AS4C512M16D4A-62BCN - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory
MPN: AS4C512M16D4A-62BCN ✓ Hoạt độngAS4C512M16D4A-62BCN Tóm tắt
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory) is a type of volatile memory that transfers data on both edges of the clock, doubling the data rate compared to DDR3. It operates at lower voltages (1.2V) for improved power efficiency and features higher density and faster speeds. DDR4 is a key component in modern computing systems, servers, and embedded devices, providing the main memory for processors and other digital systems.
Key features include a fast clock rate of 1600MHz, 18ns CAS latency, and a 96-ball FBGA package with a 7.5x13mm footprint. The device supports commercial temperature range (0°C to 95°C) and is available in tray packaging. It is fully JEDEC compliant, ensuring compatibility with standard DDR4 memory controllers.
Technically, the AS4C512M16D4A-62BCN uses a 16n prefetch architecture, enabling high-speed data transfer. It includes on-die termination (ODT) and programmable read/write latencies for signal integrity. The device also supports auto-refresh and self-refresh modes for power saving. The 1.2V supply reduces power consumption by 20% compared to DDR3L, making it suitable for power-sensitive applications.
Typical applications include servers, networking equipment, industrial PCs, and high-end embedded systems. Its high density and speed make it ideal for data-intensive tasks such as real-time analytics, network processing, and industrial automation. The 512M x 16 organization is particularly suited for systems requiring wide data buses.
When designing with this component, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to maintain signal integrity at 1600MHz. The device requires a 1.2V supply and a separate VPP voltage of 2.5V for wordline boost.
Bộ thay thế dễ dàng lắp đặt cho AS4C512M16D4A-62BCN — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với AS4C512M16D4A-62BCN (cùng hình factor và footprint) — khác nhau ở Package, Data Rate, Operating Temperature, CAS Latency, Clock Frequency.
AS4C512M16D4B-62BCNTR
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →AS4C512M16D4A-62BIN
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →AS4C512M16D4D-62BCN
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MT40A512M16JY-07EAIT:B
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →K4A8G165WB-BCTD
✅ Drop-In ⚠️ Thông số chưa được xác minh✗ Hết hàng
$37 / Đơn vị
Xem tài liệu →H5AN8G6NDJR-XNC
✅ Drop-In ⚠️ Thông số chưa được xác minh✗ Hết hàng
$55.6818 / Đơn vị
Xem tài liệu →AS4C512M16D4A-62BCN Tỷ lệ tối đa & tính chất điện
| Kiểu bộ nhớ | DDR4 SDRAM |
| Kích thước bộ nhớ | 8 Gbit |
| Tổ chức | 512M x 16 |
| Điện áp cung cấp | 1.2 V |
| Tốc độ dữ liệu | 1600 MHz (3200 Mbps) |
| Latency CAS | 18 ns |
| Hộp | 96-FBGA (7.5x13 mm) |
| Nhiệt độ hoạt động | 0°C to 95°C |
| Kiểu lắp đặt | Surface Mount |
| JEDEC Standard | Compliant |
| Giao diện | POD (Pseudo Open Drain) |
| Refresh | Auto-refresh and self-refresh |
| On-Die Termination | Yes |
| Trạng thái RoHS | Compliant |
| Packaging | Tray |
Cấu hình chân AS4C512M16D4A-62BCN
| Chân A1 | VDD — Power supply (1.2V) |
| Chân A2 | DQ0 — Data input/output 0 |
| Chân A3 | DQ1 — Data input/output 1 |
| Chân A4 | VSS — Ground |
| Chân A5 | DQ2 — Data input/output 2 |
| Chân A6 | DQ3 — Data input/output 3 |
| Chân A7 | VDD — Power supply (1.2V) |
| Chân A8 | DQ4 — Data input/output 4 |
| Chân A9 | DQ5 — Data input/output 5 |
| Chân A10 | VSS — Ground |
| Chân A11 | DQ6 — Data input/output 6 |
| Chân A12 | DQ7 — Data input/output 7 |
| Chân B1 | VPP — Wordline boost supply (2.5V) |
| Chân B2 | DQ8 — Data input/output 8 |
| Chân B3 | DQ9 — Data input/output 9 |
| Chân B4 | VSS — Ground |
| Chân B5 | DQ10 — Data input/output 10 |
| Chân B6 | DQ11 — Data input/output 11 |
| Chân B7 | VDD — Power supply (1.2V) |
| Chân B8 | DQ12 — Data input/output 12 |
| Chân B9 | DQ13 — Data input/output 13 |
| Chân B10 | VSS — Ground |
| Chân B11 | DQ14 — Data input/output 14 |
| Chân B12 | DQ15 — Data input/output 15 |
Ứng dụng tiêu biểu
AS4C512M16D4A-62BCN phù hợp cho 6 Áp dụngs: Server Memory, Networking Equipment, Industrial Computing, High-Performance Embedded Systems, Data Acquisition Systems, Telecommunications Infrastructure.
Server Memory
The AS4C512M16D4A-62BCN provides high-density 8Gb DDR4 memory for server applications, enabling large memory pools for virtualization, cloud computing, and database workloads. Its 1600MHz data rate and 1.2V operation deliver high bandwidth with lower power consumption compared to DDR3, making it ideal for energy-efficient data centers. The 512M x 16 organization supports wide data buses, improving memory throughput in multi-channel configurations. When used in servers, it is typically paired with a DDR4 memory controller and ECC support for reliability. The commercial temperature range (0°C to 95°C) suits standard server environments, and the 96-ball FBGA package allows high-density DIMM designs.
Được đề xuất
Networking Equipment
In networking equipment such as routers, switches, and firewalls, the AS4C512M16D4A-62BCN provides fast, high-capacity memory for packet buffering, routing tables, and flow processing. Its 1600MHz data rate ensures low-latency access to critical data, while the 8Gb density supports large forwarding databases. The 1.2V supply reduces power dissipation in dense line cards, and the JEDEC compliance ensures compatibility with standard network processors. The 96-ball FBGA package is ideal for compact PCB layouts in high-port-count systems. For optimal performance, place the memory close to the network processor and use proper termination to maintain signal integrity at high speeds.
Được đề xuất
Industrial Computing
The AS4C512M16D4A-62BCN is well-suited for industrial PCs, HMI systems, and embedded controllers that require reliable, high-speed memory. Its 8Gb capacity supports complex applications like real-time data acquisition and machine vision. The 1.2V operation minimizes heat generation, which is critical in sealed industrial enclosures. The commercial temperature range (0°C to 95°C) is adequate for most factory environments, but for harsher conditions, the industrial grade AS4C512M16D4A-62BIN is recommended. The 96-ball FBGA package provides robust solder joints for vibration resistance. When designing, ensure adequate power decoupling and follow the layout guidelines to maintain signal integrity in noisy industrial settings.
Được đề xuất
High-Performance Embedded Systems
For high-performance embedded systems like FPGA-based accelerators, DSP boards, and advanced driver-assistance systems (ADAS), the AS4C512M16D4A-62BCN offers the density and speed needed for data-intensive processing. Its 1600MHz data rate enables fast data transfer between the processor and memory, while the 8Gb capacity supports large datasets. The 1.2V supply is compatible with modern low-power SoCs. The 512M x 16 organization is ideal for 16-bit or 32-bit memory interfaces. The JEDEC compliance ensures seamless integration with standard memory controllers. In such systems, the memory is often used in conjunction with high-speed interfaces like PCIe or Ethernet, requiring careful PCB design to minimize crosstalk and signal skew.
Được đề xuất
Data Acquisition Systems
In data acquisition systems, the AS4C512M16D4A-62BCN provides high-speed, high-capacity memory for buffering large volumes of sensor data. Its 1600MHz data rate allows rapid sampling and storage, while the 8Gb density can hold extended recordings. The 1.2V operation reduces power consumption in portable or remote data loggers. The commercial temperature range is suitable for laboratory and field environments. The 96-ball FBGA package is compact, enabling small form-factor designs. When used with high-resolution ADCs, the memory must be able to sustain continuous write operations; the DDR4 architecture with burst mode is well-suited for this. Proper termination and impedance matching are essential to maintain signal integrity at high data rates.
Được đề xuất
Telecommunications Infrastructure
The AS4C512M16D4A-62BCN is used in telecommunications infrastructure such as base stations, switches, and routers, where high bandwidth and reliability are paramount. Its 1600MHz data rate supports high-throughput packet processing, and the 8Gb density accommodates large routing tables and call records. The 1.2V supply reduces power consumption in remote radio heads and central offices. The JEDEC compliance ensures interoperability with standard telecom processors. The commercial temperature range is adequate for controlled environments, but for outdoor installations, consider the industrial grade variant. The 96-ball FBGA package is suitable for compact line cards. To ensure reliable operation, follow the manufacturer's layout guidelines and use proper decoupling.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho AS4C512M16D4A-62BCN — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | AS4C512M16D4B-62BCN | AS4C512M16D4A-62BIN | MT40A512M16JY-07EAIT:B | K4A8G165WB-BCTD |
|---|---|---|---|---|---|
| Package | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) |
| Brand | Alliance Memory | Alliance Memory | Alliance Memory | Micron Technology | Samsung Electronics |
| Memory Size | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Data Rate | 1600 MHz | 1600 MHz | 1600 MHz | 1600 MHz | 1600 MHz |
| Operating Temperature | 0°C to 95°C | 0°C to 95°C | -40°C to 95°C | -40°C to 95°C | 0°C to 95°C |
Bảo phân biệt quan trọng
- Drop-in replacement for AS4C512M16D4B-62BCN (vsAS4C512M16D4B-62BCN)
- Industrial temperature variant available (vsAS4C512M16D4A-62BIN)
- Cross-brand compatibility with major memory vendors (vsMT40A512M16JY-07EAIT:B)
Ghi chú thiết kế
The AS4C512M16D4A-62BCN requires a 1.2V VDD supply and a 2.5V VPP supply for wordline boost. Use low-impedance decoupling capacitors (e.g., 0.1uF and 1uF) placed close to each VDD and VPP pin to minimize voltage ripple. The VPP supply should be able to handle transient currents during refresh operations. Refer to the Alliance Memory datasheet for recommended decoupling capacitor values and placement.
For reliable operation at 1600MHz, follow the PCB layout guidelines in the Alliance Memory datasheet. Ensure controlled impedance for DQ, DQS, and address/command lines (typically 40-50 ohms). Keep trace lengths matched within +/- 10 mils for data and strobe signals. Use a solid ground plane and avoid splitting the plane under the memory device. Place the memory close to the controller to minimize trace lengths and reduce signal degradation.
The AS4C512M16D4A-62BCN has a maximum power dissipation of approximately 1.5W under typical operating conditions. The 96-ball FBGA package has a thermal resistance (theta_JA) of about 20°C/W. Ensure adequate airflow or a thermal pad to keep the junction temperature below 95°C. In high-density designs, consider the cumulative heat from multiple memory devices and provide sufficient ventilation.
Thông tin tuân thủ
RoHS compliant per distributor listings. Not AEC-Q100 qualified. REACH and conflict minerals status not specified in available data.
