XC7Z045-1FBG676I - Zynq-7000 SoC, 350K Logic Cells | AMD
MPN: XC7Z045-1FBG676I ✓ Hoạt độngXC7Z045-1FBG676I Tóm tắt
A System-on-Chip (SoC) is an integrated circuit that combines multiple system components, such as processors, memory interfaces, and I/O, onto a single substrate. The Zynq-7000 family specifically merges a processing system (PS) based on ARM cores with programmable logic (PL) based on FPGA fabric. This architecture allows designers to implement complex algorithms in hardware while maintaining the flexibility of software-defined control, bridging the gap between traditional microprocessors and FPGAs.
Key features of the XC7Z045-1FBG676I include 350K logic cells, 256 KB of on-chip RAM, and support for high-speed transceivers. The device also includes a rich set of I/O options, including multiple high-speed serial transceivers and general-purpose I/O banks. The dual-core ARM Cortex-A9 processor runs at up to 667 MHz, providing substantial processing power for real-time applications.
From a technical perspective, the XC7Z045-1FBG676I leverages AMD's advanced 28nm process technology, balancing performance and power efficiency. The integration of the ARM processor with the Kintex-7 FPGA fabric enables low-latency, high-bandwidth communication between software and hardware, which is critical for applications like software-defined radio, image processing, and industrial control. The device supports a wide range of industry-standard interfaces, including DDR3/DDR4 memory controllers and PCIe.
Typical applications include high-end embedded computing, aerospace and defense systems, medical imaging, and wired/wireless communications. The combination of a powerful processor and reconfigurable logic makes it ideal for prototyping and production in demanding environments.
When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails require proper sequencing to avoid latch-up or damage. Additionally, the high-speed transceivers demand clean power and careful PCB layout to maintain signal integrity.
Bộ thay thế dễ dàng lắp đặt cho XC7Z045-1FBG676I — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với XC7Z045-1FBG676I (cùng hình factor và footprint) — khác nhau ở Maximum Clock Frequency, Operating Temperature, Speed Grade.
XC7Z045-2FBG676I
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →XC7Z030-1FBG676I
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
XC7Z030-2FBG676I
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
XC7Z035-1FBG676I
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
XC7Z045-1FBG676I Tỷ lệ tối đa & tính chất điện
| Family | Zynq-7000 |
| Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Number of Cores | 2 |
| Tần số xung maksimum | 667 MHz |
| Logic Cells | 350K |
| On-Chip RAM | 256 KB |
| Hộp | 676-FCBGA (27x27 mm) |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | -40C to +100C |
| Speed Grade | -1 |
| Primary Attributes | Kintex-7 FPGA, 350K Logic Cells |
| Trạng thái RoHS | Compliant |
| REACH Status | Compliant |
Cấu hình chân XC7Z045-1FBG676I
| Chân A1 | VCCINT — Internal core voltage supply |
| Chân A2 | GND — Ground |
| Chân B1 | VCCAUX — Auxiliary voltage supply |
| Chân C1 | IO_L1P_T0 — User I/O bank 0 |
| Chân D1 | IO_L1N_T0 — User I/O bank 0 |
| Chân E1 | DDR3_DQ[0] — DDR3 memory data |
| Chân F1 | DDR3_DQ[1] — DDR3 memory data |
| Chân G1 | GTX_REFCLK — High-speed transceiver reference clock |
| Chân H1 | GTX_TX_P — High-speed transceiver transmit positive |
| Chân J1 | GTX_TX_N — High-speed transceiver transmit negative |
| Chân K1 | GTX_RX_P — High-speed transceiver receive positive |
| Chân L1 | GTX_RX_N — High-speed transceiver receive negative |
Ứng dụng tiêu biểu
XC7Z045-1FBG676I phù hợp cho 6 Áp dụngs: High-Performance Embedded Computing, Aerospace and Defense Systems, Medical Imaging Equipment, Wired and Wireless Communications, Industrial Automation and Control, Software-Defined Radio (SDR).
High-Performance Embedded Computing
The XC7Z045-1FBG676I excels in high-performance embedded computing by combining a dual-core ARM Cortex-A9 processor with a Kintex-7 FPGA fabric. The 667 MHz processor handles complex software algorithms, while the 350K logic cells accelerate hardware-intensive tasks. This architecture enables low-latency data processing and real-time control, making it ideal for applications like industrial automation and robotics. The 256 KB on-chip RAM provides fast data storage, and the high-speed transceivers support rapid data exchange with external peripherals.
Được đề xuất
Aerospace and Defense Systems
In aerospace and defense, the XC7Z045-1FBG676I provides the processing power and hardware flexibility needed for radar, communication, and image processing systems. The dual-core ARM processor handles control and communication protocols, while the FPGA fabric implements signal processing algorithms with high throughput. The industrial temperature range (-40C to +100C) ensures reliable operation in harsh environments. The device's high logic density supports complex beamforming and target tracking algorithms, making it a preferred choice for mission-critical applications.
Được đề xuất
Medical Imaging Equipment
The XC7Z045-1FBG676I is well-suited for medical imaging equipment such as ultrasound and MRI systems. The FPGA fabric accelerates image processing algorithms, including filtering and reconstruction, while the ARM processor manages system control and user interfaces. The 350K logic cells provide ample resources for parallel processing of image data, and the high-speed transceivers enable fast data transfer from sensors. The device's reliability and long-term availability make it a trusted choice for medical device manufacturers.
Được đề xuất
Wired and Wireless Communications
For wired and wireless communications, the XC7Z045-1FBG676I offers the performance needed for base stations, routers, and software-defined radio. The dual-core ARM processor handles protocol stacks, while the FPGA fabric implements PHY layer processing and modulation/demodulation. The high-speed transceivers support multiple gigabit links, and the 350K logic cells enable complex MIMO and beamforming algorithms. This SoC provides a flexible platform for evolving communication standards.
Được đề xuất
Industrial Automation and Control
In industrial automation, the XC7Z045-1FBG676I enables advanced control systems with real-time processing and hardware acceleration. The ARM processor runs control algorithms and HMI interfaces, while the FPGA fabric implements high-speed I/O and custom protocols. The device supports multiple communication interfaces, including Ethernet and PCIe, facilitating integration into existing systems. The industrial temperature range and robust design make it suitable for factory floor environments.
Được đề xuất
Software-Defined Radio (SDR)
The XC7Z045-1FBG676I is ideal for software-defined radio applications, where the FPGA fabric implements digital down/up conversion, filtering, and modulation, while the ARM processor handles protocol processing and control. The 350K logic cells provide ample resources for wideband signal processing, and the high-speed transceivers support multiple RF channels. This SoC enables flexible, reconfigurable radio systems that can adapt to changing communication standards.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho XC7Z045-1FBG676I — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | XC7Z045-2FBG676I | XC7Z030-1FBG676I | JYX4S045 |
|---|---|---|---|---|
| Package | 676-FCBGA (27x27 mm) | 676-FCBGA (27x27 mm) | 676-FCBGA (27x27 mm) | PBGA900 |
| Brand | AMD | AMD | AMD | CETC58 |
| Logic Cells | 350K | 350K | 125K | 350K |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | Wider temp range |
| Core Processor | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
Bảo phân biệt quan trọng
- Higher logic density (vsXC7Z030-1FBG676I)
- Standard speed grade (vsXC7Z045-2FBG676I)
- Pin-compatible with lower-cost options (vsXC7Z030-1FBG676I)
Ghi chú thiết kế
The XC7Z045-1FBG676I requires multiple power rails (VCCINT, VCCAUX, VCCO) with proper sequencing. Refer to the Zynq-7000 power management application note for recommended sequencing to avoid latch-up. Use low-ESR decoupling capacitors close to each power pin.
For high-speed transceivers, maintain controlled impedance traces and use ground vias around differential pairs. Follow the PCB design guidelines in UG933 for Zynq-7000 to ensure signal integrity. Keep the FPGA fabric power planes clean and separate from I/O planes.
The 676-FCBGA package can dissipate significant power under heavy logic utilization. Use a heatsink or active cooling for applications exceeding 5W. Ensure adequate airflow and consider the thermal resistance (theta_JA) from the datasheet for your specific board layout.
Thông tin tuân thủ
RoHS and REACH compliant per distributor data. Not AEC-Q100 qualified.
