5CSEBA4U19C8N vs 5CSEBA4U19A7N 比較

詳細並排比較 5CSEBA4U19C8N 由 Intel 與 5CSEBA4U19A7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 5CSEBA4U19C8N 5CSEBA4U19A7N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 40K 40 K
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight Dual ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency 600 MHz —
FPGA Fabric Speed Grade -8 —
封裝 484-UBGA (19x19 mm) 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
工作溫度 0C to +85C (commercial) —
Process Technology TSMC 28nm low-power —
User I/O Count 161 —
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
RoHS 狀態 Compliant Compliant
Lead-Free Yes —
MSL 等級 3 (168 hours) 3 (168 hours)
Supply Voltage (Core) [DATA_NEEDED: VCC core voltage] —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
Embedded Memory (M10K) [DATA_NEEDED: M10K block count] —
Transceivers None (SE variant - no high-speed transceivers) —
Configuration Method Serial (EPCS) and Parallel —
Adaptive Logic Modules — [DATA_NEEDED: ALM count]
Embedded Memory — 3.4 Mbits (M9K)
DSP Blocks (18x18 Multipliers) — 224
PLLs — [DATA_NEEDED: PLL count]
HPS Maximum Application Clock — 925 MHz
Memory Interfaces — DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA
User I/O — 161
工作接面溫度 — -40C to +125C (automotive) / -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power
Core Voltage — 1.1 V (typical)

資料表與資源

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