10M08DAF484I7P vs 10M08DAF484I7G 比較

詳細並排比較 10M08DAF484I7P 由 Intel 與 10M08DAF484I7G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
10M08DAF484I7G 10M08DAF484I7G - MAX 10 FPGA, 8K LE, 484-FBGA | Intel

10M08DAF484I7G - MAX 10 FPGA, 8K LE, 484-FBGA | Intel

10M08DAF484I7G ✓ 啟用中

規格比較

參數 10M08DAF484I7P 10M08DAF484I7G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family MAX 10 MAX 10 FPGA
Logic Elements (LE) 8,000 8000
Embedded Memory 378 Kbits (46,080 M9K bits) —
User I/O Count 250 —
封裝 484-ball FBGA (F484) —
Pitch 1.0 mm —
Core Voltage 1.0 V —
Speed Grade -7 —
工作溫度 -40 C to +100 C (Industrial) -40 °C to +100 °C (Industrial)
On-chip Configuration Flash Yes, dual-boot —
Embedded ADC 12-bit, 1 Msps, 16 channels —
DSP Blocks Yes (24 x 18-bit multipliers) —
PLLs 4 —
Maximum LVDS Channels [DATA_NEEDED: per-bank LVDS channel count] —
User Flash 8 Kbits (non-volatile) —
RoHS 狀態 Compliant Compliant
安裝類型 Surface Mount (BGA) Surface Mount
MSL 等級 [DATA_NEEDED: moisture sensitivity level] —
Series — MAX 10
Embedded Memory (bits) — 387072
Embedded Memory (Kb) — 378
Number of I/Os — 250
Number of LABs/CLBs — [DATA_NEEDED: number of LABs]
Number of Logic Array Blocks — [DATA_NEEDED: LAB count]
Supply Voltage - Core — 1.2 V
封裝 / 外殼 — 484-BGA
Supplier Device Package — 484-FBGA (23x23 mm)
Process Technology — 55 nm
Lead Free — Yes
Configuration Memory — Internal flash (non-volatile)

資料表與資源

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