LCMXO3LF-6900E-5MG256I - 6864 LUT MachXO3LF FPGA | Lattice
MPN: LCMXO3LF-6900E-5MG256I ✓ Hoạt độngLCMXO3LF-6900E-5MG256I Tóm tắt
FPGAs (Field Programmable Gate Arrays) are user-programmable semiconductor devices built from a sea of configurable logic blocks (LUTs), programmable interconnect, and I/O cells, allowing engineers to implement any digital logic function post-fabrication. The MachXO3LF is Lattice's ultra-low-power, instant-on branch of the MachXO3 family, designed as a control PLD for glue logic, bus bridging, system configuration, and I/O expansion in cost- and power-sensitive applications. Compared with SRAM FPGAs, MachXO3LF uses on-chip Flash configuration memory so it boots in microseconds without an external boot PROM.
Key features include 6,864 LUTs (MachXO3LF series), embedded 245,760-bit user Flash memory, distributed RAM, embedded block RAM, two PLL pairs, dual configuration I2C/SPI/SJTAG ports, and on-chip 1.2 V core regulator. The 256-ball csfBGA (MG256) package exposes 206 user I/O across multiple I/O banks supporting LVCMOS 1.2 V to 3.3 V and LVDS signaling standards, with per-pin slew-rate, drive strength, and pull configuration. The LCMXO3LF-6900E grade is the mid-density device between the 4,300 LUT and 9,400 LUT siblings.
The architecture uses 65 nm Flash+CMOS process technology with embedded Flash configuration cells that eliminate the need for an external boot memory. The on-chip voltage regulator derives all internal rails from a single 1.2 V core or a 2.5 V/3.3 V single-rail supply, and the hardened I/O bank structure supports hot-socketing and 5 V tolerance on selected banks. The MachXO3LF supports Lattice Diamond and Lattice Propel design environments, plus IP libraries for I3C, I2C, SPI, UART, GPIO expansion, and platform management functions.
Typical applications include I/O expansion and bridging in industrial controllers, machine vision cameras, and motor drives; control logic in LED/LCD displays and human-machine interface panels; secure boot monitors and platform management in servers and routers; and as a glue-logic replacement for CPLDs and discrete logic. The instant-on Flash configuration is particularly valuable in safety-critical systems where the FPGA must be active within milliseconds of power-up.
When designing with this part, plan I/O bank assignments early because the 206 user I/O are split across four banks with independent voltage references, and unused banks can be powered down to reduce quiescent current. Use Lattice Diamond 3.x or later with the MachXO3LF device library for synthesis, place-and-route, and bitstream generation.
This page synthesizes verified distributor pricing from DigiKey and Mouser (as of 2026-10-08), MachXO3LF family drop-in alternatives, and practical design notes not collected in a single location in the Lattice MachXO3LF datasheet.
Bộ thay thế dễ dàng lắp đặt cho LCMXO3LF-6900E-5MG256I — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với LCMXO3LF-6900E-5MG256I (cùng hình factor và footprint) — khác nhau ở Package, Family, Speed Grade, Operating Temperature, Process Technology.
LCMXO3LF-6900C-5BG256C
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →LCMXO3LF-9400E-5MG256I
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
LCMXO3LF-4300E-5MG256I
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
LCMXO3LF-4300E-5MG121I
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →LCMXO2-4000HC-6MG132I
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →LCMXO2-640HC-6TG100I
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →LCMXO3LF-6900E-5MG256I Tỷ lệ tối đa & tính chất điện
| Family | MachXO3LF |
| Series / Grade | 6900E |
| Logic Elements / LUTs | 6,864 LUTs |
| User I/O Count | 206 |
| Embedded Memory | 245,760 bits |
| Configuration Memory | On-chip Flash (non-volatile) |
| Core Voltage | 1.2 V |
| Single-Rail Supply Option | 2.5 V / 3.3 V |
| Process Technology | 65 nm Flash + CMOS |
| Hộp | 256-ball csfBGA (MG256), 0.5 mm pitch |
| Nhiệt độ hoạt động | -40C to +100C (Industrial) |
| Speed Grade | -5 |
| I/O Banks | Multiple banks (LVCMOS 1.2 V - 3.3 V, LVDS) |
| Configuration Interfaces | I2C / SPI / Slave JTAG |
| PLLs | 2 PLL pairs |
| Trạng thái RoHS | Compliant |
| Kiểu lắp đặt | Surface Mount (BGA) |
Hướng dẫn cấu hình chân LCMXO3LF-6900E-5MG256I 256-ball csfbga (mg256), 0.5 mm pitch
Cấu hình chân cho LCMXO3LF-6900E-5MG256I (256-ball csfbga (mg256), 0.5 mm pitch gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho LCMXO3LF-6900E-5MG256I.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
LCMXO3LF-6900E-5MG256I phù hợp cho 6 Áp dụngs: Industrial I/O Expansion and Bus Bridging, Server Platform Management and Secure Boot, Motor Control Gate-Driver Logic, LED Display and Human-Machine Interface, Machine Vision Camera Interface, Automotive Infotainment and Body Electronics.
Industrial I/O Expansion and Bus Bridging
The LCMXO3LF-6900E-5MG256I excels in industrial I/O expansion and bus bridging because its 206 user I/O and 6,864 LUTs easily handle multi-protocol glue logic. The 245,760 bits of embedded memory buffer protocol conversion packets, while the on-chip Flash configuration eliminates the boot PROM that legacy CPLD designs still require, cutting BOM cost in PLC backplanes and distributed I/O blocks. It bridges SPI to I2C, UART to SPI, and parallel FPGA buses to serial transceivers without external logic, and the -40C to +100C industrial grade withstands factory-floor temperatures.
Được đề xuất
Server Platform Management and Secure Boot
The LCMXO3LF-6900E-5MG256I is well suited for server platform management because its on-chip Flash configuration provides an instant-on, tamper-resistant boot controller within microseconds of power-up. Its 6,864 LUTs implement PMBus controllers, fan-tach monitors, and secure boot monitors that authenticate the main host CPU's firmware before releasing reset. The 206 user I/O connect to voltage rails, temperature sensors, and reset sequencers across a server board, while 1.2 V core voltage plus optional 2.5/3.3 V single-rail supply simplifies the auxiliary power tree. The hardened I/O banks support 5 V tolerance on selected banks.
Được đề xuất
Motor Control Gate-Driver Logic
The LCMXO3LF-6900E-5MG256I generates PWM and dead-time control logic for three-phase motor drives because its 6,864 LUTs and 2 PLL pairs synthesize the high-resolution PWM and quadrature encoder interfaces required for FOC algorithms. The 206 user I/O drive gate-driver enable, fault, and brake lines for multi-axis servo drives, and the on-chip Flash configuration eliminates the boot PROM that protects against controller hang on power-up. The -40C to +100C industrial range handles the elevated ambient temperature inside a motor-control cabinet.
Được đề xuất
LED Display and Human-Machine Interface
The LCMXO3LF-6900E-5MG256I drives large LED walls and HMI panels because its 206 user I/O scan-matrix keyboards, multiplex LED arrays, and TFT backlights without external scan logic. The 245,760 bits of embedded memory buffer display refresh and debounce state, while 2 PLL pairs synthesize the pixel clock for LVDS display interfaces. The on-chip Flash configuration means the panel powers on to a known good state, eliminating boot-time artifacts in commercial signage. The 1.2 V core reduces panel power consumption.
Được đề xuất
Machine Vision Camera Interface
The LCMXO3LF-6900E-5MG256I bridges image-sensor data lanes to host processors in machine-vision cameras because its 206 user I/O handle MIPI-CSI lane aggregation, GPIO triggers, and lens-control PWM. The 245,760 bits of embedded memory buffer line-scan data while 2 PLL pairs generate the MIPI byte clock from an external oscillator. The non-volatile Flash configuration lets the camera boot into calibration state instantly, supporting vision-guided robotics with sub-100 ms boot budgets. The industrial -40C to +100C range tolerates enclosed camera housings.
Được đề xuất
Automotive Infotainment and Body Electronics
The LCMXO3LF-6900E-5MG256I glues together infotainment and body-electronics domains because its on-chip Flash configuration survives automotive power-down transients without re-flashing. The 6,864 LUTs run CAN/LIN gateways, RGB-LED controllers, and audio-routing logic, while 206 user I/O connect to body-control modules, HMI touchscreens, and rear-seat displays. The -40C to +100C industrial range is well within the body-electronics thermal envelope, though the automotive-grade LCMXO3LFP version should be selected for AEC-Q100 designs. The 1.2 V core plus 3.3 V single-rail simplifies the always-on power tree.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho LCMXO3LF-6900E-5MG256I — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | LCMXO3LF-6900C-5BG256C | LCMXO3LF-9400E-5MG256I | LCMXO3LF-4300E-5MG256I | LCMXO2-4000HC-6MG132I | LCMXO2-640HC-6TG100I |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 256-ball csfBGA (MG256) | 256-ball csfBGA (BG256) | 256-ball csfBGA (MG256) | 256-ball csfBGA (MG256) | 132-ball csfBGA (MG132) | 100-pin TQFP (TG100) |
| Family / Series | MachXO3LF / 6900E | MachXO3LF / 6900C | MachXO3LF / 9400E | MachXO3LF / 4300E | MachXO2 / 4000HC | MachXO2 / 640HC |
| Logic Capacity (LUTs) | 6,864 | 6,864 | 9,400 | 4,300 | 4,320 | 640 |
| User I/O Count | 206 | 206 | 206 | 206 | 105 | 78 |
| Core Voltage | 1.2 V (single-rail 2.5 V / 3.3 V option) | 1.2 V (single-rail 2.5 V / 3.3 V option) | 1.2 V (single-rail 2.5 V / 3.3 V option) | 1.2 V (single-rail 2.5 V / 3.3 V option) | 1.2 V / 2.5 V - 3.3 V | 1.2 V / 2.5 V - 3.3 V |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Embedded Memory | 245,760 bits | 245,760 bits | 331,776 bits | 92,160 bits | 92,160 bits | 18,432 bits |
| Configuration Memory | On-chip Flash (non-volatile) | On-chip Flash (non-volatile) | On-chip Flash (non-volatile) | On-chip Flash (non-volatile) | On-chip Flash (non-volatile) | On-chip Flash (non-volatile) |
| Approx. Unit Price (USD, qty-1, as of 2026-10-08) | $24.50 | ~$21.00 | ~$32.00 | ~$16.00 | ~$13.50 | ~$7.50 |
Bảo phân biệt quan trọng
- On-chip Flash configuration eliminates external boot PROM (vsSRAM-based competitors (e.g., Lattice ECP5 series in lower densities))
- Single-rail supply option reduces power-tree complexity (vsSRAM FPGAs requiring 1.0 V + 1.8 V + 2.5 V rails)
- Mid-density 6,864 LUT position in the ultra-low-power family (vsLCMXO3LF-4300E-5MG256I (4,300 LUTs) and LCMXO3LF-9400E-5MG256I (9,400 LUTs))
Ghi chú thiết kế
Estimated: at typical industrial operating conditions (3.3 V single-rail supply, 25% toggle rate, all 206 I/O driving 10 pF loads at 50 MHz) the LCMXO3LF-6900E-5MG256I dissipates approximately 0.6 W - 1.0 W. The 256-ball csfBGA package has a theta-JA of approximately 28 C/W with a 4-layer JEDEC test board, giving a junction temperature rise of 17 - 28 C above ambient. A thermal relief copper pour under the BGA is recommended for enclosed enclosures where ambient may approach +85 C, though external heatsinking is generally not required.
The 256-ball csfBGA package uses 0.5 mm pitch, which requires laser-drilled microvias and 4-layer (or finer) PCB stack-up for reliable assembly. Per the Lattice MachXO3LF hardware reference, place 0.1 uF + 10 uF decoupling capacitors within 3 mm of every VCC/VCCAUX pair, with the smallest value nearest the ball. Use length-matched differential pairs for LVDS pairs (within 0.13 mm), and keep all configuration-mode strapping resistors within 25 mm of their respective balls to avoid spurious mode selection at power-up.
Three common design pitfalls for LCMXO3LF-6900E-5MG256I: (1) Assuming the 256-ball csfBGA pinout matches the 484-ball csfBGA - they do not, even within the same family; (2) Forgetting that the -5 speed grade is the slowest in the MachXO3LF family and may not meet 200 MHz+ timing budgets; (3) Driving 5 V signals into LVCMOS33 banks without verifying the bank's VCCIO - some banks support 5 V tolerance, others do not. Always cross-reference the bank's VCCIO with the I/O standard table in the Lattice MachXO3LF datasheet before layout finalization.
Place the MachXO3LF-6900E close to the I/O connectors and high-speed buses it interfaces with to keep signal-integrity paths short. Route configuration interfaces (I2C, SPI, JTAG) on a separate layer from the user I/O, and provide a 4.7 kohm pull-up on the I2C SDA/SCL lines per the Lattice MachXO3 hardware checklist. Keep the external configuration Flash (if used for dual-boot) within 25 mm of the SPI/I2C balls, and add a ground guard ring around the BGA to reduce EMI coupling to adjacent analog/RF traces.
Thông tin tuân thủ
RoHS compliant per Lattice product page. The LCMXO3LF-6900E is not AEC-Q100 qualified; AEC-Q100 qualified variants ship with the LCMXO3LFP prefix. Reach and conflict-minerals compliance confirmed via Lattice supplier declarations.
