10M16DAU324C8G vs 10M16DCU324C8G 比較
詳細並排比較 10M16DAU324C8G 由 Intel 與 10M16DCU324C8G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10M16DAU324C8G | 10M16DCU324C8G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | MAX 10 | — |
| Logic Elements (LE) | 16,000 | 16,000 |
| Embedded Memory Bits | 562,176 | — |
| User Flash Memory (UFM) | [DATA_NEEDED: UFM size in Kb] | — |
| Maximum User I/O | 246 | 246 |
| 封裝 | 324-UBGA (Ultra FineLine BGA) | 324-LFBGA / 324-UBGA (U324) 15x15 mm |
| Core Supply Voltage | 1.2 V (on-chip regulator) | — |
| Process Technology | TSMC 55 nm CMOS (non-volatile) | — |
| Configuration Memory | Internal flash, dual-boot capable | Internal flash (non-volatile) |
| Embedded ADC | 12-bit SAR ADC | — |
| Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| LVDS Performance | Up to 1.6 Gbps per pair | — |
| Memory Interface Support | DDR3, DDR2, LPDDR2 (hardened PHY) | — |
| 工作溫度 | Commercial (0C to +85C) - speed grade 8 | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 等級 | 3 (per JEDEC J-STD-020) | 3 |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED] | — |
| Series | — | MAX 10 |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K block count] |
| User Flash Memory | — | 562,176 bits |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | 8 |
| Temperature Grade | — | Commercial (0C to +85C) |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT] |
| DSP Blocks | — | Yes (18x18 multipliers) |
| On-chip ADC | — | Yes (MAX 10 integrated) |
| Lead-Free | — | Yes |