XC7Z045-1FBG676I - Zynq-7000 SoC, 350K Logic Cells | AMD
MPN： XC7Z045-1FBG676I ✓ 啟用中XC7Z045-1FBG676I 概覽
A System-on-Chip (SoC) is an integrated circuit that combines multiple system components, such as processors, memory interfaces, and I/O, onto a single substrate. The Zynq-7000 family specifically merges a processing system (PS) based on ARM cores with programmable logic (PL) based on FPGA fabric. This architecture allows designers to implement complex algorithms in hardware while maintaining the flexibility of software-defined control, bridging the gap between traditional microprocessors and FPGAs.
Key features of the XC7Z045-1FBG676I include 350K logic cells, 256 KB of on-chip RAM, and support for high-speed transceivers. The device also includes a rich set of I/O options, including multiple high-speed serial transceivers and general-purpose I/O banks. The dual-core ARM Cortex-A9 processor runs at up to 667 MHz, providing substantial processing power for real-time applications.
From a technical perspective, the XC7Z045-1FBG676I leverages AMD's advanced 28nm process technology, balancing performance and power efficiency. The integration of the ARM processor with the Kintex-7 FPGA fabric enables low-latency, high-bandwidth communication between software and hardware, which is critical for applications like software-defined radio, image processing, and industrial control. The device supports a wide range of industry-standard interfaces, including DDR3/DDR4 memory controllers and PCIe.
Typical applications include high-end embedded computing, aerospace and defense systems, medical imaging, and wired/wireless communications. The combination of a powerful processor and reconfigurable logic makes it ideal for prototyping and production in demanding environments.
When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails require proper sequencing to avoid latch-up or damage. Additionally, the high-speed transceivers demand clean power and careful PCB layout to maintain signal integrity.
直接替換替代品，適用於 XC7Z045-1FBG676I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7Z045-1FBG676I （相同外形與佔位） — 差異在於 Maximum Clock Frequency, Operating Temperature, Speed Grade.
XC7Z045-2FBG676I
✅ 直接替換聯絡詢價
查看資料表 →XC7Z030-1FBG676I
✅ 直接替換📋 參考替代品（不在目錄中）
XC7Z030-2FBG676I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC7Z035-1FBG676I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC7Z045-1FBG676I 最大額定值與電氣特性
| Family | Zynq-7000 |
| Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Number of Cores | 2 |
| 最大時脈頻率 | 667 MHz |
| Logic Cells | 350K |
| On-Chip RAM | 256 KB |
| 封裝 | 676-FCBGA (27x27 mm) |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +100C |
| Speed Grade | -1 |
| Primary Attributes | Kintex-7 FPGA, 350K Logic Cells |
| RoHS 狀態 | Compliant |
| REACH Status | Compliant |
XC7Z045-1FBG676I 腳位配置
| 腳位 A1 | VCCINT — Internal core voltage supply |
| 腳位 A2 | GND — Ground |
| 腳位 B1 | VCCAUX — Auxiliary voltage supply |
| 腳位 C1 | IO_L1P_T0 — User I/O bank 0 |
| 腳位 D1 | IO_L1N_T0 — User I/O bank 0 |
| 腳位 E1 | DDR3_DQ[0] — DDR3 memory data |
| 腳位 F1 | DDR3_DQ[1] — DDR3 memory data |
| 腳位 G1 | GTX_REFCLK — High-speed transceiver reference clock |
| 腳位 H1 | GTX_TX_P — High-speed transceiver transmit positive |
| 腳位 J1 | GTX_TX_N — High-speed transceiver transmit negative |
| 腳位 K1 | GTX_RX_P — High-speed transceiver receive positive |
| 腳位 L1 | GTX_RX_N — High-speed transceiver receive negative |
典型應用
XC7Z045-1FBG676I 適用於 6 應用s: High-Performance Embedded Computing, Aerospace and Defense Systems, Medical Imaging Equipment, Wired and Wireless Communications, Industrial Automation and Control, Software-Defined Radio (SDR).
High-Performance Embedded Computing
The XC7Z045-1FBG676I excels in high-performance embedded computing by combining a dual-core ARM Cortex-A9 processor with a Kintex-7 FPGA fabric. The 667 MHz processor handles complex software algorithms, while the 350K logic cells accelerate hardware-intensive tasks. This architecture enables low-latency data processing and real-time control, making it ideal for applications like industrial automation and robotics. The 256 KB on-chip RAM provides fast data storage, and the high-speed transceivers support rapid data exchange with external peripherals.
推薦
Aerospace and Defense Systems
In aerospace and defense, the XC7Z045-1FBG676I provides the processing power and hardware flexibility needed for radar, communication, and image processing systems. The dual-core ARM processor handles control and communication protocols, while the FPGA fabric implements signal processing algorithms with high throughput. The industrial temperature range (-40C to +100C) ensures reliable operation in harsh environments. The device's high logic density supports complex beamforming and target tracking algorithms, making it a preferred choice for mission-critical applications.
推薦
Medical Imaging Equipment
The XC7Z045-1FBG676I is well-suited for medical imaging equipment such as ultrasound and MRI systems. The FPGA fabric accelerates image processing algorithms, including filtering and reconstruction, while the ARM processor manages system control and user interfaces. The 350K logic cells provide ample resources for parallel processing of image data, and the high-speed transceivers enable fast data transfer from sensors. The device's reliability and long-term availability make it a trusted choice for medical device manufacturers.
推薦
Wired and Wireless Communications
For wired and wireless communications, the XC7Z045-1FBG676I offers the performance needed for base stations, routers, and software-defined radio. The dual-core ARM processor handles protocol stacks, while the FPGA fabric implements PHY layer processing and modulation/demodulation. The high-speed transceivers support multiple gigabit links, and the 350K logic cells enable complex MIMO and beamforming algorithms. This SoC provides a flexible platform for evolving communication standards.
推薦
Industrial Automation and Control
In industrial automation, the XC7Z045-1FBG676I enables advanced control systems with real-time processing and hardware acceleration. The ARM processor runs control algorithms and HMI interfaces, while the FPGA fabric implements high-speed I/O and custom protocols. The device supports multiple communication interfaces, including Ethernet and PCIe, facilitating integration into existing systems. The industrial temperature range and robust design make it suitable for factory floor environments.
推薦
Software-Defined Radio (SDR)
The XC7Z045-1FBG676I is ideal for software-defined radio applications, where the FPGA fabric implements digital down/up conversion, filtering, and modulation, while the ARM processor handles protocol processing and control. The 350K logic cells provide ample resources for wideband signal processing, and the high-speed transceivers support multiple RF channels. This SoC enables flexible, reconfigurable radio systems that can adapt to changing communication standards.
推薦
推薦產品摘要
工程參考資料，適用於 XC7Z045-1FBG676I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7Z045-2FBG676I | XC7Z030-1FBG676I | JYX4S045 |
|---|---|---|---|---|
| Package | 676-FCBGA (27x27 mm) | 676-FCBGA (27x27 mm) | 676-FCBGA (27x27 mm) | PBGA900 |
| Brand | AMD | AMD | AMD | CETC58 |
| Logic Cells | 350K | 350K | 125K | 350K |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | Wider temp range |
| Core Processor | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
主要差異化特點
- Higher logic density (對比XC7Z030-1FBG676I)
- Standard speed grade (對比XC7Z045-2FBG676I)
- Pin-compatible with lower-cost options (對比XC7Z030-1FBG676I)
設計說明
The XC7Z045-1FBG676I requires multiple power rails (VCCINT, VCCAUX, VCCO) with proper sequencing. Refer to the Zynq-7000 power management application note for recommended sequencing to avoid latch-up. Use low-ESR decoupling capacitors close to each power pin.
For high-speed transceivers, maintain controlled impedance traces and use ground vias around differential pairs. Follow the PCB design guidelines in UG933 for Zynq-7000 to ensure signal integrity. Keep the FPGA fabric power planes clean and separate from I/O planes.
The 676-FCBGA package can dissipate significant power under heavy logic utilization. Use a heatsink or active cooling for applications exceeding 5W. Ensure adequate airflow and consider the thermal resistance (theta_JA) from the datasheet for your specific board layout.
合規資訊
RoHS and REACH compliant per distributor data. Not AEC-Q100 qualified.
