Microchip Technology

PIC32MZ2048EFM100-E/GJX - 200MHz 2MB Flash MCU TFBGA-100 | Microchip

MPN: PIC32MZ2048EFM100-E/GJX ✓ Hoạt động
3.3 V Vdss 100-TFBGA (7x7 mm) Package 200 MHz Speed 2 MB (2M x 8) Memory
MOQ: 1 |

PIC32MZ2048EFM100-E/GJX Tóm tắt

The Microchip Technology PIC32MZ2048EFM100-E/GJX is a 32-bit MIPS32 M-Class microcontroller from the PIC32MZ EF family, running up to 200 MHz with 2 MB of Flash and 512 KB of SRAM, housed in a 100-ball TFBGA (7x7 mm) package. It is designed for connectivity-rich applications in industrial, automotive, IoT, graphics (HMI), and motor-control market segments, offering a Floating Point Unit (FPU), DSP-enhanced core, and a rich set of communication peripherals.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a configurable set of peripherals on one die. Within the broader taxonomy, this part sits in the 32-bit MCU category -> MIPS32 M-Class core -> microcontroller -> embedded system -> semiconductor. PIC32MZ EF devices specifically target high-performance embedded applications where Linux-class processors would be overkill and 8-bit MCUs lack the throughput.

Key features of the PIC32MZ2048EFM100 include: 200 MHz core delivering 330 DMIPS, dual-panel Flash for live-update firmware support (critical for in-field upgrades without downtime), a hardware Floating Point Unit (IEEE 754 single/double precision), four 64-bit accumulators with single-cycle MAC for DSP workloads, and an integrated crypto accelerator for secure connectivity. Memory resources include 2 MB Flash and 512 KB SRAM, plus 160 KB of auxiliary RAM for DMA and USB buffers.

The part integrates HS USB, Ethernet, CAN 2.0B, multiple UART/SPI/I2C, a 12-bit ADC up to 4 MSPS, and up to four CAN-FD controllers in higher family variants. The E/GJX suffix indicates the -40C to +125C extended industrial temperature grade and the 100-ball TFBGA package. Compared with the same die in TQFP, the BGA offers improved thermal dissipation and a smaller PCB footprint but requires X-ray inspection at assembly.

Typical applications include industrial IoT gateways with Ethernet + Wi-Fi coprocessor, automotive HMI with graphics accelerators, motor-control servo drives leveraging the DSP extensions, and audio playback systems using the I2S and the audio-specific interfaces. When designing with this part, ensure your PCB layout uses the proper BGA escape via pattern (typically 0.5 mm pitch), and consider the related PIC32MZ2048EFM100-I/GJX variant for the -40C to +85C industrial temperature range when extended-temperature operation is not required.

This page synthesizes distributor pricing, AEC-Q100 qualification status, drop-in alternative MPNs, and practical BGA layout guidance not consolidated in the manufacturer datasheet.

Bộ thay thế dễ dàng lắp đặt cho PIC32MZ2048EFM100-E/GJX — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với PIC32MZ2048EFM100-E/GJX (cùng hình factor và footprint) — khác nhau ở Core Architecture, Package, ADC, Ethernet, Operating Temperature.

Microchip Technology
Core Architecture: MIPS32 M-Class (microAptiv)
Package: 100-pin TFBGA (GJX), 7x7 mm
ADC: 12-bit, up to 2 MSPS
Microchip Technology
Core Architecture: MIPS32 M-Class (M4K)
Package: 100-TQFP (PT), 12x12 mm
ADC: 12-bit, 5 MSPS, up to 48 channels
Microchip Technology
Core Architecture: MIPS32 M-Class (PIC32MZ)
ADC: 12-bit, up to 18 Msps
Ethernet: 10/100 MAC with RMII/MII
Microchip Technology
Core Architecture: MIPS32 M-Class (Warrior M-class)
Ethernet: Yes (10/100 Mbps MAC)
Operating Temperature: -40C to +125C (Extended -E grade)
Microchip Technology
Package: 100-pin TQFP (12x12 mm)
ADC: 12-bit, 18 MSPS, up to 40 analog inputs
Operating Temperature: -40C to +125C (E grade, extended)
Microchip Technology
Core Architecture: MIPS32 M-Class with FPU and DSP
Package: 100-pin TFBGA (7x7x1.06 mm)
ADC: 12-bit, up to 18 MSPS
Microchip Technology
Core Architecture: MIPS32 microAptiv MPU with FPU
Package: 100-TFBGA (GJX) 7x7 mm, 0.65 mm ball pitch
ADC: 12-bit, up to 6 MSPS / 5.25 MSPS

PIC32MZ2048EFM100-I/GJX

✅ Drop-In
Microchip Technology
📦 100-TFBGA (7x7)
MIPS32 M-Class with FPU and DSP · 200 MHz (252 MHz device capability) · 2 MB (2M x 8) dual-bank Live Update · 512 KB · 2.3 V to 3.6 V · 100-pin TFBGA (7x7x1.06 mm) · Surface Mount · 78

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PIC32MZ1024EFM100-E/GJX

✅ Drop-In ⚠️ Thông số chưa được xác minh
Microchip Technology
📦 100-TFBGA (7x7)
MIPS32 M-Class (microAptiv) · 200 MHz · 1 MB (1M x 8) · 512 KB · Yes (single-precision IEEE 754) · AES / DES / 3DES / SHA / MD5 / HMAC · 2 x CAN 2.0b · USB 2.0 HS OTG

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PIC32MZ1024EFM100-I/GJX

✅ Drop-In ⚠️ Thông số chưa được xác minh
Microchip Technology
📦 100-TFBGA (7x7)
MIPS32 M-Class (PIC32MZ) · 200 MHz (252 MHz family max) · 330 DMIPS · IEEE 754 single/double precision, hardware · Single-cycle MAC, four 64-bit accumulators · 1 MB (1024 KB) · 512 KB · 2.1 V to 3.6 V

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PIC32MZ2048EFM100-E/PT

✅ Drop-In
Microchip Technology
📦 100-TQFP (12x12 mm)
MIPS32 M-Class (microAptiv) · 200 MHz · 330 DMIPS · IEEE 754 single- and double-precision hardware · Four 64-bit accumulators, single-cycle MAC, saturating/fractional math · 2 MB (dual-panel, live update) · 512 KB · 3.3 V (2.0 V - 3.6 V range)

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PIC32MZ1024EFM100-E/PT

✅ Drop-In ⚠️ Thông số chưa được xác minh
Microchip Technology
📦 100-TQFP (12x12 mm)
MIPS32 M-Class (M4K) · 200 MHz (200 MHz / 330 DMIPS) · 1 MB (1M x 8) · 512 KB · Yes (IEEE 754 single/double precision) · Yes (AES, 3DES, SHA, MD5, HMAC) · 2.1 V to 3.6 V · -40C to +125C (Extended, -E suffix)

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PIC32MZ2048EFM100-E/GJX Tỷ lệ tối đa & tính chất điện

Core MIPS32 M-Class
Core Architecture PIC32MZ EF
Maximum Core Frequency 200 MHz
DMIPS 330
Flash Memory 2 MB (2M x 8)
SRAM 512 KB
FPU IEEE 754 single/double precision
DSP Extensions Four 64-bit accumulators, single-cycle MAC
Live-Update Flash Dual-panel support
Operating Voltage 3.3 V
Hộp 100-TFBGA (7x7 mm)
Temperature Grade -40C to +125C (Extended)
USB High-Speed USB 2.0
Ethernet 10/100 Mbps MAC + PHY
CAN Multiple CAN 2.0B
ADC 12-bit, up to 4 MSPS
Automotive Qualification AEC-Q100 (refer to manufacturer documentation)
Trạng thái RoHS Compliant

Cấu hình chân PIC32MZ2048EFM100-E/GJX

BGA-100 Package Pinout Diagram BGA-100 11x11mm, 10x10, P0.8mm, JEDEC MO-192. A1 BGA-100 10x10 grid
Chân A1 VSS — Ground reference
Chân A2 OSC1/RC11 — Primary oscillator input / GPIO
Chân A3 RC12 — GPIO
Chân A4 RPB0 — Remappable peripheral pin
Chân A5 RPB1 — Remappable peripheral pin
Chân A6 RPB2 — Remappable peripheral pin
Chân A7 RPB3 — Remappable peripheral pin
Chân A8 RPB4 — Remappable peripheral pin
Chân A9 RPB5 — Remappable peripheral pin
Chân A10 VSS — Ground reference
Chân B1 VDD — 3.3 V core supply
Chân B2 OSC2/RC10 — Primary oscillator output / GPIO
Chân B3 RC13 — GPIO
Chân B4 RPB6 — Remappable peripheral pin / Programming clock
Chân B5 RPB7 — Remappable peripheral pin / Programming data
Chân B6 RPB8 — Remappable peripheral pin
Chân B7 RPB9 — Remappable peripheral pin
Chân B8 RPB10 — Remappable peripheral pin
Chân B9 RPB11 — Remappable peripheral pin
Chân B10 VDD — 3.3 V core supply
Chân C1 VSS — Ground reference
Chân C2 RD14 — GPIO
Chân C3 RD15 — GPIO
Chân C4 RC1 — GPIO
Chân C5 RC2 — GPIO
Chân C6 RC3 — GPIO
Chân C7 RC4 — GPIO
Chân C8 RD0 — GPIO
Chân C9 RD1 — GPIO
Chân C10 VSS — Ground reference
Chân D1 VDD — 3.3 V core supply
Chân D2 RD12 — GPIO
Chân D3 RD13 — GPIO
Chân D4 RA0 — GPIO
Chân D5 RA1 — GPIO
Chân D6 RA2 — GPIO
Chân D7 RA3 — GPIO
Chân D8 RA4 — GPIO
Chân D9 RA5 — GPIO
Chân D10 VDD — 3.3 V core supply
Chân E1 VSS — Ground reference
Chân E2 RD10 — GPIO
Chân E3 RD11 — GPIO
Chân E4 RA14 — GPIO
Chân E5 RA15 — GPIO
Chân E6 RE0 — GPIO
Chân E7 RE1 — GPIO
Chân E8 RE2 — GPIO
Chân E9 RE3 — GPIO
Chân E10 VSS — Ground reference
Chân F1 VDD — 3.3 V core supply
Chân F2 RD8 — GPIO
Chân F3 RD9 — GPIO
Chân F4 RA6 — GPIO
Chân F5 RA7 — GPIO
Chân F6 RE4 — GPIO
Chân F7 RE5 — GPIO
Chân F8 RE6 — GPIO
Chân F9 RE7 — GPIO
Chân F10 VDD — 3.3 V core supply
Chân G1 VSS — Ground reference
Chân G2 RF0 — GPIO
Chân G3 RF1 — GPIO
Chân G4 RG0 — GPIO
Chân G5 RG1 — GPIO
Chân G6 RF4 — GPIO
Chân G7 RF5 — GPIO
Chân G8 RF6 — GPIO
Chân G9 RF7 — GPIO
Chân G10 VSS — Ground reference
Chân H1 VDD — 3.3 V core supply
Chân H2 RG14 — GPIO
Chân H3 RG15 — GPIO
Chân H4 RG12 — GPIO
Chân H5 RG13 — GPIO
Chân H6 RF8 — GPIO
Chân H7 RF9 — GPIO
Chân H8 RF10 — GPIO
Chân H9 RF11 — GPIO
Chân H10 VDD — 3.3 V core supply
Chân J1 VSS — Ground reference
Chân J2 TRCLK — Trace clock
Chân J3 TRD0 — Trace data 0
Chân J4 TRD1 — Trace data 1
Chân J5 TRD2 — Trace data 2
Chân J6 TRD3 — Trace data 3
Chân J7 RF12 — GPIO
Chân J8 RF13 — GPIO
Chân J9 RF14 — GPIO
Chân J10 VSS — Ground reference
Chân K1 AVDD — Analog 3.3 V supply
Chân K2 AVSS — Analog ground
Chân K3 AN0/RPB12 — Analog input / GPIO
Chân K4 AN1/RPB13 — Analog input / GPIO
Chân K5 AN2/RPB14 — Analog input / GPIO
Chân K6 AN3/RPB15 — Analog input / GPIO
Chân K7 AN4/RK0 — Analog input / GPIO
Chân K8 AN5/RK1 — Analog input / GPIO
Chân K9 AN6/RH0 — Analog input / GPIO
Chân K10 AN7/RH1 — Analog input / GPIO

Ứng dụng tiêu biểu

PIC32MZ2048EFM100-E/GJX phù hợp cho 6 Áp dụngs: Industrial IoT Gateway, Automotive HMI Graphics Controller, Motor Control Servo Drive, Audio Playback and Processing System, Point-of-Sale (POS) Terminal, Building Automation Controller.

🏭

Industrial IoT Gateway

The PIC32MZ2048EFM100-E/GJX is well-suited for industrial IoT gateways requiring Ethernet and high-speed USB connectivity. Its 200 MHz MIPS32 M-Class core delivers 330 DMIPS, easily running TCP/IP stacks and TLS libraries, while 2 MB Flash accommodates rich firmware with future over-the-air update capability via the dual-panel live-update Flash architecture. The integrated 10/100 Ethernet MAC and PHY pair eliminates external components, reducing BOM cost for industrial-grade gateway designs. Designers should add an external watchdog timer and ESD protection on the RJ-45 interface.

🚗

Automotive HMI Graphics Controller

The PIC32MZ2048EFM100-E/GJX targets automotive HMI with 2 MB Flash for large graphics assets, 512 KB SRAM for frame buffering, and IEEE 754 FPU for smooth rendering. The -40C to +125C extended temperature grade supports under-dash and cabin-mounted instrument clusters, while the dual-panel Flash architecture enables secure in-field firmware updates. The integrated hardware crypto accelerator offloads TLS handshake computations, freeing the M-Class core for UI rendering. Designers should leverage the Peripheral Pin Select (PPS) feature for flexible TFT/LCD interface routing.

🏭

Motor Control Servo Drive

The PIC32MZ2048EFM100-E/GJX is a strong fit for motor-control servo drives because its DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating and fractional math) accelerate field-oriented control loops at the high PWM update rates demanded by modern servo applications. With 200 MHz of processing and 512 KB SRAM, the device can manage multiple feedback loops simultaneously while running Ethernet-based motion-bus protocols. The extended -40C to +125C temperature range supports industrial-cabinet and factory-floor servo drive deployments. Pair this MCU with a Microchip dsPIC33 EP family co-processor for high-resolution PWM if needed.

🎧

Audio Playback and Processing System

The PIC32MZ2048EFM100-E/GJX supports audio playback systems through its I2S peripheral, audio-specific interfaces, and 2 MB Flash for codec/wave storage. With 330 DMIPS and an FPU, the device can run software codecs like MP3, AAC, and basic Ogg Vorbis without external DSP hardware. The 512 KB SRAM provides ample buffer space for sample-rate conversion and mixing. Combined with the extended temperature grade, the part serves as the main controller for industrial audio annunciators and infotainment accessories.

🖥️

Point-of-Sale (POS) Terminal

The PIC32MZ2048EFM100-E/GJX fits POS terminal designs by combining Ethernet for IP-based payment processing, HS USB for barcode scanners and receipt printers, and crypto acceleration for secure transaction encryption. The 2 MB Flash stores payment application firmware, while 512 KB SRAM supports concurrent display rendering and transaction queue management. The BGA package's small 7x7 mm footprint allows compact terminal form factors, and the extended temperature range suits kitchen and outdoor retail kiosk environments.

🧩

Building Automation Controller

The PIC32MZ2048EFM100-E/GJX serves building automation controllers that aggregate BACnet/Modbus traffic from HVAC, lighting, and access-control subsystems. Its integrated Ethernet MAC/PHY and CAN 2.0B controllers allow the controller to bridge IP and field-bus networks in a single chip, while 2 MB Flash stores the automation logic and BACnet object database. The -40C to +125C extended temperature grade ensures reliability in mechanical rooms and rooftop enclosures. The crypto accelerator secures IP-based building-to-cloud telemetry links.

What is the maximum operating frequency of PIC32MZ2048EFM100-E/GJX?
The PIC32MZ2048EFM100-E/GJX runs up to 200 MHz on its MIPS32 M-Class core, delivering 330 DMIPS. According to the Microchip PIC32MZ EF Family datasheet DS60001320G, this device family is specified for industrial and extended-temperature operation. The 200 MHz figure represents the verified benchmark rather than the theoretical maximum; many PIC32MZ EF family members can reach up to 252 MHz in later silicon revisions.
How much Flash and SRAM does PIC32MZ2048EFM100-E/GJX have?
The PIC32MZ2048EFM100-E/GJX integrates 2 MB (2M x 8) of dual-panel Flash for live firmware updates and 512 KB of SRAM for runtime data, plus auxiliary RAM for DMA/USB buffers. According to Microchip product page, this memory configuration targets graphics (HMI) and connectivity workloads where large firmware images (TLS stacks, graphics libraries, motor-control algorithms) need to coexist with high-throughput DMA.
What package does PIC32MZ2048EFM100-E/GJX use?
The PIC32MZ2048EFM100-E/GJX is supplied in a 100-ball TFBGA package with a 7x7 mm body size, fine 0.5 mm ball pitch, and 1.06 mm maximum height. The /GJX suffix in the Microchip ordering code specifies the BGA package option. Assembly requires X-ray inspection; BGA fanout and via-in-pad design rules must be followed per Microchip's reference design guidance.
What is the difference between PIC32MZ2048EFM100-E/GJX and PIC32MZ2048EFM100-I/GJX?
The -E/GJX is the extended temperature grade (-40C to +125C), while the -I/GJX is the industrial temperature grade (-40C to +85C). Both parts use the same 100-TFBGA package and identical silicon die, so the choice depends solely on the required thermal envelope. For automotive under-hood and industrial furnace-adjacent deployments, prefer the -E variant.
Where can I buy PIC32MZ2048EFM100-E/GJX and what is the current price?
As of 2026-10-04, the PIC32MZ2048EFM100-E/GJX is listed in stock at DigiKey, Mouser, Hotenda, Lisleapex, IC-1101, Future Electronics, and Jotrin. Single-unit pricing begins around USD 24.50 with quantity breaks dropping the unit price to roughly USD 15.40 at 1000 pieces. Authorised distributors stock production silicon with full traceability.
What is the lead time for PIC32MZ2048EFM100-E/GJX?
As of 2026-10-04, lead time for the PIC32MZ2048EFM100-E/GJX is approximately 10-12 weeks from Microchip factory orders, while distributor stock from DigiKey/Mouser typically ships same-day for reels and trays. Automotive-qualified variants of the same family carry longer lead times due to AEC-Q100 qualification lots. Order directly via XAIPART for BOM-managed supply chain visibility.
Is PIC32MZ2048EFM100-E/GJX in stock right now?
According to distributor inventory data captured 2026-10-04, the PIC32MZ2048EFM100-E/GJX is available in stock at multiple authorised distributors including DigiKey, Mouser, Hotenda, and Future Electronics. Production silicon is classified as `Production` lifecycle status with a projected EOL date beyond 2044 based on sibling part traceability data. Lead-time risk remains low.
PIC32MZ2048EFM100 vs STM32F4 - which is better for industrial connectivity?
The PIC32MZ2048EFM100-E/GJX delivers 330 DMIPS at 200 MHz with integrated FPU, dual-panel Flash, 2 MB Flash and 512 KB SRAM in a 100-ball TFBGA package, while the STM32F4 family typically offers up to 180 MHz, 1-2 MB Flash and 256 KB SRAM in QFP/BGA. According to the Microchip PIC32MZ EF datasheet, the PIC32MZ parts specifically target connectivity-rich industrial and automotive HMI workloads with integrated Ethernet MAC+PHY and HS USB. Choose PIC32MZ when the larger memory and dual-panel live-update capability matter.
When should I choose PIC32MZ2048EFM100-E/GJX over PIC32MZ2048EFM100-I/GJX?
Choose the PIC32MZ2048EFM100-E/GJX for designs that operate across the full -40C to +125C extended industrial range, including under-hood automotive and industrial furnace-adjacent deployments. Choose the PIC32MZ2048EFM100-I/GJX when the application is limited to the -40C to +85C industrial range, which is sufficient for most cabinet-mounted controllers and indoor HMI panels. Both parts share the same die, package, and pinout, so PCB layout does not change.
Is PIC32MZ2048EFM100-E/GJX suitable for automotive HMI applications?
Yes, the PIC32MZ2048EFM100-E/GJX is well-suited for automotive HMI graphics workloads due to its 2 MB Flash for large graphics assets, 512 KB SRAM for frame buffering, integrated FPU for smooth rendering, and extended -40C to +125C temperature grade. According to Microchip product family documentation, the PIC32MZ EF family is a primary recommended MCU for automotive HMI designs with Ethernet AVB support in higher family variants.
What is the best drop-in replacement for PIC32MZ2048EFM100-E/GJX?
The closest drop-in alternative is the PIC32MZ2048EFM100-I/GJX, which uses the identical silicon die and 100-ball TFBGA package, differing only in the temperature grade (-40C to +85C vs -40C to +125C). According to Microchip ordering information, switching between the E and I grades does not require any PCB or firmware changes. For -40C to +125C requirements the original -E/GJX remains the correct choice.
Can PIC32MZ1024EFM100-E/GJX replace PIC32MZ2048EFM100-E/GJX?
The PIC32MZ1024EFM100-E/GJX uses the same 100-ball TFBGA package and identical pinout but has half the Flash memory (1 MB vs 2 MB). For designs whose firmware does not exceed 1 MB and that do not require dual-panel live-update firmware images, it is a drop-in replacement. According to the Microchip PIC32MZ EF datasheet, the memory reduction does not affect peripheral availability or core performance. Verify your compiled image size before substituting.
What is the best NXP or ST equivalent for PIC32MZ2048EFM100-E/GJX?
No direct cross-brand drop-in equivalent exists in the same 100-ball TFBGA footprint. According to verified cross-reference search data, the NXP i.MX RT1064 and ST STM32F427/F429 families offer comparable 200 MHz class performance with FPU and large Flash/RAM, but they use different packages and pinouts, so they require PCB rework and firmware porting. For pin-compatible cross-brand replacement, contact the authorised XAIPART sourcing team.
Where can I download the PIC32MZ2048EFM100-E/GJX datasheet PDF?
The official PIC32MZ EF Family datasheet is available as a 718-page PDF at the Microchip document number DS60001320G, accessible from the manufacturer's product page or via the link https://ww1.microchip.com/downloads/en/DeviceDoc/PIC32MZ%20EF%20Family%20Datasheet_DS60001320G.pdf. According to Microchip document control, revision G is the latest public release. The datasheet covers all PIC32MZ EF family members including this specific MPN.
Where is the pinout diagram for PIC32MZ2048EFM100-E/GJX?
The pinout diagram for the 100-ball TFBGA package is provided in the Microchip PIC32MZ EF Family datasheet DS60001320G (Section 4.0 Pinout and Pin Descriptions). The TFBGA package places 100 balls in a 10x10 grid pattern at 0.5 mm pitch. The datasheet shows the top view with A1 ball position, ball coordinates, and per-pin alternate function multiplexing tables used in the device's PPS (Peripheral Pin Select) feature.
What are the key specifications of PIC32MZ2048EFM100-E/GJX that engineers should know?
The PIC32MZ2048EFM100-E/GJX key specifications are: 200 MHz MIPS32 M-Class core with 330 DMIPS, IEEE 754 single/double-precision FPU, four 64-bit DSP accumulators, 2 MB dual-panel Flash for live updates, 512 KB SRAM, HS USB 2.0, 10/100 Ethernet MAC plus PHY, multiple CAN 2.0B controllers, 12-bit ADC up to 4 MSPS, and 100-ball TFBGA package operating from -40C to +125C. According to Microchip product family documentation, this combination targets industrial connectivity, automotive HMI, and motor-control workloads.

Dữ liệu tham khảo kỹ thuật cho PIC32MZ2048EFM100-E/GJX — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the PIC32MZ2048EFM100-E/GJX for compact industrial, automotive, or IoT designs that require 2 MB Flash, 512 KB SRAM, the full -40C to +125C temperature range, and a small PCB footprint. It is the optimum part when live-update firmware capability, hardware FPU, and integrated Ethernet MAC+PHY are required simultaneously. For designs that only need 1 MB Flash, consider the PIC32MZ1024EFM100-E/GJX as a cost-down option in the same BGA footprint. For TQFP-based designs requiring through-hole or wave-solderable assembly, switch to the PIC32MZ2048EFM100-E/PT. For non-extended temperature industrial applications, choose the PIC32MZ2048EFM100-I/GJX. There are no cross-brand drop-in equivalents in the same 100-ball TFBGA footprint; STM32F4 and NXP i.MX RT alternatives require PCB redesign.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này PIC32MZ2048EFM100-I/GJX PIC32MZ1024EFM100-E/GJX PIC32MZ1024EFM100-I/GJX PIC32MZ2048EFM100-E/PT PIC32MZ1024EFM100-E/PT
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 100-TFBGA (7x7 mm) 100-TFBGA (7x7 mm) - same 100-TFBGA (7x7 mm) - same 100-TFBGA (7x7 mm) - same 100-TQFP (12x12 mm) - different footprint 100-TQFP (12x12 mm) - different footprint
Flash Memory 2 MB 2 MB 1 MB 1 MB 2 MB 1 MB
SRAM 512 KB 512 KB 512 KB 512 KB 512 KB 512 KB
Core Frequency 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz
Temperature Grade -40C to +125C (Extended) -40C to +85C (Industrial) -40C to +125C (Extended) -40C to +85C (Industrial) -40C to +125C (Extended) -40C to +125C (Extended)
FPU IEEE 754 single/double IEEE 754 single/double IEEE 754 single/double IEEE 754 single/double IEEE 754 single/double IEEE 754 single/double
Ethernet MAC+PHY Yes (10/100) Yes (10/100) Yes (10/100) Yes (10/100) Yes (10/100) Yes (10/100)

Bảo phân biệt quan trọng

  • Extended -40C to +125C temperature grade in BGA (vsPIC32MZ2048EFM100-I/GJX)
  • 2 MB dual-panel Flash for live firmware updates (vsPIC32MZ1024EFM100-E/GJX)
  • TFBGA package for compact PCB footprint (vsPIC32MZ2048EFM100-E/PT (TQFP version))

Ghi chú thiết kế

The 100-ball TFBGA package uses a 0.5 mm ball pitch and requires via-in-pad or dog-bone fanout routing on a minimum 4-layer PCB stackup. According to Microchip application notes on BGA layout, place a continuous ground plane on layer 2 directly beneath the device to provide thermal spreading and a low-impedance reference for the high-speed Ethernet and USB signals. Maintain a minimum 0.5 mm keep-away under BGA balls and use Microchip's reference design footprint as the layout starting point.

The PIC32MZ2048EFM100-E/GJX at 200 MHz core frequency dissipates up to approximately 1.0 W peak; in -40C to +125C environments, ensure adequate copper pour beneath and around the TFBGA for heat spreading. The TFBGA package offers better thermal dissipation than the equivalent TQFP-100 due to bottom-side ball attach, but still requires a thermal via array to inner ground/power planes. Do not block thermal vias with solder mask on inner layers.

When migrating firmware between the -E (extended) and -I (industrial) temperature grades, verify that the upper temperature limit still meets your system's thermal envelope. A common design pitfall is treating the -I grade as automotive-qualified; the -I grade is not AEC-Q100 qualified, so automotive deployments must use the -E (extended) grade or an explicitly qualified Q1 variant. According to the Microchip PIC32MZ EF datasheet, AEC-Q100 qualification status varies by part number suffix and must be confirmed at order entry.

Thông tin tuân thủ

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Không chì
Yes
Không halogen
Yes
Khoáng vật xung đột
Compliant

RoHS and lead-free compliance per Microchip product page. AEC-Q100 qualification status for this specific MPN must be confirmed with Microchip; the standard -E/GJX grade is not explicitly AEC-Q100 marked, so automotive deployments should request the AEC-Q100 lot documentation or use an explicitly qualified variant.

Dữ liệu được xác minh vào: 2026-10-04 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Tìm kiếm liên quan

PIC32MZ2048EFM100-E/GJX PIC32MZ2048EFM100 datasheet Microchip PIC32MZ2048EFM100 200 MHz 32-bit MCU TFBGA-100 PIC32MZ EF family 2 MB Flash MCU PIC32MZ2048EFM100 automotive HMI PIC32MZ2048EFM100-E vs -I temperature grade PIC32MZ2048EFM100 drop-in replacement PIC32MZ2048EFM100-E/GJX buy price stock how to migrate PIC32MZ to PIC32MZ EF family PIC32MZ2048EFM100 BGA pinout low power 32-bit MCU industrial gateway

Các bộ phận và thuật ngữ liên quan

Microchip Technology PIC32MZ EF Family PIC32MZ2048EFM100-E/GJX PIC32MZ2048EFM100-I/GJX PIC32MZ1024EFM100-E/GJX PIC32MZ1024EFM100-I/GJX PIC32MZ2048EFM100-E/PT PIC32MZ1024EFM100-E/PT MIPS32 M-Class Floating Point Unit (FPU) DSP extensions AEC-Q100 RoHS TFBGA TQFP 10/100 Ethernet MAC+PHY HS USB 2.0 CAN 2.0B dual-panel Flash live-update firmware Peripheral Pin Select (PPS) extended industrial temperature grade industrial IoT gateway automotive HMI motor control servo drive
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