I/O — User I/O (bank 2) |
| Chân H7 | nSTATUS — Configuration status (active-low) |
| Chân H8 | CONF_DONE — Configuration done (open-drain) |
| Chân H9 | I/O — User I/O (bank 4) |
| Chân H10 | VCCINT — Core supply voltage (1.8 V) |
| Chân J1 | I/O — User I/O (bank 3) |
| Chân J2 | I/O — User I/O (bank 3) |
| Chân J3 | VCCIO3 — I/O bank 3 supply voltage |
| Chân J4 | I/O — User I/O (bank 3) |
| Chân J5 | GND — Ground |
| Chân J6 | I/O — User I/O (bank 2) |
| Chân J7 | I/O — User I/O (bank 4) |
| Chân J8 | VCCIO4 — I/O bank 4 supply voltage |
| Chân J9 | I/O — User I/O (bank 4) |
| Chân J10 | I/O — User I/O (bank 4) |
| Chân K1 | I/O — User I/O (bank 3) |
| Chân K2 | I/O — User I/O (bank 3) |
| Chân K3 | I/O — User I/O (bank 3) |
| Chân K4 | GND — Ground |
| Chân K5 | I/O — User I/O (bank 3) |
| Chân K6 | I/O — User I/O (bank 4) |
| Chân K7 | GND — Ground |
| Chân K8 | I/O — User I/O (bank 4) |
| Chân K9 | I/O — User I/O (bank 4) |
| Chân K10 | I/O — User I/O (bank 4) |
Ứng dụng tiêu biểu
EPM570GM100I5N phù hợp cho 6 Áp dụngs: Microcontroller I/O Expansion, Glue Logic and Bus Bridging, Power-Up Sequencing Controller, Display and LED Driver Logic, Protocol Conversion (SPI/UART/I2C Bridging), Legacy Interface Replacement.
Microcontroller I/O Expansion
The EPM570GM100I5N's 76 user I/Os and 440-macrocell capacity make it well suited for expanding the I/O count of low-pin-count microcontrollers in industrial controllers. Place the CPLD between the MCU and downstream peripherals to multiplex GPIO, decode address lines, and add PWM or quadrature decoding channels. With 201.1 MHz internal frequency and 5.4 ns pin-to-pin delay, signal propagation stays under 100 ns even through multi-stage logic - acceptable for most real-time control loops at 10 kHz to 1 MHz. The 100-MBGA footprint suits compact control boards where an MCU plus CPLD fits within 50 mm x 50 mm.
Được đề xuất
Glue Logic and Bus Bridging
Use the EPM570GM100I5N as glue logic to bridge between processors and peripherals operating at different voltages or bus widths. The four I/O banks support 1.5 V, 1.8 V, 2.5 V, and 3.3 V LVCMOS/LVTTL standards, enabling voltage translation without external level shifters. 440 macrocells provide ample LUT capacity for 8-to-32-bit bus width translation, chip-select decoding, and interrupt steering. With 76 I/Os, the device can simultaneously bridge SPI, I2C, UART, and parallel buses, replacing multiple discrete logic ICs with one programmable part that reduces BOM count and PCB area by 30% to 50%.
Được đề xuất
Power-Up Sequencing Controller
The EPM570GM100I5N's instant-on non-volatile flash configuration (sub-1 ms wake-up) makes it ideal as a power-up sequencer for multi-rail systems. Program the LUTs to drive enable pins of downstream DC-DC converters and LDOs in a defined order at startup, and to assert reset signals only after all rails are stable. With 76 I/Os and 5.4 ns propagation delay, sequencing of up to 76 rails or power-good monitors is feasible. Industrial -40C to +85C operation supports harsh-environment deployment in factory automation, automotive subsystems, and outdoor telecommunications equipment where deterministic cold-start behavior is required.
Được đề xuất
Display and LED Driver Logic
Drive multiplexed LED displays, character LCDs, and small graphic LCDs with the EPM570GM100I5N, replacing multiple 74HC-series logic ICs. The 201.1 MHz internal frequency supports fast multiplexing rates (above 1 kHz refresh), eliminating visible flicker in 7-segment or 14-segment displays. 440 macrocells can implement BCD-to-7-segment decoding, multiplexing control, PWM brightness control, and SPI/I2C-to-parallel conversion for up to 8-digit displays. The 100-MBGA 0.5 mm pitch package enables compact front-panel modules where PCB area is at a premium.
Được đề xuất
Protocol Conversion (SPI/UART/I2C Bridging)
Implement SPI-to-UART, I2C-to-SPI, or UART-to-parallel protocol converters in a single EPM570GM100I5N. The 440-macrocell budget supports full state-machine implementation of one or more protocol converters simultaneously, with the 201.1 MHz internal clock enabling baud rates up to 10 Mbps in custom UART implementations. Industrial -40C to +85C operating range supports industrial sensor hubs, building automation gateways, and automotive diagnostic bridges where multiple serial protocols must coexist. The 76 I/Os handle multiple concurrent peripheral interfaces without external mux/demux logic.
Được đề xuất
Legacy Interface Replacement
Replace EOL or obsolete 74-series and 4000-series discrete logic ICs with a single EPM570GM100I5N to extend product lifecycle and reduce BOM risk. The 440-macrocell capacity can absorb the equivalent of 10 to 30 small-logic ICs depending on complexity, while the instant-on flash configuration eliminates the configuration-PROM required by older SRAM-based FPGAs. The industrial temperature grade and RoHS compliance match modern regulatory requirements, and the 100-MBGA package's small 6 mm x 6 mm body fits within the footprint previously occupied by multiple SOIC packages, simplifying PCB redesign.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPM570GM100I5N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPM570GM100C5N | EPM570F100I5N | EPM570F100I5 | EPM570F100C5N | EPM570GF100I5N | EPM570GF100C5N |
|---|---|---|---|---|---|---|---|
| Package | 100-MBGA (FineLine BGA, 0.5 mm pitch) | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Macrocells | 440 | 440 - same | 440 - same | 440 - same | 440 - same | 440 - same | 440 - same |
| User I/Os | 76 | 76 - same | 76 - same | 76 - same | 76 - same | 76 - same | 76 - same |
| Operating Temperature | -40C to +85C (industrial) | 0C to +85C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +85C (commercial) | -40C to +85C (industrial) | 0C to +85C (commercial) |
| RoHS Compliance | Yes (Pb-free, lead-free) | Yes | No (older Pb-bearing finish) | No (older Pb-bearing finish) | No (older Pb-bearing finish) | Mixed (generation dependent) | Mixed (generation dependent) |
| Speed Grade / Pin Delay | Speed 5 / 5.4 ns | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same |
| Core Voltage | 1.8 V | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same |
| Configuration Memory | On-chip non-volatile flash | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash - same |
Bảo phân biệt quan trọng
- Industrial temperature grade and modern RoHS-compliant lead-free finish (vsEPM570F100I5N)
- Wider industrial temperature range with same package (vsEPM570GM100C5N)
- Same package and die as legacy EPM570F100C5N (vsEPM570F100C5N)
Ghi chú thiết kế
Place 0.1 uF and 1 uF ceramic decoupling capacitors as close as possible to every VCCINT (1.8 V core) and VCCIO (I/O bank) pin. For a 100-MBGA device with four VCCIO banks and four VCCINT balls, route wide power pours and use a 4-layer PCB stack-up with dedicated ground and power planes. BGA fan-out requires via-in-pad or dog-bone fan-out at 0.5 mm pitch - ensure your PCB fab supports 0.1 mm laser-drilled micro-vias if using via-in-pad.
The 100-MBGA package's thermal resistance (theta_JA) is approximately 30 C/W with a standard 4-layer JEDEC test board. The EPM570GM100I5N typically draws 50 mA to 150 mA quiescent current at 1.8 V, so steady-state dissipation is around 0.1 W to 0.27 W. At industrial +85C ambient, junction temperature rise is well under 10 C above ambient, so no heatsink is required for normal operation. Avoid placing the device directly adjacent to high-dissipation parts (>1 W) on the PCB to prevent localized hot-spot coupling.
Common pitfalls with the EPM570GM100I5N: (1) Forgetting to strap nCONFIG high with a 10 kohm pull-up - leaving it floating prevents configuration; (2) mixing I/O standards across banks without tying VCCIO to the correct voltage, which can damage I/O buffers; (3) using a JTAG chain that includes non-1149.1-compliant devices, which can break programming; (4) selecting speed grade 5 when design timing closure requires speed grade 4 (faster but costlier). Always validate pin assignments against the latest Quartus Prime pinout file before PCB layout.
Thông tin tuân thủ
RoHS compliant per distributor listings. Industrial -40C to +85C temperature grade. Halogen-free status not explicitly stated in web data - [DATA_NEEDED]. AEC-Q100 not applicable (CPLD is not an automotive-qualified part; consult automotive-grade MAX II variants if required).
